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1. 发明申请

US20030127334A1 Method for determining a concentration of conductive species in an aqueous system 审中-公开
标题翻译：确定含水体系中导电物质浓度的方法
公开(公告)号：US20030127334A1
公开(公告)日：2003-07-10
申请号：US10043701
申请日：2002-01-08
申请人： Applied Materials, Inc.
发明人： Deenesh Padhi , Srinivas Gandikota , Chris McGuirk , Girish Dixit
IPC分类号： C25D005/00
CPC分类号： C25D21/14
摘要： A method of measuring a concentration of conductive species in an aqueous system is disclosed. In one embodiment, the method comprises providing an electrochemical cell wherein the electrochemical cell has a cell resistance that varies with a concentration of conductive species and determining a relationship between the cell resistance of the electrochemical cell and the concentration of conductive species. The method further comprises measuring one or more electrochemical parameters of the electrochemical cell and determining a test concentration of conductive species based upon the one or more measured electrochemical parameters. Also disclosed is a system for electroplating a material layer on a substrate. The system comprises an electroplating apparatus for electroplating a material layer on a substrate, an electrochemical sensing device capable of measuring a cell resistance of the electroplating bath and one or more material storage reservoirs capable of delivering one or more materials to the electrochemical plating bath.
摘要翻译：公开了一种测量水性体系中导电物质浓度的方法。在一个实施方案中，该方法包括提供电化学电池，其中电化学电池具有随着导电种类的浓度而变化的电池电阻，并且确定电化学电池的电池电阻与导电种类的浓度之间的关系。该方法还包括测量电化学电池的一个或多个电化学参数，并基于一个或多个测量的电化学参数确定导电物质的测试浓度。还公开了一种用于在基板上电镀材料层的系统。该系统包括用于电镀基材上的材料层的电镀设备，能够测量电镀槽的电池电阻的电化学感测装置和能够将一种或多种材料输送到电化学镀浴的一个或多个材料储存容器。

2. 发明申请

US20030209523A1 Planarization by chemical polishing for ULSI applications 审中-公开
标题翻译：通过ULSI应用的化学抛光进行平面化
公开(公告)号：US20030209523A1
公开(公告)日：2003-11-13
申请号：US10143401
申请日：2002-05-09
申请人： Applied Materials, Inc.
发明人： Deenesh Padhi , Srinivas Gandikota , Chunping Long , Sivakami Ramanathan , Chris R. McGuirk , Girish Dixit , Muhammad Atif Malik
IPC分类号： C03C025/68 , C23F001/00
CPC分类号： H01L21/68728 , B24B1/04 , B24B37/04 , B24B51/00 , B24B57/02 , C23F3/06 , H01L21/2885 , H01L21/32115 , H01L21/32134 , H01L21/67051 , H01L21/68792
摘要： Methods, compositions, and apparatus are provided for planarizing conductive materials disposed on a substrate surface by an chemical polishing technique. In one aspect, a substrate having conductive material disposed thereon is disposed on a substrate support and exposed to a composition containing an oxidizing agent and an inorganic etchant. The substrate is planarized by the composition without the presence of mechanical abrasion. The substrate may optionally be rotated, agitated, or both during exposure to the composition. The method removes conductive materials forming protuberances on the substrate surface at a higher rate than conductive materials forming recesses on the substrate surface.
摘要翻译：提供了通过化学抛光技术平面化设置在基板表面上的导电材料的方法，组合物和装置。在一个方面，其上设置有导电材料的基板设置在基板支撑件上并暴露于含有氧化剂和无机蚀刻剂的组合物。基体被组合物平坦化，而不存在机械磨损。在暴露于组合物期间，可任选地将基材旋转，搅拌或两者。该方法以比在衬底表面上形成凹槽的导电材料更高的速率移除在衬底表面上形成突起的导电材料。

