专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110291806A1 FOOD PACKAGE WITH INTEGRATED RFID-TAG AND SENSOR 有权
标题翻译：具有集成RFID标签和传感器的食品包装
公开(公告)号：US20110291806A1
公开(公告)日：2011-12-01
申请号：US13116920
申请日：2011-05-26
申请人： Romano Hoofman , Roel Daamen , Youri Victorovitch Ponomarev , Fotopoulou Kyriaki , Matthias Merz , Gilberto Curatola , Anton Tombeur
发明人： Romano Hoofman , Roel Daamen , Youri Victorovitch Ponomarev , Fotopoulou Kyriaki , Matthias Merz , Gilberto Curatola , Anton Tombeur
IPC分类号： H04Q5/22
CPC分类号： B65D79/02 , B65D2203/10 , G01N33/0062 , G01N33/02
摘要： A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.
摘要翻译：用于容纳易腐物质的容器具有容纳有内侧和外侧的容器壁。该壁具有在内侧和外侧之间延伸的导电层。内侧面向包含物质的空间。容器包括具有用于感测物质的物理性质或状况的传感器的电子电路和用于将RF信号传送到容器外部的接收器的天线。 RF信号表示所感测到的物理属性或状况。传感器被定位成在容器的操作使用中暴露于容纳物质的空间。天线位于外侧，或位于外侧和导电层之间，并且与导电层电隔离。

2. 发明授权

US09884715B2 Food package with integrated RFID-tag and sensor 有权
公开(公告)号：US09884715B2
公开(公告)日：2018-02-06
申请号：US13116920
申请日：2011-05-26
申请人： Romano Hoofman , Roel Daamen , Youri Victorovitch Ponomarev , Fotopoulou Kyriaki , Matthias Merz , Gilberto Curatola , Anton Tombeur
发明人： Romano Hoofman , Roel Daamen , Youri Victorovitch Ponomarev , Fotopoulou Kyriaki , Matthias Merz , Gilberto Curatola , Anton Tombeur
IPC分类号： H04Q5/22 , B65D79/02 , G01N33/00 , G01N33/02
CPC分类号： B65D79/02 , B65D2203/10 , G01N33/0062 , G01N33/02
摘要： A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.

3. 发明授权

US08906534B2 Stacked multi-cell battery concept 有权
标题翻译：堆叠多节电池概念
公开(公告)号：US08906534B2
公开(公告)日：2014-12-09
申请号：US12474165
申请日：2009-05-28
申请人： Romano Hoofman , Aurelie Humbert , Matthias Merz , Youri Victorovitch Ponomarev , Remco Henricus Wilhelmus Pijnenburg , Gilberto Curatola
发明人： Romano Hoofman , Aurelie Humbert , Matthias Merz , Youri Victorovitch Ponomarev , Remco Henricus Wilhelmus Pijnenburg , Gilberto Curatola
IPC分类号： H01M6/18 , H01M10/05 , H01M6/40 , H01M4/70 , H01M10/04 , H01M10/0585 , H01M10/0562
CPC分类号： H01M6/40 , H01M4/70 , H01M6/18 , H01M6/188 , H01M10/0436 , H01M10/0562 , H01M10/0585 , Y10T29/49108
摘要： A device is provided that includes a battery layer on a substrate, where a first battery cell is formed in the battery layer. The first battery cell includes a first anode, a first cathode, and a first electrolyte arranged between the first anode and the first cathode, where the first anode, the first cathode, and the first electrolyte are arranged in the battery layer such that perpendicular projections onto the substrate of each of the first anode and the first cathode are non-overlapping. A method of manufacturing such device is also provided. A system is also provide that includes such device for supplying power to an electronic device.
摘要翻译：提供了一种在基板上包括电池层的装置，其中第一电池单体形成在电池层中。第一电池单元包括第一阳极，第一阴极和布置在第一阳极和第一阴极之间的第一电解质，其中第一阳极，第一阴极和第一电解质布置在电池层中，使得垂直突起在第一阳极和第一阴极中的每一个的衬底上是不重叠的。还提供了制造这种装置的方法。还提供一种包括用于向电子设备供电的设备的系统。

