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1. 发明授权

US08330191B2 Intrusion protection using stress changes 有权
标题翻译：使用压力变化的入侵保护
公开(公告)号：US08330191B2
公开(公告)日：2012-12-11
申请号：US12997576
申请日：2009-05-26
申请人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev
发明人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev
IPC分类号： H01L29/84 , G08B13/14
CPC分类号： H01L23/576 , G06F21/87 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.
摘要翻译：本发明涉及一种集成电路，其包括集成在基板（5）上的电子电路，并且还包括用于保护电子电路（25）的保护装置。保护装置包括：i）第一应变封装层（10），设置在基板（5）的第一侧上，其中第一应变封装层（10）在平行于基板的方向上具有应变（S1）（5），以及ii）布置成在所述衬底（5）中的应变变化的控制下至少部分地禁用所述电子电路（25）的禁用装置（20）。本发明还涉及一种制造这种集成电路的方法，以及包括这种集成电路的系统。这样的系统从包括银行卡，智能卡，无接触卡和RFID的组中选择。根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。第一主要实施例涉及集成电路，其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。第二主要实施例涉及一种集成电路，其中通过设计应变封装层的堆叠来获得防篡改，使得篡改导致应变释放，从而导致集成电路的机械分解（破坏，分层等），从而导致无效电子电路。

2. 发明授权

US08872290B2 Sensing environmental parameter through stress induced in IC 有权
标题翻译：通过IC引起的应力感应环境参数
公开(公告)号：US08872290B2
公开(公告)日：2014-10-28
申请号：US13057075
申请日：2009-07-30
申请人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
发明人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
IPC分类号： H04L23/00 , G01D5/18
CPC分类号： G01D5/18
摘要： A sensor is provided for sensing a value of a physical parameter characteristic of the sensor's environment. The sensor is implemented in semiconductor technology. A behavior of the sensor's electronic circuitry is affected by stress. The stress is induced by a film covering the circuitry or only part thereof. The stress is caused by the film's material, whose dimensions depend on a value of the parameter. This dependence is different from the 5 dependence of the circuitry's substrate on the same parameter.
摘要翻译：提供了用于感测传感器环境的物理参数特性值的传感器。传感器采用半导体技术实现。传感器的电子电路的行为受到压力的影响。应力由覆盖电路或仅部分的膜引起。压力是由胶片材料造成的，其尺寸取决于参数值。这种依赖性不同于电路衬底对相同参数的依赖性。

3. 发明申请

US20110291806A1 FOOD PACKAGE WITH INTEGRATED RFID-TAG AND SENSOR 有权
标题翻译：具有集成RFID标签和传感器的食品包装
公开(公告)号：US20110291806A1
公开(公告)日：2011-12-01
申请号：US13116920
申请日：2011-05-26
申请人： Romano Hoofman , Roel Daamen , Youri Victorovitch Ponomarev , Fotopoulou Kyriaki , Matthias Merz , Gilberto Curatola , Anton Tombeur
发明人： Romano Hoofman , Roel Daamen , Youri Victorovitch Ponomarev , Fotopoulou Kyriaki , Matthias Merz , Gilberto Curatola , Anton Tombeur
IPC分类号： H04Q5/22
CPC分类号： B65D79/02 , B65D2203/10 , G01N33/0062 , G01N33/02
摘要： A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.
摘要翻译：用于容纳易腐物质的容器具有容纳有内侧和外侧的容器壁。该壁具有在内侧和外侧之间延伸的导电层。内侧面向包含物质的空间。容器包括具有用于感测物质的物理性质或状况的传感器的电子电路和用于将RF信号传送到容器外部的接收器的天线。 RF信号表示所感测到的物理属性或状况。传感器被定位成在容器的操作使用中暴露于容纳物质的空间。天线位于外侧，或位于外侧和导电层之间，并且与导电层电隔离。