3. 发明申请

US20030209440A1 Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives 失效
标题翻译：用多组分添加剂分析电镀浴中有机添加剂的潜在脉冲扫描方法
公开(公告)号：US20030209440A1
公开(公告)日：2003-11-13
申请号：US10142719
申请日：2002-05-08
申请人： Applied Materials, Inc.
发明人： Zhi-Wen Sun , Nicolay Kovarsky , Chunman Yu , Girish Dixit
IPC分类号： C25D021/12
CPC分类号： C25D21/12
摘要： A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an additive to be measured therein and cycling the potential of an inert working electrode through a series of measurement steps. The series of measurement steps includes a metal stripping step including pulsing from an open circuit potential to a metal stripping potential between about 0.2 V and about 0.8 V, and holding the metal stripping potential until a corresponding current nears 0 mA/cm. The series of measurement steps further includes a cleaning step including pulsing from the metal stripping potential to a cleaning potential between about 1.2 V and about 1.6 V, and holding the cleaning potential for about 2 seconds to about 10 seconds. The series of measurement steps then includes a pre-plating step including pulsing from the cleaning potential to a pre-plating potential between about null0.2 V and about null0.5 V, and holding the pre-plating potential for about 2 seconds to about 10 seconds. The series of measurement steps additionally includes an equilibration step including pulsing from the pre-plating potential to the open circuit potential, and holding the open circuit potential for a predetermined time period, and a metal deposition step including scanning from the open circuit potential of the equilibration step to an additive sensitive potential, holding the additive sensitive potential for about 1 second to about 30 seconds, and scanning back to the open circuit potential. The method further includes plotting a profile of a deposition current resulting from the metal deposition potential as a function of time and integrating the deposition current to determine the concentration of the additive to be measured.
摘要翻译：一种用于测量电镀溶液中添加剂浓度的循环伏安法。该方法通常包括提供具有未测量的待测量添加剂浓度的电镀溶液，并通过一系列测量步骤循环惰性工作电极的电位。一系列测量步骤包括金属剥离步骤，包括从约0.2V至约0.8V之间的开路电位脉冲至金属剥离电势，并保持金属剥离电位，直到相应的电流接近0mA / cm。一系列测量步骤还包括清洁步骤，其包括从金属剥离电位脉冲至约1.2V至约1.6V之间的清洁电势，并将清洁电位保持约2秒至约10秒。所述一系列测量步骤包括预镀步骤，包括从清洁电势脉冲至约-0.2V至约-0.5V之间的预镀电势，并将预镀电位保持约2秒至约10秒。一系列测量步骤还包括平衡步骤，包括从预镀电位脉冲到开路电位，并将开路电位保持预定时间段，以及金属沉积步骤，包括从开路电位扫描平衡步骤到加性敏感电位，保持添加剂敏感电位约1秒至约30秒，并扫描回开路电位。该方法还包括绘制由金属沉积电势产生的沉积电流的轮廓作为时间的函数，并且积分沉积电流以确定待测量的添加剂的浓度。

4. 发明申请

US20030146102A1 Method for forming copper interconnects 审中-公开
标题翻译：形成铜互连的方法
公开(公告)号：US20030146102A1
公开(公告)日：2003-08-07
申请号：US10358561
申请日：2003-02-05
申请人： Applied Materials, Inc.
发明人： Sivakami Ramanathan , Srinivas Gandikota , Deenesh Padhi , Chris McGuirk , Girish Dixit , Robin Cheung
IPC分类号： C25D003/38 , C25D007/04
CPC分类号： C25D7/123 , C25D3/38 , H01L21/2885 , H01L21/76877 , Y10T428/12431
摘要： Embodiments of the invention provide a method of plating a copper film on a substrate in an electrochemical plating apparatus. The method includes positioning a substrate in an electrolyte solution, applying a current between the substrate and an anode to generate a current density of between about 10 mA/cm2 and about 40 mA/cm2 on the substrate surface, rotating the, substrate at a rotational speed of between about 20 rpm and about 50 rpm, and plating a copper film having a sheet resistance of less than about 16.5null10null2 Ohms/cm2. Embodiments of the invention further provide a copper film plated onto a semiconductor substrate, wherein the film has improved electromigration and stress characteristics
摘要翻译：本发明的实施例提供了一种在电化学电镀装置中在基板上镀覆铜膜的方法。该方法包括将基板定位在电解质溶液中，在基板和阳极之间施加电流，以在基板表面上产生约10mA / cm 2至约40mA / cm 2之间的电流密度，旋转基板速度为约20rpm至约50rpm，并且电镀具有小于约16.5×10-2欧姆/ cm 2的薄层电阻的铜膜。本发明的实施例还提供了镀在半导体衬底上的铜膜，其中该膜具有改善的电迁移和应力特性

5. 发明申请

US20020084189A1 Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature 失效
标题翻译：用于机械地增强金属膜在特征内的沉积的方法和相关装置
公开(公告)号：US20020084189A1
公开(公告)日：2002-07-04
申请号：US09754499
申请日：2001-01-03
申请人： Applied Materials, Inc.
发明人： Hougong Wang , Bo Zheng , Girish Dixit , Fusen Chen
IPC分类号： C25D021/06 , C25D021/16 , C25D017/00
CPC分类号： C25D21/10 , C25D5/003 , C25D5/08 , C25D5/20 , C25D7/123 , C25D17/001
摘要： A method and associated apparatus of electroplating an object and filling small features. The method comprises immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features. In one embodiment, the mechanical enhancement comprises mechanically vibrating the plating surface. In another embodiment, the mechanical enhancement comprises mechanically vibrating the electrolyte solution. In a further embodiment, the mechanical enhancement comprises increasing the pressure applied to the electrolyte solution.
摘要翻译：一种电镀电镀方法和相关装置，并填充小特征。该方法包括将电镀表面浸入电解质溶液中，并机械地提高电解质溶液中金属离子的浓度。在一个实施例中，机械增强包括机械振动电镀表面。在另一个实施例中，机械增强包括机械振动电解质溶液。在另一个实施方案中，机械增强包括增加施加到电解质溶液上的压力。