4. 发明授权

US08683861B2 Humidity sensor based on progressive corrosion of exposed material 失效
标题翻译：基于暴露材料逐渐腐蚀的湿度传感器
公开(公告)号：US08683861B2
公开(公告)日：2014-04-01
申请号：US12670715
申请日：2008-07-30
申请人： Aurelie Humbert , Youri Victorovitch Ponomarev , Matthias Merz , Romano Hoofman
发明人： Aurelie Humbert , Youri Victorovitch Ponomarev , Matthias Merz , Romano Hoofman
IPC分类号： G01N19/00
CPC分类号： G01N17/04
摘要： A sensor senses a characteristic of an environment, e.g., humidity. The sensor has a substrate with strips of material that is sensitive to corrosion as a result of the characteristic. The strips are configured to respond differently to the characteristic. By means of repeatedly measuring the resistances of the strips, the environment can be monitored in terms of accumulated exposure to the characteristic. The strips are manufactured in a semiconductor technology so as to generate accurate sensors that behave predictably.
摘要翻译：传感器感测环境的特性，例如湿度。传感器具有由于特性而对腐蚀敏感的材料条带的基板。条带被配置为对特性做出不同的响应。通过重复测量条的电阻，可以根据特征的累积暴露来监测环境。这些条以半导体技术制造，以便产生可预测地行为的精确传感器。

5. 发明申请

US20100192688A1 HUMIDITY SENSOR BASED ON PROGRESSIVE CORROSION OF EXPOSED MATERIAL 失效
标题翻译：基于暴露材料逐渐腐蚀的湿度传感器
公开(公告)号：US20100192688A1
公开(公告)日：2010-08-05
申请号：US12670715
申请日：2008-07-30
申请人： Aurelie Humbert , Youri Victorovitch Ponomarev , Matthias Merz , Romano Hoofman
发明人： Aurelie Humbert , Youri Victorovitch Ponomarev , Matthias Merz , Romano Hoofman
IPC分类号： G01N17/04
CPC分类号： G01N17/04
摘要： A sensor senses a characteristic of an environment, e.g., humidity. The sensor has a substrate with strips of material that is sensitive to corrosion as a result of the characteristic. The strips are configured to respond differently to the characteristic. By means of repeatedly measuring the resistances of the strips, the environment can be monitored in terms of accumulated exposure to the characteristic. The strips are manufactured in a semiconductor technology so as to generate accurate sensors that behave predictably.
摘要翻译：传感器感测环境的特性，例如湿度。传感器具有由于特性而对腐蚀敏感的材料条带的基板。条带被配置为对特性做出不同的响应。通过重复测量条的电阻，可以根据特征的累积暴露来监测环境。这些条以半导体技术制造，以便产生可预测地行为的精确传感器。

6. 发明授权

US08330191B2 Intrusion protection using stress changes 有权
标题翻译：使用压力变化的入侵保护
公开(公告)号：US08330191B2
公开(公告)日：2012-12-11
申请号：US12997576
申请日：2009-05-26
申请人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev
发明人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev
IPC分类号： H01L29/84 , G08B13/14
CPC分类号： H01L23/576 , G06F21/87 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.
摘要翻译：本发明涉及一种集成电路，其包括集成在基板（5）上的电子电路，并且还包括用于保护电子电路（25）的保护装置。保护装置包括：i）第一应变封装层（10），设置在基板（5）的第一侧上，其中第一应变封装层（10）在平行于基板的方向上具有应变（S1）（5），以及ii）布置成在所述衬底（5）中的应变变化的控制下至少部分地禁用所述电子电路（25）的禁用装置（20）。本发明还涉及一种制造这种集成电路的方法，以及包括这种集成电路的系统。这样的系统从包括银行卡，智能卡，无接触卡和RFID的组中选择。根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。第一主要实施例涉及集成电路，其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。第二主要实施例涉及一种集成电路，其中通过设计应变封装层的堆叠来获得防篡改，使得篡改导致应变释放，从而导致集成电路的机械分解（破坏，分层等），从而导致无效电子电路。

7. 发明授权

US08872290B2 Sensing environmental parameter through stress induced in IC 有权
标题翻译：通过IC引起的应力感应环境参数
公开(公告)号：US08872290B2
公开(公告)日：2014-10-28
申请号：US13057075
申请日：2009-07-30
申请人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
发明人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
IPC分类号： H04L23/00 , G01D5/18
CPC分类号： G01D5/18
摘要： A sensor is provided for sensing a value of a physical parameter characteristic of the sensor's environment. The sensor is implemented in semiconductor technology. A behavior of the sensor's electronic circuitry is affected by stress. The stress is induced by a film covering the circuitry or only part thereof. The stress is caused by the film's material, whose dimensions depend on a value of the parameter. This dependence is different from the 5 dependence of the circuitry's substrate on the same parameter.
摘要翻译：提供了用于感测传感器环境的物理参数特性值的传感器。传感器采用半导体技术实现。传感器的电子电路的行为受到压力的影响。应力由覆盖电路或仅部分的膜引起。压力是由胶片材料造成的，其尺寸取决于参数值。这种依赖性不同于电路衬底对相同参数的依赖性。

