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1. 发明申请

US20080299394A1 COATED METAL PARTICLES 有权
标题翻译：涂层金属颗粒
公开(公告)号：US20080299394A1
公开(公告)日：2008-12-04
申请号：US12191710
申请日：2008-08-14
申请人： Sanyogita Arora , Gerard R. Minogue
发明人： Sanyogita Arora , Gerard R. Minogue
IPC分类号： B32B15/04
CPC分类号： B22F1/0062 , B22F1/0059 , B22F2998/00 , B23K35/34 , H05K3/3484 , H05K2201/0224 , H05K2203/0425 , H05K2203/105 , Y10T428/2991 , Y10T428/2998
摘要： A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.
摘要翻译：一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动。用于静电或电动沉积过程的静电和电动移动颗粒。颗粒包括涂层介质和颗粒体上的电荷导向器。

2. 发明授权

US06635101B2 Rapid surface cooling of solder droplets by flash evaporation 失效
公开(公告)号：US06635101B2
公开(公告)日：2003-10-21
申请号：US09944609
申请日：2001-08-31
申请人： Gerard R. Minogue
发明人： Gerard R. Minogue
IPC分类号： B22F908
CPC分类号： B23K3/0607 , B23K3/0623
摘要： A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contact the surfaces of molten solder droplets and be flash vaporized upon contact, thereby rapidly extracting heat from the molten solder droplets and accelerating cooling and solidification to produce an enhanced solder ball as a product of this process.

3. 发明授权

US06467641B1 Container device with adjustable volume for immobilizing solder spheres and method thereof 失效
标题翻译：用于固定焊球的可调节体积的容器装置及其方法
公开(公告)号：US06467641B1
公开(公告)日：2002-10-22
申请号：US09638820
申请日：2000-08-14
申请人： Gerard R. Minogue
发明人： Gerard R. Minogue
IPC分类号： B65D700
CPC分类号： B23K3/0623 , H05K3/3478
摘要： A container device with an adjustable volume is provided for holding and immobilizing solder spheres used in manufacturing printed circuit boards and other electronic assemblies. The container device includes a hollow containing portion having a first terminal end and a second terminal end with a side wall connecting the first and second terminal ends and a removable sealing mechanism connected to the first terminal end. An adjustable piston is positioned within the containing portion having a length and a width such that when the piston is inserted into the containing portion of the container device, the piston exerts a sufficient pressure against the side wall of the containing portion to rigidly position the piston within the container device. The pressure exerted by the piston forms a seal between the piston and the side wall of the containing portion, thereby preventing solder spheres contained therein from slipping between the piston and the side wall. The piston is positioned within the containing portion at an adjustable and appropriate position such that the piston substantially fills any empty volume of the containing portion and presses substantially against a mass of solder spheres to immobilize solder spheres during transport and storage. The invention also provides a method of immobilizing solder spheres during transport and storage.
摘要翻译：提供了具有可调节体积的容器装置，用于保持和固定用于制造印刷电路板和其它电子组件的焊球。容器装置包括具有第一末端的中空容纳部分和具有连接第一和第二末端的侧壁和连接到第一终端的可移除密封机构的第二终端。可调节活塞位于容纳部分内，其长度和宽度使得当活塞插入到容器装置的容纳部分中时，活塞对容纳部分的侧壁施加足够的压力以使活塞刚性地定位在集装箱装置内。由活塞施加的压力在活塞和容纳部分的侧壁之间形成密封，从而防止其中容纳的焊球从活塞和侧壁之间滑动。活塞位于容纳部分内的可调和适当的位置，使得活塞基本上填充容纳部分的任何空的体积，并且基本抵靠大量的焊球，以在运输和储存期间固定焊球。本发明还提供了一种在运输和储存期间固定焊球的方法。

4. 发明授权

US06345718B1 Method and apparatus for immobilizing solder spheres 失效
标题翻译：用于固定焊球的方法和装置
公开(公告)号：US06345718B1
公开(公告)日：2002-02-12
申请号：US09501174
申请日：2000-02-09
申请人： Gerard R. Minogue
发明人： Gerard R. Minogue
IPC分类号： B65D8102
CPC分类号： B65D51/26 , H01L21/673 , H05K3/3478 , Y10S206/814
摘要： A containing device and method to hold and immobilize solder spheres during storage and transport including a container portion having an open top terminal end and an opposing closed bottom terminal end with at least one side wall connecting each terminal end, a removably attachable lid to seal the container portion and a lid insert for insertion into the container portion to immobilize solder spheres contained therein. In one embodiment, the lid insert is comprised of compressible material, such as a polymeric foam, whereby insertion of the lid insert into the container portion causes compression of the lid insert substantially adjacent to the side wall of the container portion, a bottom planar surface of the lid and an uppermost surface layer of solder spheres to completely fill any open or dead space within the containing device. The lid insert forms a mechanical seal which immobilizes the solder spheres until the lid insert is removed from the containing device.
摘要翻译：一种用于在储存和运输期间保持和固定焊球的容纳装置和方法，包括具有敞开的顶部末端和相对的封闭的底部末端的容器部分，其具有连接每个终端的至少一个侧壁，可拆卸地附接的盖以密封容器部分和用于插入容器部分中的盖插件，以固定其中所含的焊球。在一个实施例中，盖插入件由诸如聚合物泡沫的可压缩材料组成，由此将盖插入件插入容器部分中导致盖插入件压缩基本上邻近容器部分的侧壁，底平面的盖子和焊球的最上表面层，以完全填充容纳装置内的任何开放或死区。盖子插入件形成机械密封件，其固定焊球，直到从插入装置移除盖子插入件。

