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1. 发明申请

US20030029726A1 Apparatus and method of evaluating electroplating solutions and conditions 审中-公开
标题翻译：评估电镀溶液和条件的设备和方法
公开(公告)号：US20030029726A1
公开(公告)日：2003-02-13
申请号：US09924080
申请日：2001-08-07
申请人： Applied Materials, Inc.
发明人： Nicolay Kovarsky , Zhi-Wen Sun , Girish A. Dixit
IPC分类号： C25D021/12 , C25D005/00 , C25D017/00
CPC分类号： C25D21/12
摘要： The present invention generally relates to an apparatus and method of evaluating electroplating solutions and conditions. In one embodiment, the method of evaluating electroplating solutions comprises utilizing an electrochemical measuring cell having a working electrode having a lid with at least one hole, a counter electrode, and a reference electrode. The working electrode, the counter electrode, and the reference electrode are immersed in at least one sample of at least one electroplating solution. The lid is disposed over the working electrode forming a chamber between the working electrode and the lid. The lid further has a hole to allow an electroplating solution to flow into the chamber and reach the working electrode. The potential of the working electrode in the sample of the electroplating solution is measured over time with a constant current supplied to the working electrode. The electrochemical measurements may be used to determine which solutions are capable of bottom-up filling and may be used to estimate the optimal electroplating parameters. In still another embodiment, the present invention relates to an apparatus for electroplating a substrate comprises a chamber body, an anode disposed in the chamber body, a contact ring disposed in the chamber body, one or more power supplies coupled to the anode and the contact ring, and an electrochemical measuring cell disposed in the chamber body or coupled to an electrolyte output coupled to the chamber body.
摘要翻译：本发明一般涉及一种评估电镀溶液和条件的设备和方法。在一个实施例中，电镀溶液的评估方法包括利用电化学测量单元，该电化学测量单元具有具有至少一个孔的盖的工作电极，对电极和参比电极。工作电极，对电极和参比电极浸入至少一个电镀溶液的至少一个样品中。盖子设置在工作电极之上，在工作电极和盖子之间形成一个室。盖子还具有孔，以允许电镀溶液流入室并到达工作电极。在供给工作电极的恒定电流下，随时间测量电镀液样品中的工作电极的电位。电化学测量可用于确定哪些溶液能够自下而上填充，并可用于估计最佳电镀参数。在另一个实施例中，本发明涉及一种用于电镀基板的设备，包括室主体，设置在室主体中的阳极，设置在室主体中的接触环，耦合到阳极和接触件的一个或多个电源环和电化学测量单元，其设置在室主体中或耦合到耦合到室主体的电解质输出。

2. 发明申请

US20030201191A1 Electrochemical method for direct organic additives analysis in copper baths 审中-公开
标题翻译：铜浴中直接有机添加剂分析的电化学方法
公开(公告)号：US20030201191A1
公开(公告)日：2003-10-30
申请号：US10135485
申请日：2002-04-29
申请人： Applied Materials, Inc.
发明人： Nicolay Kovarsky , Zhi-Wen Sun
IPC分类号： G01N027/48
CPC分类号： G01N27/48 , C25D3/38 , C25D21/12
摘要： A voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, including an unknown concentration of an additive to be measured, cycling an inert working electrode potential to alternately deposit and strip metal from the working electrode surface in the plating solution, wherein the metal deposition step includes a constant voltage plateau at a plateau potential sufficient to eliminate the interference of additives in the plating solution other than the additive to be measured. The method further includes determining a profile of the anodic current resulting from the applied working electrode potential as a function of time and determining a stripping peak area. The method may further include determining the concentration of the additive to be measured by the ratio of the stripping peak area from the profile to a stripping peak area of a base solution not including the additive to be measured.
摘要翻译：用于测量电镀溶液中添加剂浓度的伏安法。该方法通常包括提供包括未测浓度的待测量添加剂的电镀溶液，循环惰性工作电极电位以在电镀溶液中从工作电极表面交替沉积和剥离金属，其中金属沉积步骤包括常数具有足以消除除了待测量的添加剂之外的电镀溶液中的添加剂的干扰的平台电压。该方法还包括确定由施加的工作电极电位产生的阳极电流的轮廓作为时间的函数并确定剥离峰面积。该方法还可以包括通过不包括待测量的添加剂的碱溶液的剥离峰面积与轮廓的剥离峰面积的比率确定待测量的添加剂的浓度。