8. 发明申请

US20110127627A1 SENSING ENVIRONMENTAL PARAMETER THROUGH STRESS INDUCED IN IC 有权
标题翻译：通过IC中诱发的应力感测环境参数
公开(公告)号：US20110127627A1
公开(公告)日：2011-06-02
申请号：US13057075
申请日：2009-07-30
申请人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
发明人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenbrug , Youri Victorovitch Ponomarev
IPC分类号： H01L31/0352 , H01L29/66
CPC分类号： G01D5/18
摘要： A sensor is provided for sensing a value of a physical parameter characteristic of the sensor's environment. The sensor is implemented in semiconductor technology. A behavior of the sensor's electronic circuitry is affected by stress. The stress is induced by a film covering the circuitry or only part thereof. The stress is caused by the film's material, whose dimensions depend on a value of the parameter. This dependence is different from the 5 dependence of the circuitry's substrate on the same parameter.
摘要翻译：提供了用于感测传感器环境的物理参数特性值的传感器。传感器采用半导体技术实现。传感器的电子电路的行为受到压力的影响。应力由覆盖电路或仅部分的膜引起。压力是由胶片材料造成的，其尺寸取决于参数值。这种依赖性不同于电路衬底对相同参数的依赖性。

9. 发明申请

US20110089506A1 INTRUSION PROTECTION USING STRESS CHANGES 有权
标题翻译：使用压力变化的侵入保护
公开(公告)号：US20110089506A1
公开(公告)日：2011-04-21
申请号：US12997576
申请日：2009-05-26
申请人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev
发明人： Romano Hoofman , Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev
IPC分类号： H01L29/84 , G06K19/073 , H01L21/56
CPC分类号： H01L23/576 , G06F21/87 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.
摘要翻译：本发明涉及一种集成电路，其包括集成在基板（5）上的电子电路，并且还包括用于保护电子电路（25）的保护装置。保护装置包括：i）第一应变封装层（10），设置在基板（5）的第一侧上，其中第一应变封装层（10）在平行于基板的方向上具有应变（S1）（5），以及ii）布置成在所述衬底（5）中的应变变化的控制下至少部分地禁用所述电子电路（25）的禁用装置（20）。本发明还涉及一种制造这种集成电路的方法，以及包括这种集成电路的系统。这样的系统从包括银行卡，智能卡，无接触卡和RFID的组中选择。根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。第一主要实施例涉及集成电路，其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。第二主要实施例涉及一种集成电路，其中通过设计应变封装层的堆叠来获得防篡改，使得篡改导致应变释放，从而导致集成电路的机械分解（破坏，分层等），从而导致无效电子电路。

10. 发明申请

US20110097896A1 Method for fabrication of in-laid metal interconnects 有权
标题翻译：埋入式金属互连的制造方法
公开(公告)号：US20110097896A1
公开(公告)日：2011-04-28
申请号：US10526422
申请日：2003-08-04
申请人： Roel Daamen , Viet Nguyen Hoang , Romano Hoofman , Greja Verheijoen
发明人： Roel Daamen , Viet Nguyen Hoang , Romano Hoofman , Greja Verheijoen
IPC分类号： H01L21/768
CPC分类号： H01L21/7684 , H01L21/7688
摘要： The present invention relates to a method for fabrication of in-laid metal interconnects. The method comprises the steps of providing a substrate with a dielectric material (1) on top thereof, depositing a protection layer (2) on top of the dielectric material, depositing a sacrificial layer (7) on top of the protection layer, the sacrificial layer having a mechanical strength that is lower than the mechanical strength of the protection layer, making an opening (3) through the sacrificial layer, through the protection layer and into the dielectric material, depositing a barrier layer (4) in the opening and on the sacrificial layer, depositing metal material (5) on the barrier layer, the metal material filling the opening, removing portions of the metal material existing beyond the opening by means of polishing, and removing the barrier layer and the sacrificial layer in one polishing step.
摘要翻译：本发明涉及一种内置金属互连的制造方法。该方法包括以下步骤：在其顶部提供介电材料（1）的基底，在电介质材料的顶部上沉积保护层（2），在保护层的顶部上沉积牺牲层（7）具有低于保护层的机械强度的机械强度的层，通过保护层形成通过牺牲层的开口（3）并进入电介质材料，在开口中沉积阻挡层（4）牺牲层，在阻挡层上沉积金属材料（5），填充开口的金属材料，通过抛光去除存在于开口之外的金属材料的部分，以及在一个抛光步骤中去除阻挡层和牺牲层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式