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    • 4. 发明授权
    • Method for preparing homogeneous single crystal ternary III-V alloys
    • 制备均相单晶三元III-V合金的方法
    • US5047112A
    • 1991-09-10
    • US566930
    • 1990-08-14
    • Theodore F. Ciszek
    • Theodore F. Ciszek
    • C30B15/00C30B15/12
    • C30B29/40C30B15/12Y10S117/90
    • A method for producing homogeneous, single-crystal III-V ternary alloys of high crystal perfection using a floating crucible system in which the outer crucible holds a ternary alloy of the composition desired to be produced in the crystal and an inner floating crucible having a narrow, melt-passing channel in its bottom wall holds a small quantity of melt of a pseudo-binary liquidus composition that would freeze into the desired crystal composition. The alloy of the floating crucilbe is maintained at a predetermined lower temperature than the alloy of the outer crucible, and a single crystal of the desired homogeneous alloy is pulled out of the floating crucible melt, as melt from the outer crucible flows into a bottom channel of the floating crucible at a rate that corresponds to the rate of growth of the crystal.
    • 一种使用浮动坩埚系统制造具有高结晶完全性的均匀的单晶III-V三元合金的方法,其中外坩埚保持期望在晶体中生产的组成的三元合金和具有狭窄的内部浮动坩埚 ,其底壁中的熔融通道保持少量熔融的拟二元液相组合物,其将冷冻成所需的晶体组成。 浮动坩埚的合金保持在比外坩埚的合金低的预定温度下,并且将期望的均质合金的单晶从浮坩坩埚熔化出来,当外坩埚的熔体流入底槽 的浮动坩埚以与晶体生长速率相对应的速率。
    • 6. 发明授权
    • Shallow melt apparatus for semicontinuous czochralski crystal growth
    • 用于半连续切克萨斯基晶体生长的浅熔体装置
    • US06984263B2
    • 2006-01-10
    • US10494482
    • 2001-11-01
    • Tihu WangTheodore F. Ciszek
    • Tihu WangTheodore F. Ciszek
    • C30B35/00
    • C30B29/06C30B15/02C30B15/12Y10T117/1032Y10T117/1052Y10T117/1056Y10T117/1068Y10T117/1072Y10T117/108Y10T117/1088
    • In a single crystal pulling apparatus for providing a Czochralski crystal growth process, the improvement of a shallow melt crucible (20) to eliminate the necessity supplying a large quantity of feed stock materials that had to be preloaded in a deep crucible to grow a large ingot, comprising a gas tight container a crucible with a deepened periphery (25) to prevent snapping of a shallow melt and reduce turbulent melt convection; source supply means for adding source material to the semiconductor melt; a double barrier (23) to minimize heat transfer between the deepened periphery (25) and the shallow melt in the growth compartment; offset holes (24) in the double barrier (23) to increase melt travel length between the deepened periphery (25) and the shallow growth compartment; and the interface heater/heat sink (22) to control the interface shape and crystal growth rate.
    • 在用于提供切克劳斯基晶体生长工艺的单晶拉制装置中,改进浅熔体坩埚(20),以消除必须提供大量必须预先装入深坩埚中的原料来生长大锭 ,包括具有加深的周边(25)的坩埚的气密容器,以防止浅熔体的咬合并减少湍流的熔融对流; 用于将源材料添加到半导体熔体的源供给装置; 双壁障(23),以最小化加深的周边(25)和生长室中的浅熔体之间的热传递; 在双重屏障(23)中的偏移孔(24),以增加加深的周边(25)和浅生长室之间的熔体移动长度; 和界面加热器/散热器(22),以控制界面形状和晶体生长速率。
    • 9. 发明授权
    • Method and apparatus for casting conductive and semiconductive materials
    • 用于铸造导电和半导体材料的方法和装置
    • US4572812A
    • 1986-02-25
    • US640286
    • 1984-08-13
    • Theodore F. Ciszek
    • Theodore F. Ciszek
    • B22D11/01B22D11/04B22D11/041B22D23/00B22D23/06B22D27/02
    • B22D27/02B22D11/001B22D11/141
    • A method and apparatus is disclosed for casting conductive and semiconduce materials. The apparatus includes a plurality of conductive members arranged to define a container-like area having a desired cross-sectional shape. A portion or all of the conductive or semiconductive material which is to be cast is introduced into the container-like area. A means is provided for inducing the flow of an electrical current in each of the conductive members, which currents act collectively to induce a current flow in the material. The induced current flow through the conductive members is in a direction substantially opposite to the induced current flow in the material so that the material is repelled from the conductive members during the casting process.
    • 公开了用于铸造导电和半导体材料的方法和装置。 该装置包括多个导电构件,其布置成限定具有期望横截面形状的容器状区域。 待铸造的导电或半导体材料的一部分或全部被引入容器状区域。 提供了一种用于诱导每个导电构件中的电流流动的装置,该电流共同作用以引起材料中的电流流动。 通过导电构件的感应电流在与材料中的感应电流基本相反的方向上,使得材料在铸造过程期间被从导电构件排斥。