4. 发明申请

US20110217206A1 SENSOR AND A METHOD OF ASSEMBLING A SENSOR 有权
标题翻译：传感器和组装传感器的方法
公开(公告)号：US20110217206A1
公开(公告)日：2011-09-08
申请号：US13043352
申请日：2011-03-08
申请人： Romano HOOFMAN , Gerard REUVERS , Franciscus Petrus WIDDERSHOVEN , Evelyne GRIDELET , Marcus Henricus van KLEEF
发明人： Romano HOOFMAN , Gerard REUVERS , Franciscus Petrus WIDDERSHOVEN , Evelyne GRIDELET , Marcus Henricus van KLEEF
IPC分类号： G01N27/00 , H01H11/00
CPC分类号： B01L3/502715 , B01L2200/12 , B01L2300/0645 , G01N27/3275 , Y10T29/49105
摘要： “Click-assembly” methods of assembling a sensor for sensing biologically-active molecules by measuring impedance changes, are disclosed, comprising supporting a bio-sensor on a carrier, the bio-sensor comprising an electronic component having at least one micro-electrode and at least one electrical contact, functionalizing the bio-sensor by physically or chemically coupling a bio-receptor molecule to each of the at least one micro-electrode, and subsequently assembling the bio-sensor with a micro-fluidic unit by means of a clamp which clamps the bio-sensor with the micro-fluidic unit, such that in use a fluid introduced into the micro-fluidic unit is able to contact the bio-receptor and is isolated from the electrical contact. The clamp may be a spring, and the method may avoid a requirement for sealing by chemical or thermal means and thereby avoid damaging the bio-receptor. Sensors which can be assembled according to such methods are also disclosed.
摘要翻译：公开了通过测量阻抗变化来组装用于感测生物活性分子的传感器的“点击组装”方法，其包括在载体上支撑生物传感器，所述生物传感器包括具有至少一个微电极的电子部件和至少一个电接触，通过将所述生物受体分子物理或化学耦合至所述至少一个微电极中的每一个来官能化所述生物传感器，以及随后通过夹具将所述生物传感器与微流体单元组装其利用微流体单元夹持生物传感器，使得在使用中，引入微流体单元的流体能够接触生物接受体并与电接触物隔离。夹具可以是弹簧，并且该方法可以避免通过化学或热方式对密封的要求，从而避免损坏生物受体。还公开了可以根据这些方法组装的传感器。

5. 发明授权

US09034493B2 Integrated battery and IC 有权
标题翻译：集成电池和IC
公开(公告)号：US09034493B2
公开(公告)日：2015-05-19
申请号：US12953980
申请日：2010-11-24
申请人： Romano Hoofman , Coen Tak , Marc Andre De Samber
发明人： Romano Hoofman , Coen Tak , Marc Andre De Samber
IPC分类号： H01L23/498 , H01L23/14 , H01L23/58 , B81C1/00 , H01M10/04 , H01L23/00 , H01M10/0562 , H01M10/46
CPC分类号： H01L23/49855 , B81B2201/0235 , B81B2207/015 , B81B2207/03 , B81C1/00246 , H01L23/145 , H01L23/58 , H01L24/16 , H01L24/48 , H01L2224/48 , H01L2924/00014 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01M10/0436 , H01M10/0562 , H01M10/46 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Consistent with an example embodiment, there is an apparatus comprising a carrier, a laminated battery provided on a major surface of the carrier, and an integrated circuit. The laminated battery includes a bottom electrode layer, an electrolyte layer, and a top electrode layer. The integrated circuit is connected to the bottom electrode layer and the top electrode layer. The integrated circuit is surrounded by the laminated battery on the major surface of the carrier.
摘要翻译：与示例性实施例一致，存在包括载体，设置在载体的主表面上的层叠电池和集成电路的装置。叠层电池包括底电极层，电解质层和顶电极层。集成电路连接到底电极层和顶电极层。集成电路被载体的主表面上的层叠电池包围。

