专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20040256235A1 Method for recycling of plating solutions 失效
标题翻译：电镀液回收方法
公开(公告)号：US20040256235A1
公开(公告)日：2004-12-23
申请号：US10813251
申请日：2004-03-30
发明人： Koujiro Kameyama
IPC分类号： C25D021/06 , C25D021/16 , C23C028/00
CPC分类号： C25D3/60 , C22B7/006 , C22B25/04 , C23C2/00 , C23C18/1617 , C25D21/18 , Y02P10/234
摘要： In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and the present invention can recycle a foemer plating solution to prepare a new plating solution, for example, in the following order: a process for preparing a SnnullBi alloy plating solution (S1); a process for an active carbon treatment to remove the completing agent (S2); a process for removing Bi (S3); a process for a sedimenting treatment (S4); and a process for analyzing and correcting Sn plating solution. The recycling of plating solutions eliminates their effluent treatment and reduces environmental loads, effluent costs, and costs for purchasing new solutions. In the administration of the plating solution compositions, the conventional data can be utilized to facilitate the administrating operation.
摘要翻译：在传统电镀工艺中，新制备电镀液，先前使用的电镀液作为工业废弃物倾倒，伴随着环境负荷，废水成本，购买新溶液的成本等，本发明可回收例如按照以下顺序制备新的电镀液：制备Sn-Bi合金电镀液（S1）的方法; 活性炭处理以除去完成剂的方法（S2）; 一种去除Bi（S3）的方法; 沉淀处理工艺（S4）; 以及用于分析和校正镀锡溶液的工艺。电镀解决方案的回收消除了其废水处理，减少了环境负荷，污水成本以及购买新解决方案的成本。在电镀溶液组合物的施用中，可以利用常规数据来促进给药操作。

2. 发明申请

US20040258847A1 Method of measuring component loss 审中-公开
标题翻译：测量元件损耗的方法
公开(公告)号：US20040258847A1
公开(公告)日：2004-12-23
申请号：US10723218
申请日：2003-11-26
申请人： Shipley Company, L.L.C.
发明人： Martin W. Bayes , Raymund W. M. Kwok
IPC分类号： C25D021/06 , C25D021/16 , C25D021/18
CPC分类号： C23C18/31 , C23C18/1617 , C23C18/1683 , C23C18/36 , C25D21/12
摘要： A method to determine and monitor concentrations of inert metal plating components in metal plating baths. An inert indictor is included in the bath composition and the concentration of the inert indictor is monitored during plating. The change in the concentration of the inert indicator is used to determine the change in the concentration of inert bath components.
摘要翻译：确定和监测金属电镀液中惰性金属电镀组分浓度的方法。在浴组合物中包括惰性指示剂，并且在电镀期间监测惰性指示剂的浓度。惰性指示剂浓度的变化用于确定惰性浴组分浓度的变化。

3. 发明申请

US20030150734A1 Electroplating solution composition control 审中-公开
标题翻译：电镀液组成控制
公开(公告)号：US20030150734A1
公开(公告)日：2003-08-14
申请号：US10074489
申请日：2002-02-11
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Ramin Emami , Girish Dixit , Hiral Ajmera , Roman Mostovoy
IPC分类号： C25D021/06 , C25D021/16 , C25D017/00
CPC分类号： H01L21/2885 , C25D7/123 , C25D21/06 , C25D21/18
摘要： A method and apparatus for removing degraded organics from an electroplating solution by passing at least a portion of electroplating solution through a filter. The apparatus generally includes a deposition cell including a fluid inlet, a fluid reservoir, and at least one filter disposed between the reservoir and the fluid inlet. The apparatus may further include a control valve disposed between the fluid reservoir and the fluid inlet for passing at least a portion of an electroplating solution to a recovery stream including the at least one filter. Embodiments of the invention further include a method generally including the steps of providing a substrate having a seed layer disposed on a surface thereof, disposing the substrate in an electroplating solution, flowing a portion of the electroplating solution through a filter in an amount sufficient to remove an amount of organic additives from the electroplating solution equal to a calculated rate of organic additive degradation, and flowing the electroplating solution to the substrate.
摘要翻译：一种通过使至少一部分电镀溶液通过过滤器从电镀溶液中除去有机物的方法和装置。该装置通常包括沉积池，其包括流体入口，流体储存器以及设置在储存器和流体入口之间的至少一个过滤器。该装置还可以包括设置在流体储存器和流体入口之间的控制阀，用于将至少一部分电镀溶液传送到包括至少一个过滤器的回收流。本发明的实施例还包括一种方法，通常包括以下步骤：提供具有设置在其表面上的种子层的基底，将基底设置在电镀溶液中，使电镀溶液的一部分通过过滤器，其量足以去除来自电镀溶液的一定量的有机添加剂等于计算的有机添加剂降解速率，并将电镀溶液流到基底。

