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1. 发明公开

US20240035186A1 DEVICE FOR FORMING CONCRETIONS BY ELECTROLYSIS 审中-公开
公开(公告)号：US20240035186A1
公开(公告)日：2024-02-01
申请号：US18010162
申请日：2021-06-16
申请人： GEOCORAIL
发明人： Nicolas VERJAT , Alaric ZANIBELLATO
IPC分类号： C25D9/10 , C25D17/10 , C25D21/06
CPC分类号： C25D9/10 , C25D17/10 , C25D21/06
摘要： The invention relates to a device for forming concretions in an electrolytic medium by electrolysis, the device comprising an anode and a cathode device connected to each other, the cathode device comprising an arrangement of metal conductors forming a mesh that can be developed in a plane, in a plane P, the cathode device having a surface coefficient α of between 20% and 150%, in which: α=chemical surface area/influence surface area; the chemical surface area corresponding to the total surface area of the metal conductors intended to be in contact with the electrolytic medium; the influence surface area corresponding to the orthonormal projection of an influence volume in the plane P; and the influence volume corresponding to the volume that extends at any point in space within two centimetres of one of the metal conductors when the mesh is considered developed in a plane, in the plane P.

2. 发明申请

US20170145576A1 SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS 审中-公开
公开(公告)号：US20170145576A1
公开(公告)日：2017-05-25
申请号：US15332192
申请日：2016-10-24
申请人： International Business Machines Corporation
发明人： Charles L. Arvin , Michael S. Gordon
IPC分类号： C25D3/30 , H01L23/00 , C25D17/00
CPC分类号： C25D3/30 , B01J20/0211 , B01J20/0251 , B01J20/06 , B01J20/3078 , B01J20/3085 , B01J20/3204 , B01J20/3236 , C23C18/54 , C25D5/50 , C25D5/505 , C25D7/12 , C25D17/00 , C25D17/001 , C25D17/002 , C25D17/10 , C25D17/12 , C25D21/06 , G21F9/12 , H01L24/11 , H01L2224/11462 , H01L2224/115 , H01L2224/13111 , H01L2924/01084
摘要： A non alpha controlled plating bath including Tin species and a trace amount of Polonium species is utilized in a plating tool. The plating tool includes a Polonium filter element to remove Polonium species from the plating bath to selectively plate Tin upon a plating cathode. The filter may include a Titanium inner portion surrounding by a stannic oxide exterior. The filter may reduce the Polonium species by having the polonium absorb and then enter within the stannic oxide matrix. The filter may be located within the plating tool reservoir or filter housing. The filter may be fabricated by forming Tin upon a Titanium backbone and converting the Tin to stannic oxide.