5. 发明授权

US07655304B2 Coated solder metal particles 有权
标题翻译：涂层焊料金属颗粒
公开(公告)号：US07655304B2
公开(公告)日：2010-02-02
申请号：US12191710
申请日：2008-08-14
申请人： Sanyogita Arora , Gerard R. Minogue
发明人： Sanyogita Arora , Gerard R. Minogue
IPC分类号： B32B5/16
CPC分类号： B22F1/0062 , B22F1/0059 , B22F2998/00 , B23K35/34 , H05K3/3484 , H05K2201/0224 , H05K2203/0425 , H05K2203/105 , Y10T428/2991 , Y10T428/2998
摘要： A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.
摘要翻译：一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动。用于静电或电动沉积过程的静电和电动移动颗粒。颗粒包括涂层介质和颗粒体上的电荷导向器。

6. 发明授权

US07663242B2 Thermal interface material and solder preforms 有权
标题翻译：热界面材料和焊料预制件
公开(公告)号：US07663242B2
公开(公告)日：2010-02-16
申请号：US11682729
申请日：2007-03-06
申请人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
发明人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
IPC分类号： H01L23/48
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L23/433 , H01L2224/73253 , H01L2924/0002 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/12041 , H01L2924/3011 , H01L2924/00
摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
摘要翻译：具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。含有内在吸气剂的活性焊料。

7. 发明授权

US07585549B2 Method of applying a pattern of particles to a substrate 有权
标题翻译：将颗粒图案应用于基材的方法
公开(公告)号：US07585549B2
公开(公告)日：2009-09-08
申请号：US10888286
申请日：2004-07-09
申请人： Brian G. Lewis , Bawa Singh , Robert H. Detig , Gerard R. Minogue , Dietmar C. Eberlein , Kenneth Reilly , Michael Marczi
发明人： Brian G. Lewis , Bawa Singh , Robert H. Detig , Gerard R. Minogue , Dietmar C. Eberlein , Kenneth Reilly , Michael Marczi
IPC分类号： B05D3/14
CPC分类号： H05K3/3484 , B23K3/0607 , H01L21/288 , H01L21/2885 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03622 , H01L2224/03912 , H01L2224/0401 , H01L2224/05023 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/11005 , H01L2224/11332 , H01L2224/11334 , H01L2224/114 , H01L2224/11442 , H01L2224/116 , H01L2224/11849 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01049 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/12042 , H05K3/3478 , H05K2203/0338 , H05K2203/041 , H05K2203/0425 , H05K2203/0776 , H05K2203/09 , H05K2203/105 , H01L2224/13099 , H01L2924/00014 , H01L2924/00
摘要： A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.
摘要翻译：通过将基质暴露于流体介质中的颗粒以电动或静电将颗粒沉积到基底上，通过电动或静电方式直接或通过使用中间工具将图案颗粒施加到基底上的方法。

8. 发明授权

US07413771B2 Coating solder metal particles with a charge director medium 有权
标题翻译：用电荷导向剂介质涂覆焊料金属颗粒
公开(公告)号：US07413771B2
公开(公告)日：2008-08-19
申请号：US10888619
申请日：2004-07-09
申请人： Sanyogita Arora , Gerard R. Minogue
发明人： Sanyogita Arora , Gerard R. Minogue
IPC分类号： B05D7/14 , C25D15/00 , B32B5/16
CPC分类号： B22F1/0062 , B22F1/0059 , B22F2998/00 , B23K35/34 , H05K3/3484 , H05K2201/0224 , H05K2203/0425 , H05K2203/105 , Y10T428/2991 , Y10T428/2998
摘要： A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.
摘要翻译：一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动。用于静电或电动沉积过程的静电和电动移动颗粒。颗粒包括涂层介质和颗粒体上的电荷导向器。

9. 发明授权

US07187083B2 Thermal interface material and solder preforms 有权
标题翻译：热界面材料和焊料预制件
公开(公告)号：US07187083B2
公开(公告)日：2007-03-06
申请号：US10722288
申请日：2003-11-25
申请人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
发明人： Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/42 , B23K35/302 , B23K35/3066 , B23K35/3602 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01L2924/01019 , H01L2924/01066 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
摘要翻译：具有多个层的焊料预制件，其包括填充有介于两个未填充层之间的添加剂的焊料层，以改善润湿性。具有包含填充有添加剂的焊料材料的球体的焊料预制件和用于改善润湿性的未填充表面层。具有粘合组分和作为CTE改性组分和/或导热性增强组分的添加剂组分的热界面材料。含有内在吸气剂的活性焊料。

10. 发明授权

US07097806B2 Rapid surface cooling of solder droplets by flash evaporation 有权
标题翻译：通过闪蒸快速表面冷却焊料液滴
公开(公告)号：US07097806B2
公开(公告)日：2006-08-29
申请号：US10363420
申请日：2001-08-31
申请人： Gerard R. Minogue
发明人： Gerard R. Minogue
IPC分类号： B22F9/08
CPC分类号： B23K3/0607 , B23K3/0623
摘要： A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contract the surfaces of molten solder droplets and be flash vaporized upon contact, thereby rapidly extracting heat from the molten solder droplets and accelerating cooling and solidification to produce an enhanced solder ball as a product of this process.
摘要翻译：液体冷却剂的雾气被引入雾化，熔融的焊料液滴的路径中。腔室内的雾气和其它条件被设计成使得雾气中的液体冷却剂液滴收缩熔融焊料液滴的表面，并在接触时被闪蒸，从而迅速地从熔融的焊料液滴中提取热量并加速冷却和凝固以产生作为该工艺的产品的增强型焊球。

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