4. 发明申请

US20020027082A1 Method of improving contact reliability for electroplating 审中-公开
标题翻译：提高电镀接触可靠性的方法
公开(公告)号：US20020027082A1
公开(公告)日：2002-03-07
申请号：US09983235
申请日：2001-10-23
发明人： Panayotis C. Andricacos , W. Jean Horkans , Keith T. Kwietniak , Peter S. Locke , Cyprian E. Uzoh
IPC分类号： C25D021/06 , C25D021/16 , C25D005/02 , H01L021/288 , H01L021/445 , C25D007/12 , C25D011/32
CPC分类号： C25D7/123 , C25D5/003 , C25D21/12 , C25D21/18
摘要： A method of reducing etching of a seed layer by a plating solution. Prior to introducing the semiconductor wafer with the seed layer into the plating solution, the etching power of the plating solution is diminished.
摘要翻译：通过电镀液减少种子层的蚀刻的方法。在将具有种子层的半导体晶片引入电镀液之前，电镀液的蚀刻功率降低。

5. 发明申请

US20020079226A1 Plating method and plating bath precursor used therefor 失效
标题翻译：电镀方法及镀浴前驱体
公开(公告)号：US20020079226A1
公开(公告)日：2002-06-27
申请号：US10036506
申请日：2002-01-07
申请人： DAIWA FINE CHEMICALS CO., LTD.
发明人： Keigo Obata , Dong-Hyun Kim , Takao Takeuchi , Seiichiro Nakao , Shinji Inazawa , Ayao Kariya , Masatoshi Majima , Shigeyoshi Nakayama
IPC分类号： C25D021/06 , C25D021/16
CPC分类号： C23C18/1617 , C23C18/34 , Y10S428/935 , Y10T428/12681 , Y10T428/12701 , Y10T428/12708 , Y10T428/12792 , Y10T428/12819 , Y10T428/12826 , Y10T428/12847 , Y10T428/12861 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/12951
摘要： To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
摘要翻译：为了提供能够广泛地使用具有优异特性的氧化还原体系无电镀方法的镀覆方法，以及优选用于电镀方法的镀浴前体。电镀方法包括将电镀浴的氧化还原体系的第一金属离子氧化为较低氧化态的工艺，并且所述氧化还原体系的第二金属离子被还原并沉积到被镀物体的表面上其中提供了一种通过向电镀槽供应电流的方法，使第一金属离子从所述较低氧化态还原，从而激活镀浴。形成电镀槽前体稳定电镀液，从而基本上不会发生第二金属离子的还原和沉积，以改善其存储性能。