3. 发明申请

US20020117472A1 Cleaning of multicompositional etchant residues 失效
标题翻译：清洗多组分蚀刻剂残留物
公开(公告)号：US20020117472A1
公开(公告)日：2002-08-29
申请号：US09792444
申请日：2001-02-23
申请人： Applied Materials, Inc.
发明人： Zhi-Wen Sun , Anbei Jiang , Tuo-Chuan Huang
IPC分类号： H01L021/3065 , C23F001/00
CPC分类号： H01L21/02046 , H01J37/321 , H01J37/32449 , H01J37/32935
摘要： A substrate processing apparatus has a chamber with a substrate transport to transport a substrate onto a substrate support in the chamber, a gas supply to provide a gas in the chamber, a gas energizer to energize the gas, and a gas exhaust to exhaust the gas. A controller operates one or more of the substrate support, gas supply, gas energizer, and gas exhaust, to set etching process conditions in the chamber to etch a plurality of substrates, thereby depositing etchant residues on surfaces in the chamber. The controller also operates one or more of the substrate support, gas supply, gas energizer, and gas exhaust, to set cleaning process conditions in the chamber to clean the etchant residues. The cleaning process conditions comprise a volumetric flow ratio of O2 to CF4 of from about 1:1 to about 1:40.
摘要翻译：基板处理装置具有具有基板输送的基板输送基板到室内的基板支撑体上的气室，在该室内提供气体的气体供给器，对该气体进行通电的气体增压器以及排出气体的排气。控制器操作衬底支撑件，气体供应器，气体激发器和气体排出中的一个或多个，以在腔室中设置蚀刻工艺条件以蚀刻多个衬底，由此在腔室中的表面上沉积蚀刻剂残留物。控制器还操作一个或多个衬底支撑件，气体供应器，气体激励器和气体排出器，以设置腔室中的清洁工艺条件以清洁蚀刻剂残留物。清洗过程条件包括O2至CF4的体积流量比为约1:1至约1:40。

4. 发明申请

US20030209440A1 Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives 失效
标题翻译：用多组分添加剂分析电镀浴中有机添加剂的潜在脉冲扫描方法
公开(公告)号：US20030209440A1
公开(公告)日：2003-11-13
申请号：US10142719
申请日：2002-05-08
申请人： Applied Materials, Inc.
发明人： Zhi-Wen Sun , Nicolay Kovarsky , Chunman Yu , Girish Dixit
IPC分类号： C25D021/12
CPC分类号： C25D21/12
摘要： A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an additive to be measured therein and cycling the potential of an inert working electrode through a series of measurement steps. The series of measurement steps includes a metal stripping step including pulsing from an open circuit potential to a metal stripping potential between about 0.2 V and about 0.8 V, and holding the metal stripping potential until a corresponding current nears 0 mA/cm. The series of measurement steps further includes a cleaning step including pulsing from the metal stripping potential to a cleaning potential between about 1.2 V and about 1.6 V, and holding the cleaning potential for about 2 seconds to about 10 seconds. The series of measurement steps then includes a pre-plating step including pulsing from the cleaning potential to a pre-plating potential between about null0.2 V and about null0.5 V, and holding the pre-plating potential for about 2 seconds to about 10 seconds. The series of measurement steps additionally includes an equilibration step including pulsing from the pre-plating potential to the open circuit potential, and holding the open circuit potential for a predetermined time period, and a metal deposition step including scanning from the open circuit potential of the equilibration step to an additive sensitive potential, holding the additive sensitive potential for about 1 second to about 30 seconds, and scanning back to the open circuit potential. The method further includes plotting a profile of a deposition current resulting from the metal deposition potential as a function of time and integrating the deposition current to determine the concentration of the additive to be measured.
摘要翻译：一种用于测量电镀溶液中添加剂浓度的循环伏安法。该方法通常包括提供具有未测量的待测量添加剂浓度的电镀溶液，并通过一系列测量步骤循环惰性工作电极的电位。一系列测量步骤包括金属剥离步骤，包括从约0.2V至约0.8V之间的开路电位脉冲至金属剥离电势，并保持金属剥离电位，直到相应的电流接近0mA / cm。一系列测量步骤还包括清洁步骤，其包括从金属剥离电位脉冲至约1.2V至约1.6V之间的清洁电势，并将清洁电位保持约2秒至约10秒。所述一系列测量步骤包括预镀步骤，包括从清洁电势脉冲至约-0.2V至约-0.5V之间的预镀电势，并将预镀电位保持约2秒至约10秒。一系列测量步骤还包括平衡步骤，包括从预镀电位脉冲到开路电位，并将开路电位保持预定时间段，以及金属沉积步骤，包括从开路电位扫描平衡步骤到加性敏感电位，保持添加剂敏感电位约1秒至约30秒，并扫描回开路电位。该方法还包括绘制由金属沉积电势产生的沉积电流的轮廓作为时间的函数，并且积分沉积电流以确定待测量的添加剂的浓度。

