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    • 1. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US07951679B2
    • 2011-05-31
    • US11187958
    • 2005-07-25
    • Koji YoshidaKeita TakahashiFumihiko NoroMasatoshi AraiNobuyoshi Takahashi
    • Koji YoshidaKeita TakahashiFumihiko NoroMasatoshi AraiNobuyoshi Takahashi
    • H01L21/336
    • H01L27/115H01L27/11568
    • First, on a semiconductor region of a first conductivity type, a trapping film is formed which stores information by accumulating charges. Then, the trapping film is formed with a plurality of openings, and impurity ions of a second conductivity type are implanted into the semiconductor region from the formed openings, thereby forming a plurality of diffused layers of the second conductivity type in portions of the semiconductor region located below the openings, respectively. An insulating film is formed to cover edges of the trapping film located toward the openings, and then the semiconductor region is subjected to a thermal process in an atmosphere containing oxygen to oxidize upper portions of the diffused layers. Thereby, insulating oxide films are formed in the upper portions of the diffused layers, respectively. Subsequently, a conductive film is formed over the trapping film including the edges thereof to form an electrode.
    • 首先,在第一导电类型的半导体区域上,形成通过累积电荷来存储信息的捕获膜。 然后,捕获膜形成有多个开口,并且第二导电类型的杂质离子从形成的开口注入到半导体区域中,从而在半导体区域的部分中形成多个第二导电类型的扩散层 分别位于开口下方。 形成绝缘膜以覆盖位于开口的捕获膜的边缘,然后在含氧气氛中对半导体区域进行热处理,以氧化扩散层的上部。 因此,绝缘氧化膜分别形成在扩散层的上部。 随后,在包括其边缘的捕获膜上形成导电膜以形成电极。
    • 5. 发明申请
    • SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
    • 半导体器件及其制造方法
    • US20090189214A1
    • 2009-07-30
    • US12360488
    • 2009-01-27
    • Nobuyoshi TakahashiIchirou Matsuo
    • Nobuyoshi TakahashiIchirou Matsuo
    • H01L29/792H01L21/336
    • H01L27/11568
    • The semiconductor device includes: a plurality of bit lines formed in stripes in a semiconductor substrate of a first conductivity type, each of the bit lines being a diffusion layer of an impurity of a second conductivity type; a plurality of gate insulation films s formed on regions of the semiconductor substrate between the bit lines; a plurality of word lines formed on the semiconductor substrate via the gate insulating films, the word lines extending in a direction intersecting with the bit lines; and a plurality of bit line isolation diffusion layers formed in regions of the semiconductor substrate between the word lines, each of the bit line isolation diffusion layers being a diffusion layer of an impurity of the first conductivity type. The bit line isolation diffusion layer includes a diffusion suppressor for suppressing diffusion of an impurity.
    • 半导体器件包括:在第一导电类型的半导体衬底中以条纹形成的多个位线,每个位线是第二导电类型的杂质的扩散层; 在所述位线之间形成在所述半导体衬底的区域上的多个栅绝缘膜; 经由所述栅极绝缘膜形成在所述半导体衬底上的多个字线,所述字线在与所述位线相交的方向上延伸; 以及在所述字线之间的所述半导体衬底的区域中形成的多个位线隔离扩散层,所述位线隔离扩散层中的每一个为所述第一导电类型的杂质的扩散层。 位线隔离扩散层包括用于抑制杂质扩散的扩散抑制器。
    • 10. 发明授权
    • Semiconductor device and fabrication method for the same
    • 半导体器件及其制造方法相同
    • US08569824B2
    • 2013-10-29
    • US12360488
    • 2009-01-27
    • Nobuyoshi TakahashiIchirou Matsuo
    • Nobuyoshi TakahashiIchirou Matsuo
    • H01L29/792
    • H01L27/11568
    • The semiconductor device includes: a plurality of bit lines formed in stripes in a semiconductor substrate of a first conductivity type, each of the bit lines being a diffusion layer of an impurity of a second conductivity type; a plurality of gate insulation films formed on regions of the semiconductor substrate between the bit lines; a plurality of word lines formed on the semiconductor substrate via the gate insulating films, the word lines extending in a direction intersecting with the bit lines; and a plurality of bit line isolation diffusion layers formed in regions of the semiconductor substrate between the word lines, each of the bit line isolation diffusion layers being a diffusion layer of an impurity of the first conductivity type. The bit line isolation diffusion layer includes a diffusion suppressor for suppressing diffusion of an impurity.
    • 半导体器件包括:在第一导电类型的半导体衬底中以条纹形成的多个位线,每个位线是第二导电类型的杂质的扩散层; 形成在位线之间的半导体衬底的区域上的多个栅极绝缘膜; 经由所述栅极绝缘膜形成在所述半导体衬底上的多个字线,所述字线在与所述位线相交的方向上延伸; 以及在所述字线之间的所述半导体衬底的区域中形成的多个位线隔离扩散层,所述位线隔离扩散层中的每一个为所述第一导电类型的杂质的扩散层。 位线隔离扩散层包括用于抑制杂质扩散的扩散抑制器。