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    • 3. 发明授权
    • Semiconductor device and fabrication method for the same
    • 半导体器件及其制造方法相同
    • US08076196B2
    • 2011-12-13
    • US12899164
    • 2010-10-06
    • Nobuyoshi Takahashi
    • Nobuyoshi Takahashi
    • H01L21/00
    • H01L27/11573H01L27/0248H01L27/0629H01L27/105
    • The semiconductor device includes: memory cells each having a first multilayer electrode including a first lower electrode made of a first conductive film and a first upper electrode made of a second conductive film formed one on the other with a first interface film therebetween; and a diode having a diode electrode made of the second conductive film and a second interface film as a silicon oxide film formed at the interface between the diode electrode and a substrate. The first interface film has a thickness with which electrical connection between the lower electrode and the upper electrode is maintained, and the second interface film has a thickness with which epitaxial growth between the substrate and the diode electrode is inhibited.
    • 半导体器件包括:各自具有第一多层电极的存储单元,所述第一多层电极包括由第一导电膜制成的第一下部电极和由其间形成有第一界面膜的第二导电膜形成的第一上部电极; 以及具有由第二导电膜制成的二极管电极和形成在二极管电极和基板之间的界面处的氧化硅膜的第二界面膜的二极管。 第一界面膜具有保持下电极和上电极之间的电连接的厚度,并且第二界面膜具有抑制衬底和二极管电极之间的外延生长的厚度。