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    • 3. 发明授权
    • Intrusion protection using stress changes
    • 使用压力变化的入侵保护
    • US08330191B2
    • 2012-12-11
    • US12997576
    • 2009-05-26
    • Romano HoofmanRemco Henricus Wilhelmus PijnenburgYouri Victorovitch Ponomarev
    • Romano HoofmanRemco Henricus Wilhelmus PijnenburgYouri Victorovitch Ponomarev
    • H01L29/84G08B13/14
    • H01L23/576G06F21/87H01L2924/0002H01L2924/00
    • The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.
    • 本发明涉及一种集成电路,其包括集成在基板(5)上的电子电路,并且还包括用于保护电子电路(25)的保护装置。 保护装置包括:i)第一应变封装层(10),设置在基板(5)的第一侧上,其中第一应变封装层(10)在平行于基板的方向上具有应变(S1) (5),以及ii)布置成在所述衬底(5)中的应变变化的控制下至少部分地禁用所述电子电路(25)的禁用装置(20)。 本发明还涉及一种制造这种集成电路的方法,以及包括这种集成电路的系统。 这样的系统从包括银行卡,智能卡,无接触卡和RFID的组中选择。 根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。 第一主要实施例涉及集成电路,其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。 第二主要实施例涉及一种集成电路,其中通过设计应变封装层的堆叠来获得防篡改,使得篡改导致应变释放,从而导致集成电路的机械分解(破坏,分层等),从而导致无效 电子电路。
    • 8. 发明申请
    • INTRUSION PROTECTION USING STRESS CHANGES
    • 使用压力变化的侵入保护
    • US20110089506A1
    • 2011-04-21
    • US12997576
    • 2009-05-26
    • Romano HoofmanRemco Henricus Wilhelmus PijnenburgYouri Victorovitch Ponomarev
    • Romano HoofmanRemco Henricus Wilhelmus PijnenburgYouri Victorovitch Ponomarev
    • H01L29/84G06K19/073H01L21/56
    • H01L23/576G06F21/87H01L2924/0002H01L2924/00
    • The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.
    • 本发明涉及一种集成电路,其包括集成在基板(5)上的电子电路,并且还包括用于保护电子电路(25)的保护装置。 保护装置包括:i)第一应变封装层(10),设置在基板(5)的第一侧上,其中第一应变封装层(10)在平行于基板的方向上具有应变(S1) (5),以及ii)布置成在所述衬底(5)中的应变变化的控制下至少部分地禁用所述电子电路(25)的禁用装置(20)。 本发明还涉及一种制造这种集成电路的方法,以及包括这种集成电路的系统。 这样的系统从包括银行卡,智能卡,无接触卡和RFID的组中选择。 根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。 第一主要实施例涉及集成电路,其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。 第二主要实施例涉及一种集成电路,其中通过设计应变封装层的堆叠来获得防篡改,使得篡改导致应变释放,从而导致集成电路的机械分解(破坏,分层等),从而导致无效 电子电路。