6. 发明授权

US08079248B2 Moisture sensor 有权
标题翻译：水分传感器
公开(公告)号：US08079248B2
公开(公告)日：2011-12-20
申请号：US12093667
申请日：2006-10-24
申请人： Romano Hoofman , Julien Maurice Marcel Michelon
发明人： Romano Hoofman , Julien Maurice Marcel Michelon
IPC分类号： G01N7/00
CPC分类号： G01N27/223 , Y10T29/43
摘要： A moisture sensor includes interdigitated first and second electrodes formed in trenches A porous low-k dielectric is provided between the electrodes. The electrodes are of Cu surrounded by a barrier layer to protect the Cu from corrosion. TiN may be used as barrier layer and selectively deposited barrier material such as CoWB, MoWB or NiMoP as barrier layer.
摘要翻译：水分传感器包括形成在沟槽中的交错的第一和第二电极。在电极之间提供多孔的低k电介质。电极是被阻挡层包围的铜，以保护铜免受腐蚀。可以使用TiN作为阻挡层和选择性沉积的阻挡材料，例如CoWB，MoWB或NiMoP作为阻挡层。

7. 发明申请

US20110301903A1 SENSOR CALIBRATION IN AN RFID TAG 审中-公开
标题翻译： RFID标签中的传感器校准
公开(公告)号：US20110301903A1
公开(公告)日：2011-12-08
申请号：US12992824
申请日：2009-04-30
申请人： Arelie Humbert , Gilbert Curatola , Matthias Merz , Remco Henricus Wilhelmus Pijenburg , Romano Hoofman , Youri Ponomarev
发明人： Arelie Humbert , Gilbert Curatola , Matthias Merz , Remco Henricus Wilhelmus Pijenburg , Romano Hoofman , Youri Ponomarev
IPC分类号： G01D18/00
CPC分类号： G01D18/008 , G01K1/024 , G01K3/04 , G01K15/00
摘要： A sensor, electrically connected to transponder, is calibrated in an environment of operational use of the transponder. The calibrating uses as a reference a value of a parameter representative of the environment.
摘要翻译：电连接到应答器的传感器在应答器的操作使用环境中被校准。校准使用代表环境的参数的值作为参考。

8. 发明申请

US20110127627A1 SENSING ENVIRONMENTAL PARAMETER THROUGH STRESS INDUCED IN IC 有权
标题翻译：通过IC中诱发的应力感测环境参数
公开(公告)号：US20110127627A1
公开(公告)日：2011-06-02
申请号：US13057075
申请日：2009-07-30
申请人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
发明人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
IPC分类号： H01L31/0352 , H01L29/66
CPC分类号： G01D5/18
摘要： A sensor is provided for sensing a value of a physical parameter characteristic of the sensor's environment. The sensor is implemented in semiconductor technology. A behavior of the sensor's electronic circuitry is affected by stress. The stress is induced by a film covering the circuitry or only part thereof. The stress is caused by the film's material, whose dimensions depend on a value of the parameter. This dependence is different from the 5 dependence of the circuitry's substrate on the same parameter.
摘要翻译：提供了用于感测传感器环境的物理参数特性值的传感器。传感器采用半导体技术实现。传感器的电子电路的行为受到压力的影响。应力由覆盖电路或仅部分的膜引起。压力是由胶片材料造成的，其尺寸取决于参数值。这种依赖性不同于电路衬底对相同参数的依赖性。

