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    • 1. 发明授权
    • Suction head and transporting machine applying the same
    • 吸头和运输机应用它
    • US08256813B2
    • 2012-09-04
    • US12722777
    • 2010-03-12
    • Jung-Lin HsiehShang-Chih ChenHung-Tsung Chung
    • Jung-Lin HsiehShang-Chih ChenHung-Tsung Chung
    • B25J15/06B25J11/00B66C1/02
    • B25J15/0616B25J15/0095B25J17/0208
    • A suction head including a first transmission part, a second transmission part and a suction nozzle is provided. The second transmission part is magnetically attracted by the first transmission part to permit a displacement of the second transmission part relative to the first transmission part. The suction nozzle is disposed on the second transmission part and transmitted by the first transmission part via the second transmission part. Additionally, a transporting machine including a shuttle, a transporting mechanism and the aforementioned suction nozzle is provided. The shuttle is capable of carrying an object being transported, and the suction head is driven by the transporting mechanism to take the object being transported. The suction head and the transporting machine applying the same provide high transporting efficiency and ensuring a normal operation in transporting process.
    • 提供了包括第一传动部分,第二传递部分和吸嘴的吸头。 第二传动部分由第一传动部分磁吸引,以允许第二传动部分相对于第一传动部分的位移。 吸嘴设置在第二传动部分上,并经第二传动部分由第一传动部分传送。 此外,提供了包括梭子,输送机构和上述吸嘴的输送机械。 梭子能够携带被运送的物体,并且吸引头由运送机构驱动以取出运送物体。 吸头和运送机运送效率高,运输过程中正常运转。
    • 8. 发明申请
    • High Performance CMOS Device Design
    • 高性能CMOS器件设计
    • US20090090935A1
    • 2009-04-09
    • US12330961
    • 2008-12-09
    • Chih-Hao WangShang-Chih ChenChing-Wei TsaiTa-Wei WangPang-Yen Tsai
    • Chih-Hao WangShang-Chih ChenChing-Wei TsaiTa-Wei WangPang-Yen Tsai
    • H01L29/78
    • H01L21/823807H01L21/823814H01L29/1054H01L29/66553H01L29/66636
    • A semiconductor device includes a gate, which comprises a gate electrode and a gate dielectric underlying the gate electrode, a spacer formed on a sidewall of the gate electrode and the gate dielectric, a buffer layer having a first portion underlying the gate dielectric and the spacer and a second portion adjacent the spacer wherein the top surface of the second portion of the buffer layer is recessed below the top surface of the first portion of the buffer layer, and a source/drain region substantially aligned with the spacer. The buffer layer preferably has a greater lattice constant than an underlying semiconductor substrate. The semiconductor device may further include a semiconductor-capping layer between the buffer layer and the gate dielectric, wherein the semiconductor-capping layer has a smaller lattice constant then the buffer layer.
    • 半导体器件包括栅极,栅极包括位于栅极电极下方的栅极电极和栅极电介质,形成在栅极电极和栅极电介质的侧壁上的间隔物,缓冲层,其具有位于栅极电介质下方的第一部分和间隔物 以及与间隔物相邻的第二部分,其中缓冲层的第二部分的顶表面在缓冲层的第一部分的顶表面下方凹陷,并且基本上与间隔物对准的源极/漏极区域。 缓冲层优选具有比下面的半导体衬底更大的晶格常数。 半导体器件还可以包括在缓冲层和栅极电介质之间的半导体覆盖层,其中半导体覆盖层具有比缓冲层更小的晶格常数。