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    • 1. 发明授权
    • Semiconductor memory device and method for manufacturing the same
    • 半导体存储器件及其制造方法
    • US07474548B2
    • 2009-01-06
    • US11637939
    • 2006-12-13
    • Yoshiya MoriyamaYuji HaradaKeita Takahashi
    • Yoshiya MoriyamaYuji HaradaKeita Takahashi
    • G11C5/06
    • H01L27/115H01L27/11521H01L27/11568
    • A semiconductor memory device includes: a memory cell array region formed in a semiconductor region of a first conductivity type and having a plurality of memory cells arranged in rows and columns; a plurality of word lines each of which collectively connects ones of the plurality of memory cells aligned in the same row; and a protective diode region formed in the semiconductor region to be separated from the memory cell array region. In the protective diode region, a protective diode element is constructed by making a junction between a first diffusion layer of a second conductivity type formed in the upper portion of the semiconductor region and the semiconductor region. Each of the word lines extends to the protective diode region and is brought into direct connection to the first diffusion layer of the second conductivity type, thereby making electrical connection to the protective diode element.
    • 半导体存储器件包括:存储单元阵列区域,形成在第一导电类型的半导体区域中,并具有以行和列排列的多个存储单元; 多个字线,其各自共同连接在同一行中排列的多个存储单元中的一个; 以及形成在半导体区域中以与存储单元阵列区域分离的保护二极管区域。 在保护二极管区域中,通过在半导体区域的上部形成的第二导电类型的第一扩散层与半导体区域之间形成接合来构成保护二极管元件。 每条字线延伸到保护二极管区,并与第二导电类型的第一扩散层直接连接,从而与保护二极管元件电连接。
    • 2. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SAME
    • 半导体器件及其制造方法
    • US20090114998A1
    • 2009-05-07
    • US12261431
    • 2008-10-30
    • Yoshiya MORIYAMA
    • Yoshiya MORIYAMA
    • H01L27/088H01L21/28
    • H01L21/82345H01L21/28035H01L21/28088H01L21/823412H01L21/823462H01L21/823481H01L27/088H01L29/4966H01L29/518
    • A first MIS transistor is formed in a low voltage transistor formation region and includes a gate insulating film and a first gate electrode composed of a metal film and a polycrystalline silicon film. A second MIS transistor is formed in a high voltage transistor formation region and includes a gate insulating film and a second gate electrode composed of a polycrystalline silicon film. An equivalent oxide thickness of the gate insulating film formed in the low voltage transistor formation region is thinner than an equivalent oxide thickness of the gate insulating film formed in the high voltage transistor formation region. A level of the surface of a semiconductor substrate in the low voltage transistor formation region is higher than a level of the surface of a semiconductor substrate in the high voltage transistor formation region.
    • 第一MIS晶体管形成在低压晶体管形成区域中,并且包括栅绝缘膜和由金属膜​​和多晶硅膜构成的第一栅电极。 第二MIS晶体管形成在高电压晶体管形成区域中,并且包括栅极绝缘膜和由多晶硅膜构成的第二栅电极。 形成在低压晶体管形成区域中的栅极绝缘膜的等效氧化物厚度比形成在高压晶体管形成区域中的栅极绝缘膜的等效氧化物厚度薄。 低压晶体管形成区域中的半导体衬底的表面的电平高于高压晶体管形成区域中的半导体衬底的表面的电平。
    • 4. 发明申请
    • Semiconductor memory device and method for manufacturing the same
    • 半导体存储器件及其制造方法
    • US20070152265A1
    • 2007-07-05
    • US11637939
    • 2006-12-13
    • Yoshiya MoriyamaYuji HaradaKeita Takahashi
    • Yoshiya MoriyamaYuji HaradaKeita Takahashi
    • H01L29/792
    • H01L27/115H01L27/11521H01L27/11568
    • A semiconductor memory device includes: a memory cell array region formed in a semiconductor region of a first conductivity type and having a plurality of memory cells arranged in rows and columns; a plurality of word lines each of which collectively connects ones of the plurality of memory cells aligned in the same row; and a protective diode region formed in the semiconductor region to be separated from the memory cell array region. In the protective diode region, a protective diode element is constructed by making a junction between a first diffusion layer of a second conductivity type formed in the upper portion of the semiconductor region and the semiconductor region. Each of the word lines extends to the protective diode region and is brought into direct connection to the first diffusion layer of the second conductivity type, thereby making electrical connection to the protective diode element.
    • 半导体存储器件包括:存储单元阵列区域,形成在第一导电类型的半导体区域中,并具有以行和列排列的多个存储单元; 多个字线,其各自共同连接在同一行中排列的多个存储单元中的一个; 以及形成在半导体区域中以与存储单元阵列区域分离的保护二极管区域。 在保护二极管区域中,通过在半导体区域的上部形成的第二导电类型的第一扩散层与半导体区域之间形成接合来构成保护二极管元件。 每条字线延伸到保护二极管区,并与第二导电类型的第一扩散层直接连接,从而与保护二极管元件电连接。