3. 发明申请

US20150299882A1 NICKEL ELECTROPLATING SYSTEMS HAVING A GRAIN REFINER RELEASING DEVICE 审中-公开
标题翻译：具有谷物改性剂释放装置的镍电镀系统
公开(公告)号：US20150299882A1
公开(公告)日：2015-10-22
申请号：US14256883
申请日：2014-04-18
申请人： Lam Research Corporation
发明人： Bryan L. Buckalew , Thomas Anand Ponnuswamy
IPC分类号： C25D3/12 , H01L21/288 , C25D21/06 , C25D7/12 , C25D21/04
CPC分类号： C25D3/12 , C25D7/12 , C25D17/001 , C25D17/002 , C25D21/04 , C25D21/06 , C25D21/14 , H01L21/6723 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/741 , H01L24/94 , H01L2224/0239 , H01L2224/03462 , H01L2224/0401 , H01L2224/05147 , H01L2224/05569 , H01L2224/05655 , H01L2224/11462 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/741 , H01L2224/742 , H01L2224/94 , H01L2924/3656 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01082 , H01L2224/03 , H01L2924/01029 , H01L2224/11
摘要： Disclosed herein are grain refiner releasing devices for releasing a grain refiner compound into an electrolyte solution as it is flowed to a cathode chamber during an electroplating operation. In some embodiments, the devices may include a housing for flowing an electrolyte solution having a fluidic inlet and a fluidic outlet, a particle filter located within the housing configured to remove particles from the electrolyte solution as it flows within the housing from the fluidic inlet to the fluidic outlet, and a grain refiner holder located within the housing for holding the grain refiner compound and for contacting the grain refiner compound with the electrolyte solution as the electrolyte solution flows within the housing from the fluidic inlet to the fluidic outlet. Also disclosed herein are nickel electroplating systems including such grain refiner releasing devices and nickel electroplating methods employing grain refiner compounds.
摘要翻译：本文公开了一种晶粒细化剂释放装置，用于在电镀操作期间将晶粒细化剂化合物释放到电解质溶液中，使其流向阴极室。在一些实施例中，所述装置可以包括用于流动具有流体入口和流体出口的电解质溶液的壳体，位于所述壳体内的颗粒过滤器，其构造成当所述电解质溶液在所述壳体内从所述流体入口流动到所述壳体流体出口和位于壳体内的晶粒细化剂保持器，用于保持晶粒细化剂化合物，并且当电解质溶液在流体入口到流体出口处在壳体内流动时，使晶粒细化剂与电解质溶液接触。本文还公开了包括这种晶粒细化剂释放装置和采用晶粒细化剂化合物的镍电镀方法的镍电镀系统。

4. 发明申请

US20140224664A1 METHOD FOR REMOVING RARE EARTH IMPURITIES FROM NICKEL-ELECTROPLATING SOLUTION 有权
标题翻译：从镍电镀解决方案中去除稀土元素的方法
公开(公告)号：US20140224664A1
公开(公告)日：2014-08-14
申请号：US14346058
申请日：2012-09-21
申请人： HITACHI METALS, LTD.
发明人： Masanao Kamachi
IPC分类号： C25D21/06 , C25D7/00
CPC分类号： C25D21/06 , C25D3/12 , C25D7/001 , C25D21/18
摘要： [Object] When rare earth magnets are plated, components of the rare earth magnets are dissolved in the plating solution, causing plating defects. Thus, an easy method for removing rare earth impurities has been necessary.[Means for Solution] A nickel-electroplating solution containing rare earth impurities is kept at 60° C. or higher for a predetermined period of time to precipitate rare earth impurities for separation by sedimentation or filtration. Rare earth impurities can be precipitated further efficiently by adding precipitate to the nickel-electroplating solution, or by concentrating the nickel-electroplating solution by heating.
摘要翻译：对象当稀土磁体被镀覆时，稀土磁体的成分溶解在电镀溶液中，导致电镀缺陷。因此，需要用于除去稀土杂质的简单方法。 [解决方案]将含有稀土杂质的镍电镀溶液在60℃以上保持规定时间以沉淀稀土杂质，通过沉降或过滤分离。通过向镍电镀溶液中添加沉淀物，或者通过加热浓缩镍电镀液，能够进一步有效地析出稀土杂质。

5. 发明申请

US20140131211A1 ELECTROLYTE LOOP WITH PRESSURE REGULATION FOR SEPARATED ANODE CHAMBER OF ELECTROPLATING SYSTEM 审中-公开
标题翻译：用于电镀系统分离阳极室的电压调节电解质环路
公开(公告)号：US20140131211A1
公开(公告)日：2014-05-15
申请号：US14074510
申请日：2013-11-07
申请人： Novellus Systems, Inc.
发明人： Robert Rash , Richard Abraham , David W. Porter , Steven T. Mayer
IPC分类号： C25D5/08 , C25D17/00
CPC分类号： C25D5/08 , C25D5/006 , C25D17/00 , C25D17/002 , C25D21/04 , C25D21/06 , C25D21/14 , C25D21/18
摘要： An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.
摘要翻译：电解质，特别是阳极电解液可以经由具有压力调节器的开环循环，使得电镀室中的压力相对于大气压维持在恒定（或基本上恒定的）值。在这些实施例中，压力调节器与阳极室流体连通。