6. 发明申请

US20020056647A1 Plating method and plating apparatus 失效
标题翻译：电镀方法和电镀装置
公开(公告)号：US20020056647A1
公开(公告)日：2002-05-16
申请号：US09955115
申请日：2001-09-19
发明人： Koji Mishima , Hiroaki Inoue , Natsuki Makino , Junji Kunisawa , Kenji Nakamura , Tetsuo Matsuda , Hisashi Kaneko , Toshiyuki Morita
IPC分类号： C25D005/00 , C25D021/06 , C25D021/16 , C25D017/00
CPC分类号： H01L21/2885 , C25D5/04 , C25D5/08 , C25D21/12 , H01L21/7684 , H01L21/76877
摘要： The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with the use of a plating liquid having high throwing power and leveling properties, and which can make the film thickness of the plated film substantially equal between the interconnection region and the non-interconnection region, thereby facilitating a later CMP processing. A plating method comprising filling a plating liquid containing metal ions and an additive into a plating space formed between a substrate and an anode disposed closely to the substrate so as to face the substrate, and changing the concentration of the additive in the plating liquid filled into the plating space during a plating process.
摘要翻译：电镀方法和电镀装置技术领域本发明涉及一种电镀方法和电镀装置，其可以通过使用具有高抛光力和流平性的电镀液将铜嵌入精细互连图案中，并且可以使镀膜的膜厚基本相等在互连区域和非互连区域之间，从而有助于稍后的CMP处理。一种电镀方法，包括将含有金属离子的电镀液和添加剂填充到形成在基板和靠近基板的阳极之间形成的电镀空间中以面对基板，并且将填充的电镀液中的添加剂的浓度变化电镀过程中的电镀空间。

7. 发明申请

US20020033339A1 Plating apparatus and plating method for substrate 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20020033339A1
公开(公告)日：2002-03-21
申请号：US09955112
申请日：2001-09-19
发明人： Norio Kimura , Koji Mishima , Junji Kunisawa , Hiroaki Inoue , Natsuki Makino , Tetsuo Matsuda , Hisashi Kaneko
IPC分类号： C25C007/00 , C25D017/00 , C25D021/06 , C25D021/16 , C25F007/00 , C25B009/00 , B23H011/00
CPC分类号： C25D17/001 , C25D5/02 , C25D7/123 , C25D17/004 , C25D17/02
摘要： A substrate is plated with a metal film of uniform thickness only in a limited area thereof which is to be plated. A substrate plating apparatus has a substrate holder for holding a substrate and a plating cell for plating a portion of a surface, to be plated, of the substrate held by the substrate holder. The plating cell has an anode disposed so as to cover the portion of the surface, to be plated, of the substrate held by the substrate holder, a cathode for supplying a current to the surface, to be plated, of the substrate in such a state that the cathode is brought into contact with the substrate, a plating liquid supplying device for supplying a plating liquid between the anode and the surface, to be plated, of the substrate, and a power source for applying a voltage between the anode and the cathode.
摘要翻译：基板镀有均匀厚度的金属膜，仅在要镀覆的有限区域内。基板电镀装置具有用于保持基板的基板保持器和用于镀覆被基板保持器保持的基板的待镀表面的一部分的电镀单元。电镀单元具有阳极，该阳极设置成覆盖被基板保持器保持的基板的要被电镀的部分，用于将基板的电镀液供给到该基板的表面的阴极表示阴极与基板接触，电镀液供给装置，用于在阳极和要被电镀的表面之间提供电镀液体，以及用于在阳极和阳极之间施加电压的电源阴极。

8. 发明申请

US20040200725A1 Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process 审中-公开
标题翻译：消泡剂在半导体电化学电镀工艺中的应用
公开(公告)号：US20040200725A1
公开(公告)日：2004-10-14
申请号：US10410105
申请日：2003-04-09
申请人： Applied Materials Inc.
发明人： Joseph Yahalom , Mei Wen , Roman Mostovoy
IPC分类号： C25D021/06 , C25D021/16
CPC分类号： C25D21/12 , C23C18/1683 , C23C18/31 , C23C18/405 , H01L21/2885
摘要： Embodiments of the invention provide a method and formulations for preventing foam formation inside a plating apparatus prior to or during plating a material on a substrate. In one embodiment, a method for preventing foam formation inside a plating apparatus designed for plating a material on a substrate includes providing an electrolyte solution containing at least one antifoaming agent, at least one metal ion source, and a supporting electrolyte. The method further includes placing the substrate onto a substrate holder of the plating apparatus, immersing the substrate in the electrolyte solution, and depositing the material onto the substrate.
摘要翻译：本发明的实施方案提供了一种用于在将材料镀覆在基材上之前或期间防止电镀装置内的泡沫形成的方法和配方。在一个实施方案中，在设计用于在基材上镀覆材料的电镀装置内防止泡沫形成的方法包括提供含有至少一种消泡剂，至少一种金属离子源和支持电解质的电解质溶液。该方法还包括将衬底放置在电镀设备的衬底保持器上，将衬底浸入电解质溶液中，并将该材料沉积到衬底上。