6. 发明申请

US20040118699A1 Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects 审中-公开
标题翻译：均匀的铜 - 钯合金电镀，用于增强互连中的电迁移电阻
公开(公告)号：US20040118699A1
公开(公告)日：2004-06-24
申请号：US10678003
申请日：2003-10-02
申请人： Applied Materials, Inc.
发明人： Deenesh Padhi , Srinivas Gandikota , Girish Dixit
IPC分类号： C25D003/56 , C25D017/00
CPC分类号： C25D5/18 , C25D3/58 , C25D7/123 , H01L21/2885
摘要： A method for plating a homogenous copper-palladium alloy. The method includes providing a plating solution to an electrochemical plating cell. The plating solution includes a copper ion source at a concentration of between about 0.1 M and about 1.0 M and a palladium ion source at a concentration of between about 0.0005 M and about 0.1 M. The method further includes supplying an electrical deposition bias to a plating surface. The electrical deposition bias is configured to simultaneously deposit copper ions and palladium ions onto the plating surface.
摘要翻译：电镀均匀的铜 - 钯合金的方法。该方法包括向电化学电镀单元提供电镀液。电镀溶液包括浓度在约0.1M和约1.0M之间的铜离子源和浓度在约0.0005M和约0.1M之间的钯离子源。该方法还包括向电镀提供电沉积偏压表面。电沉积偏压被配置为将铜离子和钯离子同时沉积到电镀表面上。

7. 发明申请

US20040045831A1 ECP GAP FILL BY MODULATING THE VOLTAGE ON THE SEED LAYER TO INCREASE CUT CONCENTRATION INSIDE FEATURE 失效
标题翻译：通过调节种子层上的电压以增加切割浓度的ECP填充
公开(公告)号：US20040045831A1
公开(公告)日：2004-03-11
申请号：US09981508
申请日：2001-10-16
申请人： Applied Materials, Inc.
发明人： Bo Zheng , Renren He , Girish Dixit
IPC分类号： C25D005/18
CPC分类号： H01L21/2885 , C25D5/18 , C25D7/123 , C25D17/001 , H01L21/76877
摘要： A method and apparatus for electro-chemically depositing a metal onto a substrate. The apparatus generally includes a head assembly having a cathode and a wafer holder disposed above the cathode. The apparatus further includes a process kit disposed below the head assembly, the process kit including an electrolyte container configured to receive and maintain a fluid electrolyte therein, and an anode disposed in the electrolyte container. The apparatus further includes a power supply in electrical communication with the cathode and the anode, the power supply being configured to provide a varying amplitude electrical signal to the anode and cathode. The method generally includes providing an electrolyte container configured to receive and maintain a fluid electrolyte therein, the electrolyte container having an anode disposed within the electrolyte container, providing a head assembly positioned above the electrolyte container, the head assembly including a wafer holder for supporting a wafer and a cathode, and positioning a wafer in the electrolyte container in contact with the fluid electrolyte, and applying a varying amplitude waveform to the cathode and anode in an electroplating process.
摘要翻译：一种用于将金属电化学沉积到基底上的方法和装置。该装置通常包括具有设置在阴极上方的阴极和晶片保持器的头部组件。该设备还包括设置在头部组件下方的处理套件，该处理套件包括构造成在其中容纳和保持流体电解质的电解质容器和设置在电解质容器中的阳极。该装置还包括与阴极和阳极电连通的电源，电源被配置为向阳极和阴极提供变化幅度的电信号。该方法通常包括提供构造成在其中接收和保持流体电解质的电解质容器，电解质容器具有设置在电解质容器内的阳极，提供位于电解质容器上方的头组件，头组件包括用于支撑晶片和阴极，并且将晶片定位在与流体电解质接触的电解质容器中，以及在电镀工艺中向阴极和阳极施加变化的振幅波形。