6. 发明申请

US20130334052A1 PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS 有权
标题翻译：保护阳极从合金镀层系统的钝化
公开(公告)号：US20130334052A1
公开(公告)日：2013-12-19
申请号：US13902517
申请日：2013-05-24
申请人： Novellus Systems, Inc.
发明人： Lee Peng Chua , Steven T. Mayer , David W. Porter , Thomas A. Ponnuswamy
IPC分类号： C25D5/00 , C25D21/06
CPC分类号： C25D21/18 , C25D3/60 , C25D5/00 , C25D17/001 , C25D17/002 , C25D17/10 , C25D21/06
摘要： An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
摘要翻译：用于连续同时电镀具有基本上不同的标准电沉积电位（例如，用于沉积Sn-Ag合金）的两种金属的装置包括阳极室，用于容纳包含第一少量贵金属（例如锡）的离子的阳极电解液，但不是第二个，更高贵的金属（例如银）和活性阳极; 阴极室，用于容纳包含第一金属（例如锡）的离子，第二，更贵金属（例如银）的离子和底物的阴极电解液; 位于阳极室和阴极室之间的分离结构，其中分离结构基本上防止更贵族金属从阴极电解液转移到阳极电解液; 流体特征和相关联的控制器，其耦合到所述装置并且被配置为执行连续电镀，同时在延长的使用期限内保持基本恒定的电镀浴组分的浓度。

7. 发明申请

US20110226613A1 ELECTROLYTE LOOP WITH PRESSURE REGULATION FOR SEPARATED ANODE CHAMBER OF ELECTROPLATING SYSTEM 审中-公开
公开(公告)号：US20110226613A1
公开(公告)日：2011-09-22
申请号：US13049318
申请日：2011-03-16
申请人： Robert Rash , Richard Abraham , David W. Porter , Steven T. Mayer
发明人： Robert Rash , Richard Abraham , David W. Porter , Steven T. Mayer
IPC分类号： C25D21/00
CPC分类号： C25D5/08 , C25D5/006 , C25D17/00 , C25D17/002 , C25D21/04 , C25D21/06 , C25D21/14 , C25D21/18
摘要： An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

8. 发明申请

US20090194139A1 Surface Treatment Apparatus 有权
标题翻译：表面处理装置
公开(公告)号：US20090194139A1
公开(公告)日：2009-08-06
申请号：US12361230
申请日：2009-01-28
申请人： Hideki NAKADA , Kouhei Kohama , Tetsuro Uemura , Takashi Sato , Ryosuke Hamada
发明人： Hideki NAKADA , Kouhei Kohama , Tetsuro Uemura , Takashi Sato , Ryosuke Hamada
IPC分类号： B08B7/04 , B08B3/10 , B08B3/04
CPC分类号： C25D17/00 , C25D17/06 , C25D17/10 , C25D21/06 , C25D21/08
摘要： [Object] To provide a surface treatment apparatus capable of carrying out a surface treatment, a water washing process, a drying process, etc. automatically in an assembly line manner and in a space-saving installation area.[Solution] The surface treatment apparatus includes: a supply device (2) for supplying an introduced workpiece to the inside of a treatment cell (8) of a subsequent surface treatment device (3); a surface treatment device (3) for supplying a surface treatment liquid to the inside of the treatment cell (8) while rotating the treatment cell (8), thereby performing a surface treatment on the workpiece; a workpiece collection device (4) for inverting the treatment cell (8), and squirting the inside of the treatment cell (8) with water from below to flow out the workpiece, thereby collecting the workpiece into a collection vessel (45); a drying device (5) for receiving the collection vessel (45) from the workpiece collection device (4), and exposing the workpiece within the collection vessel (45) to air, thereby drying the workpiece; and a carrying device (6) for carrying the treatment cell (8) between the surface treatment devices (3), and between the surface treatment device (3) and the workpiece collection device (4), wherein the surface treatment apparatus includes the one or more surface treatment devices (3).
摘要翻译：提供一种能够以装配线方式自动进行表面处理，水洗处理，干燥处理等的表面处理装置，并且在节省空间的安装区域中。 [解决方案]表面处理装置包括：用于将引入的工件供应到随后的表面处理装置（3）的处理室（8）的内部的供给装置（2）; 表面处理装置（3），用于在旋转处理电池（8）的同时向处理电池（8）的内部供给表面处理液体，从而对工件进行表面处理; 用于翻转处理单元（8）的工件收集装置（4），以及从下方用水喷射处理单元（8）的内部以流出工件，从而将工件收集到收集容器（45）中; 干燥装置（5），用于从所述工件收集装置（4）接收所述收集容器（45），并且将所述收集容器（45）内的工件暴露于空气中，从而干燥所述工件; 以及用于在表面处理装置（3）之间以及表面处理装置（3）和工件收集装置（4）之间承载处理电池（8）的承载装置（6），其中表面处理装置包括一个或更多的表面处理装置（3）。