9. 发明申请

US20100001409A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100001409A1
公开(公告)日：2010-01-07
申请号：US12514214
申请日：2007-10-29
申请人： Aurelie Humbert , Romano Hoofman
发明人： Aurelie Humbert , Romano Hoofman
IPC分类号： H01L23/48 , H01L21/768 , H01L23/522
CPC分类号： H01L21/7682 , H01L21/76825 , H01L21/76831 , H01L23/5222 , H01L23/53295 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The invention relates to a semiconductor device comprising: a substrate (1), the substrate (1) comprising a body (5), the body (5) having a surface, the substrate (1) being provided with an insulating layer (10) on the surface of the body (1);—a conductor (25) with insulating sidewall spacers (22) located in the insulating layer (10), the conductor (25) having a current-flow direction during operation, the conductor (25) having a first width, the insulating sidewall spacers (22) each having a second width being smaller than the first width of the conductor (25), the first width and the second width being measured in a direction perpendicular to the current-flow direction of the conductor (25) and parallel to said surface, the conductor (25) having a first top surface extending parallel to said surface, the insulating sidewall spacers (22) having a second top surface, and airgaps (30) located in the insulating layer (10) adjacent to the insulating sidewall spacers (22), characterized in that the first top surface coincides with the second top surface, and in that the airgaps (30) extend from the surface of the body (5) to said first and second top surface. The invention further relates to a method of manufacturing such a semiconductor device. The semiconductor device according to the invention enables a lower resistance of the conductor while still providing a tolerance for unlanded vias.
摘要翻译：本发明涉及一种半导体器件，包括：衬底（1），所述衬底（1）包括主体（5），所述主体（5）具有表面，所述衬底（1）设置有绝缘层（10）在所述主体（1）的表面上; - 具有位于所述绝缘层（10）中的绝缘侧壁间隔物（22）的导体（25），所述导体（25）在操作期间具有电流流动方向，所述导体），所述绝缘侧壁间隔件（22）各自具有小于所述导体（25）的第一宽度的第二宽度，所述第一宽度和所述第二宽度在垂直于所述电流流动方向的方向上被测量的导体（25）并且平行于所述表面，所述导体（25）具有平行于所述表面延伸的第一顶表面，所述绝缘侧壁间隔件（22）具有第二顶表面，以及位于绝缘体中的气隙（30）邻近绝缘侧壁间隔物（22）的层（10），其特征在于第一顶表面与第二顶表面重合，并且气囊（30）从主体（5）的表面延伸到所述第一和第二顶表面。本发明还涉及一种制造这种半导体器件的方法。根据本发明的半导体器件使得导体的电阻较低，同时仍然提供对未经过过孔的容差。

10. 发明授权

US09375711B2 Sensor and a method of assembling a sensor 有权
标题翻译：传感器和组装传感器的方法
公开(公告)号：US09375711B2
公开(公告)日：2016-06-28
申请号：US13043352
申请日：2011-03-08
申请人： Romano Hoofman , Gerard Reuvers , Franciscus Petrus Widdershoven , Evelyne Gridelet , Marcus Henricus van Kleef
发明人： Romano Hoofman , Gerard Reuvers , Franciscus Petrus Widdershoven , Evelyne Gridelet , Marcus Henricus van Kleef
IPC分类号： G01N27/00 , B01L3/00 , G01N27/327
CPC分类号： B01L3/502715 , B01L2200/12 , B01L2300/0645 , G01N27/3275 , Y10T29/49105
摘要： “Click-assembly” methods of assembling a sensor for sensing biologically-active molecules by measuring impedance changes, are disclosed, comprising supporting a bio-sensor on a carrier, the bio-sensor comprising an electronic component having at least one micro-electrode and at least one electrical contact, functionalizing the bio-sensor by physically or chemically coupling a bio-receptor molecule to each of the at least one micro-electrode, and subsequently assembling the bio-sensor with a micro-fluidic unit by means of a clamp which clamps the bio-sensor with the micro-fluidic unit, such that in use a fluid introduced into the micro-fluidic unit is able to contact the bio-receptor and is isolated from the electrical contact. The clamp may be a spring, and the method may avoid a requirement for sealing by chemical or thermal means and thereby avoid damaging the bio-receptor.Sensors which can be assembled according to such methods are also disclosed.
摘要翻译：公开了通过测量阻抗变化来组装用于感测生物活性分子的传感器的“点击组装”方法，其包括在载体上支撑生物传感器，所述生物传感器包括具有至少一个微电极的电子部件和至少一个电接触，通过将所述生物受体分子物理或化学耦合至所述至少一个微电极中的每一个来官能化所述生物传感器，以及随后通过夹具将所述生物传感器与微流体单元组装其利用微流体单元夹持生物传感器，使得在使用中，引入微流体单元的流体能够接触生物接受体并与电接触物隔离。夹具可以是弹簧，并且该方法可以避免通过化学或热方式对密封的要求，从而避免损坏生物受体。还公开了可以根据这些方法组装的传感器。

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