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1. 发明申请

US20040200725A1 Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process 审中-公开
标题翻译：消泡剂在半导体电化学电镀工艺中的应用
公开(公告)号：US20040200725A1
公开(公告)日：2004-10-14
申请号：US10410105
申请日：2003-04-09
申请人： Applied Materials Inc.
发明人： Joseph Yahalom , Mei Wen , Roman Mostovoy
IPC分类号： C25D021/06 , C25D021/16
CPC分类号： C25D21/12 , C23C18/1683 , C23C18/31 , C23C18/405 , H01L21/2885
摘要： Embodiments of the invention provide a method and formulations for preventing foam formation inside a plating apparatus prior to or during plating a material on a substrate. In one embodiment, a method for preventing foam formation inside a plating apparatus designed for plating a material on a substrate includes providing an electrolyte solution containing at least one antifoaming agent, at least one metal ion source, and a supporting electrolyte. The method further includes placing the substrate onto a substrate holder of the plating apparatus, immersing the substrate in the electrolyte solution, and depositing the material onto the substrate.
摘要翻译：本发明的实施方案提供了一种用于在将材料镀覆在基材上之前或期间防止电镀装置内的泡沫形成的方法和配方。在一个实施方案中，在设计用于在基材上镀覆材料的电镀装置内防止泡沫形成的方法包括提供含有至少一种消泡剂，至少一种金属离子源和支持电解质的电解质溶液。该方法还包括将衬底放置在电镀设备的衬底保持器上，将衬底浸入电解质溶液中，并将该材料沉积到衬底上。

2. 发明申请

US20030150734A1 Electroplating solution composition control 审中-公开
标题翻译：电镀液组成控制
公开(公告)号：US20030150734A1
公开(公告)日：2003-08-14
申请号：US10074489
申请日：2002-02-11
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Ramin Emami , Girish Dixit , Hiral Ajmera , Roman Mostovoy
IPC分类号： C25D021/06 , C25D021/16 , C25D017/00
CPC分类号： H01L21/2885 , C25D7/123 , C25D21/06 , C25D21/18
摘要： A method and apparatus for removing degraded organics from an electroplating solution by passing at least a portion of electroplating solution through a filter. The apparatus generally includes a deposition cell including a fluid inlet, a fluid reservoir, and at least one filter disposed between the reservoir and the fluid inlet. The apparatus may further include a control valve disposed between the fluid reservoir and the fluid inlet for passing at least a portion of an electroplating solution to a recovery stream including the at least one filter. Embodiments of the invention further include a method generally including the steps of providing a substrate having a seed layer disposed on a surface thereof, disposing the substrate in an electroplating solution, flowing a portion of the electroplating solution through a filter in an amount sufficient to remove an amount of organic additives from the electroplating solution equal to a calculated rate of organic additive degradation, and flowing the electroplating solution to the substrate.
摘要翻译：一种通过使至少一部分电镀溶液通过过滤器从电镀溶液中除去有机物的方法和装置。该装置通常包括沉积池，其包括流体入口，流体储存器以及设置在储存器和流体入口之间的至少一个过滤器。该装置还可以包括设置在流体储存器和流体入口之间的控制阀，用于将至少一部分电镀溶液传送到包括至少一个过滤器的回收流。本发明的实施例还包括一种方法，通常包括以下步骤：提供具有设置在其表面上的种子层的基底，将基底设置在电镀溶液中，使电镀溶液的一部分通过过滤器，其量足以去除来自电镀溶液的一定量的有机添加剂等于计算的有机添加剂降解速率，并将电镀溶液流到基底。

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