9. 发明申请

US20080105555A1 Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device 审中-公开
标题翻译：电镀装置，电镀方法，半导体装置及制造半导体装置的方法
公开(公告)号：US20080105555A1
公开(公告)日：2008-05-08
申请号：US11792812
申请日：2005-12-08
申请人： Yoshihide Iwazaki
发明人： Yoshihide Iwazaki
IPC分类号： C25D5/02 , C25D17/02 , C25D5/08 , C25D21/06
CPC分类号： H01L24/11 , C25D5/02 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D17/10 , C25D21/06 , H01L21/2885 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05548 , H01L2224/05569 , H01L2224/05647 , H01L2224/1148 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/00014 , H01L2924/013
摘要： An object of the present invention is to provide a face-down type jet plating device in which deterioration in plating quality due to minute solid foreign matters derived from a black film etc. is prevented without impairing operativity. The plating device is designed such that a partition (7) is provided between a semiconductor wafer (1) and an anode (5) so that the anode (5) and the semiconductor wafer (7) are separated from each other and a plating tank (100) is divided into a substrate-to-be-plated chamber and an anode chamber.
摘要翻译：本发明的目的是提供一种面向下型喷射镀覆装置，其中防止由黑色膜等导致的微小的固体异物导致的电镀质量劣化，而不损害操作性。电镀装置被设计成使得在半导体晶片（1）和阳极（5）之间设置隔板（7），使得阳极（5）和半导体晶片（7）彼此分离，镀槽（100）被分为待镀覆基板的室和阳极室。

10. 发明申请

US20060000717A1 Method and apparatus for stabilizing plating film impurities 有权
公开(公告)号：US20060000717A1
公开(公告)日：2006-01-05
申请号：US10880675
申请日：2004-06-30
申请人： Hsien-Ping Feng , Ming-Yuang Cheng , Si-Kwua Cheng , Steven Lin , Jung-Chih Tsao , Chen-Peng Fan , Chi-Wen Liu
发明人： Hsien-Ping Feng , Ming-Yuang Cheng , Si-Kwua Cheng , Steven Lin , Jung-Chih Tsao , Chen-Peng Fan , Chi-Wen Liu
IPC分类号： C25D21/06
CPC分类号： H01L21/2885 , C25D21/06 , C25D21/18
摘要： A method of stabilizing plating film impurities in an electrochemical plating bath solution is disclosed. The method includes providing an electrochemical plating machine in which an electrochemical plating process is carried out. A by-product bath solution is formed by continually removing a pre-filtered bath solution from the machine and removing an additive from the pre-filtered bath solution. A clean bath solution is formed by removing an additive by-product from the by-product bath solution. An additive bath solution is formed by adding a fresh additive to the clean bath solution. The additive bath solution is added to the electrochemical plating machine. An apparatus for stabilizing film impurities in an electrochemical plating bath solution is also disclosed.

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