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    • 5. 发明授权
    • pH sensor and manufacturing method
    • pH传感器和制造方法
    • US08742470B2
    • 2014-06-03
    • US13600385
    • 2012-08-31
    • Matthias MerzCoenraad Cornelis TakRomano Hoofman
    • Matthias MerzCoenraad Cornelis TakRomano Hoofman
    • G01N27/403
    • G01N27/302G01N27/4148G01N27/4167G01N33/02G01N33/04G01N33/12H01L2224/48091H01L2924/1815Y10T29/49002H01L2924/00014
    • Disclosed is a pH sensor comprising a carrier (10) comprising a plurality of conductive tracks and an exposed conductive area (40) defining a reference electrode connected to one of said conductive tracks; a sensing device (30) mounted on the carrier and connected at least one other of said conductive tracks; an encapsulation (20) covering the carrier, said encapsulation comprising a first cavity (22) exposing a surface (32) of the sensing device and a second cavity (24) exposing the exposed conductive area, said second cavity comprising a reference electrode material (42) and an ion reservoir material (44) sharing at least one ion type with said reference electrode material, the reference electrode material being sandwiched between the exposed conductive area and the ion reservoir material. A method of manufacturing such a pH sensor is also disclosed.
    • 公开了一种pH传感器,其包括包括多个导电轨道的载体(10)和限定连接到所述导电轨道之一的参考电极的暴露导电区域(40) 感测装置(30),其安装在所述载体上并且连接至少另一个所述导电轨道; 覆盖所述载体的封装(20),所述封装包括暴露所述感测装置的表面(32)的第一空腔(22)和暴露所述暴露的导电区域的第二空腔(24),所述第二空腔包括参考电极材料 42)和与所述参考电极材料共享至少一种离子型离子储存器材料(44),所述参考电极材料夹在所述暴露的导电区域和所述离子储存器材料之间。 还公开了制造这种pH传感器的方法。
    • 8. 发明授权
    • Intrusion protection using stress changes
    • 使用压力变化的入侵保护
    • US08330191B2
    • 2012-12-11
    • US12997576
    • 2009-05-26
    • Romano HoofmanRemco Henricus Wilhelmus PijnenburgYouri Victorovitch Ponomarev
    • Romano HoofmanRemco Henricus Wilhelmus PijnenburgYouri Victorovitch Ponomarev
    • H01L29/84G08B13/14
    • H01L23/576G06F21/87H01L2924/0002H01L2924/00
    • The invention relates to a integrated circuit comprising an electronic circuit integrated on a substrate (5), and further comprising protections means for protection of the electronic circuit (25). The protection means comprise: i) a first strained encapsulation layer (10) being provided on a first side of the substrate (5), wherein the first strained encapsulation layer (10) has a strain (S1) in a direction parallel to the substrate (5), and ii) disabling means (20) arranged for at least partially disabling the electronic circuit (25) under control of a strain change in the substrate (5). The invention further relates to a method of manufacturing such integrated circuit, and to a system comprising such integrated circuit. Such system is selected from a group comprising: a bank-card, a smart-card, a contact-less card and an RFID. All embodiments of the integrated circuit in accordance with the invention provide essentially an alternative tamper protection to the data stored or present in the electronic circuit therein. A first main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by detecting a strain change during tampering and subsequently disabling the electronic circuit. A second main group of embodiments concerns an integrated circuit wherein tamper protection is obtained by designing a stack of strained encapsulation layers, such that tampering causes releasing of strain and thereby mechanical disintegrate (break, delaminate, etc) of the integrated circuit, and thus disabling the electronic circuit.
    • 本发明涉及一种集成电路,其包括集成在基板(5)上的电子电路,并且还包括用于保护电子电路(25)的保护装置。 保护装置包括:i)第一应变封装层(10),设置在基板(5)的第一侧上,其中第一应变封装层(10)在平行于基板的方向上具有应变(S1) (5),以及ii)布置成在所述衬底(5)中的应变变化的控制下至少部分地禁用所述电子电路(25)的禁用装置(20)。 本发明还涉及一种制造这种集成电路的方法,以及包括这种集成电路的系统。 这样的系统从包括银行卡,智能卡,无接触卡和RFID的组中选择。 根据本发明的集成电路的所有实施例基本上为存储或存在于其中的电子电路中的数据提供了替代的篡改保护。 第一主要实施例涉及集成电路,其中通过在篡改期间检测应变变化并随后禁用电子电路来获得篡改保护。 第二主要实施例涉及一种集成电路,其中通过设计应变封装层的堆叠来获得防篡改,使得篡改导致应变释放,从而导致集成电路的机械分解(破坏,分层等),从而导致无效 电子电路。