9. 发明申请

US20030159936A1 Method and apparatus for reducing organic depletion during non-processing time periods 失效
标题翻译：在非处理时间段内减少有机物耗尽的方法和装置
公开(公告)号：US20030159936A1
公开(公告)日：2003-08-28
申请号：US10085338
申请日：2002-02-27
申请人： Applied Materials, Inc.
发明人： Srinivas Gandikota , Chris R. McGuirk , Deenesh Padhi , Sivakami Ramanathan , Muhammad Atif Malik , Girish A. Dixit
IPC分类号： C25D021/06 , C25D021/16 , C25D017/00
CPC分类号： C25D21/18 , C25D21/14
摘要： Embodiments of the invention generally provide an apparatus and method for replenishing organic molecules in an electroplating bath. The replenishment process of the present invention may occur on a real-time basis, and therefore, the concentration of organics minimally varies from desired concentration levels. The replenishment method generally includes conducting pre-processing depletion measurements in order to determine organic depletion rates per current density applied in the electroplating system. Once the organic depletion rates per current density are determined, these depletion rates may be applied to an electroplating processing recipe to calculate the volume of organic depletion per recipe step. The calculated volume of organic depletion per recipe step may then be used to determine the volume of organic molecule replenishment per unit of time that is required per recipe step in order to maintain a desired concentration of organics in the plating solution. The calculated replenishment volume may then be added to the processing recipe so that the replenishment process may occur at real-time during processing periods. The apparatus generally includes a selectively actuated valve in communicaiton with a fluid delivery line, wherein the valve is configured to fluidly isolate a plating cell during a non-processing time period. The valve may be controlled by a system controller, and thus, the fluid level in the cell may be controlled during a non-processing time period.
摘要翻译：本发明的实施方案通常提供用于在电镀浴中补充有机分子的装置和方法。本发明的补充方法可以在实时的基础上进行，因此有机物的浓度最小化从期望的浓度水平变化。补充方法通常包括进行预处理耗尽测量，以便确定在电镀系统中施加的每个电流密度的有机耗尽率。一旦确定了每个电流密度的有机耗尽率，则这些耗尽率可以应用于电镀处理配方以计算每个配方步骤的有机耗尽量。然后可以使用每个配方步骤的计算的有机耗尽体积来确定每个配方步骤所需的每单位时间的有机分子补充体积，以维持电镀溶液中所需的有机物浓度。计算的补充量然后可以被添加到处理配方中，使得补货过程可以在处理时段期间实时发生。该装置通常包括与流体输送管线通信的选择性致动的阀，其中阀被配置为在非处理时间段期间流体地隔离电镀槽。阀可以由系统控制器控制，因此，可以在非处理时间段期间控制单元中的液位。

10. 发明申请

US20030136666A1 Combination liquid dispenser and electrochemical cell 有权
公开(公告)号：US20030136666A1
公开(公告)日：2003-07-24
申请号：US10051750
申请日：2002-01-18
发明人： Heiner Ophardt
IPC分类号： C25B015/00 , C25D021/16
CPC分类号： H01M8/04208 , H01M8/04186 , H01M8/083 , H01M8/086 , H01M8/1009 , H01M8/1013 , H01M2008/1095 , Y02E60/522
摘要： In combination, a fluid dispenser and an electrochemical cell to produce electric energy by chemical conversion of the fluid to be dispensed. The electrical energy produced is preferably used to operate a device associated with the dispensing of the fluid as, for example, in operation of an electric pump-to-pump fluid from the reservoir. The fluid preferably is dispensed for use after dispensing in some other purpose than as a source for electrochemical energy to dispense fluid from the reservoir. For example, preferred fluid containing alcohol compounds are for use in cleaning and disinfecting.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式