8. 发明申请

US20030150734A1 Electroplating solution composition control 审中-公开
标题翻译：电镀液组成控制
公开(公告)号：US20030150734A1
公开(公告)日：2003-08-14
申请号：US10074489
申请日：2002-02-11
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Ramin Emami , Girish Dixit , Hiral Ajmera , Roman Mostovoy
IPC分类号： C25D021/06 , C25D021/16 , C25D017/00
CPC分类号： H01L21/2885 , C25D7/123 , C25D21/06 , C25D21/18
摘要： A method and apparatus for removing degraded organics from an electroplating solution by passing at least a portion of electroplating solution through a filter. The apparatus generally includes a deposition cell including a fluid inlet, a fluid reservoir, and at least one filter disposed between the reservoir and the fluid inlet. The apparatus may further include a control valve disposed between the fluid reservoir and the fluid inlet for passing at least a portion of an electroplating solution to a recovery stream including the at least one filter. Embodiments of the invention further include a method generally including the steps of providing a substrate having a seed layer disposed on a surface thereof, disposing the substrate in an electroplating solution, flowing a portion of the electroplating solution through a filter in an amount sufficient to remove an amount of organic additives from the electroplating solution equal to a calculated rate of organic additive degradation, and flowing the electroplating solution to the substrate.
摘要翻译：一种通过使至少一部分电镀溶液通过过滤器从电镀溶液中除去有机物的方法和装置。该装置通常包括沉积池，其包括流体入口，流体储存器以及设置在储存器和流体入口之间的至少一个过滤器。该装置还可以包括设置在流体储存器和流体入口之间的控制阀，用于将至少一部分电镀溶液传送到包括至少一个过滤器的回收流。本发明的实施例还包括一种方法，通常包括以下步骤：提供具有设置在其表面上的种子层的基底，将基底设置在电镀溶液中，使电镀溶液的一部分通过过滤器，其量足以去除来自电镀溶液的一定量的有机添加剂等于计算的有机添加剂降解速率，并将电镀溶液流到基底。

9. 发明申请

US20040000484A1 Methods in electroanalytical techniques to analyze organic components in plating baths 有权
标题翻译：电分析方法分析电镀浴中的有机成分
公开(公告)号：US20040000484A1
公开(公告)日：2004-01-01
申请号：US10187734
申请日：2002-06-27
申请人： Applied Materials, Inc.
发明人： Zhi-wen Sun , Chunman Yu , Brian Metzger , David W. Nguyen , Girish Dixit
IPC分类号： C25D005/00
CPC分类号： C25D21/12 , G01N27/42 , G01N27/49 , G01N31/164
摘要： Embodiments of the invention provide an electro-analytical method for determining the concentration of an organic additive in an acidic or basic metal plating bath using an organic chemical analyzer. The method includes preparing a supporting-electrolyte solution, preparing a testing solution including the supporting-electrolyte solution and a standard solution, measuring an electrochemical response of the supporting-electrolyte solution using the organic chemical analyzer, and implementing an electro-analytical technique to determine the concentration of the organic additive in the plating bath from the electrochemical response measurements. The method is performed for independently analyzing one organic additive component in a plating bath containing multi-component organic additives, regardless of knowledge of the concentration of other organic additives and with minimal interference among organic additives.
摘要翻译：本发明的实施方案提供了使用有机化学分析仪确定酸性或碱性金属电镀浴中的有机添加剂的浓度的电解分析方法。该方法包括制备支持电解质溶液，制备包括支持电解质溶液和标准溶液的测试溶液，使用有机化学分析仪测量支持电解质溶液的电化学响应，并实施电解分析技术以确定电化学响应测量中电镀液中有机添加剂的浓度。不管知道其他有机添加剂的浓度以及有机添加剂的干扰最小，都可以独立地分析含有多组分有机添加剂的电镀液中的一种有机添加剂成分。

10. 发明申请

US20040003780A1 Self aligning non contact shadow ring process kit 审中-公开
标题翻译：自对准非接触阴影环工艺套件
公开(公告)号：US20040003780A1
公开(公告)日：2004-01-08
申请号：US10614992
申请日：2003-07-07
申请人： APPLIED MATERIALS, INC.
发明人： Joseph Yudovsky , Lawrence C. Lei , Salvador Umotoy , Tom Madar , Girish Dixit , Gwo-Chuan Tzu
IPC分类号： C23C016/00
CPC分类号： C23C16/4585 , C30B25/12 , C30B31/14
摘要： The invention provides a removable first edge ring configured for pin and recess/slot coupling with a second edge ring disposed on the substrate support. In one embodiment, a first edge ring includes a plurality of pins, and a second edge ring includes one or more alignment recesses and one or more alignment slots for mating engagement with the pins. Each of the alignment recesses and alignment slots are at least as wide as the corresponding pins, and each of the alignment slots extends in the radial direction a length that is sufficient to compensate for the difference in thermal expansion between the first edge ring and the second edge ring.
摘要翻译：本发明提供了可拆卸的第一边缘环，其被配置用于与设置在基板支撑件上的第二边缘环的销和凹槽/狭槽联接。在一个实施例中，第一边缘环包括多个销，并且第二边缘环包括一个或多个对准凹槽和用于与销配合接合的一个或多个对准槽。每个对准凹槽和对准槽至少与相应的销一样宽，并且每个对准槽在径向方向上延伸的长度足以补偿第一边缘环和第二边缘之间的热膨胀差边缘环。

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