5. 发明申请

US20040084327A1 Apparatus and method for plating solution analysis 失效
标题翻译：电镀溶液分析仪器及方法
公开(公告)号：US20040084327A1
公开(公告)日：2004-05-06
申请号：US10287901
申请日：2002-11-04
申请人： APPLIED MATERIALS, INC.
发明人： Todd Alan Balisky , Donald A. Cameron , Zhi-Wen Sun
IPC分类号： G01N027/26
CPC分类号： G01N27/48
摘要： A method and apparatus for analyzing plating solutions. The apparatus generally includes a plating cell, a reference electrolyte input, one or more external additive pumps, and a process controller. In one embodiment, the plating cell includes a cavity therein having a larger volumetric portion adjacent a smaller volumetric portion adapted to hold one or more solutions therein. The plating cell also includes a base disposed adjacent the bottom of the plating cell and adapted to receive and mix one or more test solutions as part of the plating solution analysis. In one configuration, the base includes electrical ports adapted to connect stimulation signals to a working electrode, counter electrode, and reference electrode disposed within the cell. The base also includes a thermal sensor in thermal contact with test solutions contained within the vessel.
摘要翻译：一种用于分析电镀液的方法和装置。该设备通常包括电镀槽，参考电解质输入，一个或多个外部添加剂泵以及过程控制器。在一个实施例中，电镀单元包括其中具有较大体积部分的空腔，该体积部分邻近适于在其中容纳一种或多种溶液的较小体积部分。电镀单元还包括邻近电镀单元的底部设置的底座，并适于接收和混合作为电镀溶液分析的一部分的一种或多种测试溶液。在一种配置中，底座包括适于将刺激信号连接到设置在电池内的工作电极，对电极和参考电极的电气端口。该基座还包括与容器内容纳的测试溶液热接触的热传感器。

6. 发明申请

US20040000491A1 Electroplating cell with copper acid correction module for substrate interconnect formation 审中-公开
标题翻译：具有铜酸校正模块的电镀电池用于衬底互连形成
公开(公告)号：US20040000491A1
公开(公告)日：2004-01-01
申请号：US10187027
申请日：2002-06-28
申请人： Applied Materials, Inc.
发明人： Nicolay Kovarsky , Zhi-Wen Sun
IPC分类号： C25C007/00 , C25D017/00
CPC分类号： C25D21/14 , C25D7/12 , C25D21/18
摘要： The present invention generally provides an apparatus and method for neutralizing an acid in a plating solution. The apparatus generally includes a plating cell having an anolyte compartment containing an anolyte and a catolyte compartment containing a catolyte, wherein the anolyte compartment has an anolyte inlet and an anolyte drain and the catolyte compartment has a catolyte inlet and a catolyte drain, and a cell membrane disposed in the cell between the anolyte compartment and the catolyte compartment, wherein the membrane is selective to hydrogen ions and copper ions. The apparatus further includes a catolyte storage unit in fluid communication with the catolyte inlet and an electrochemical device in fluid communication with the catolyte chamber, the electrochemical device being configured to receive a portion of aged catolyte solution and correct a catolyte concentration. The method generally includes supplying an electrolyte solution to a copper plating cell, plating copper onto a substrate in the plating cell with the electrolyte solution, removing aged electrolyte solution from the plating cell, and neutralizing a portion of the used electrolyte solution with an electrochemical device.
摘要翻译：本发明通常提供一种中和电镀液中的酸的装置和方法。该设备通常包括具有阳极电解液室的电镀池，该阳极电解液室含有阳极电解液和含有聚集体的聚合物层，其中阳极电解液室具有阳极电解液入口和阳极电解液排出物，并且所述聚合物区域具有聚集体入口和聚集体排水口，膜设置在阳极电解液室和聚合物室之间的电池中，其中膜对氢离子和铜离子是选择性的。所述设备还包括与所述聚合物入口流体连通的聚合物储存单元和与所述聚集液室流体连通的电化学装置，所述电化学装置构造成接收一部分老化的聚集体溶液并校正聚集体浓度。该方法通常包括向镀铜电池提供电解质溶液，用电解液将铜镀在电镀液中的基底上，从镀覆电池中除去老化的电解质溶液，并用电化学装置中和一部分使用的电解液。

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