专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06223429B1 Method of production of semiconductor device 失效
标题翻译：半导体器件的生产方法
公开(公告)号：US06223429B1
公开(公告)日：2001-05-01
申请号：US08981509
申请日：1998-07-30
申请人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
发明人： Aizou Kaneda , Masaaki Yasuda , Itsuo Watanabe , Tomohisa Ohta , Fumio Inoue , Yoshiaki Tsubomatsu , Toshio Yamazaki , Hiroto Ohata , Kenzo Takemura , Akira Nagai , Osamu Watanabe , Naoyuki Shiozawa , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
IPC分类号： H05K330
CPC分类号： H01L24/83 , H01L23/3121 , H01L23/49816 , H01L23/49883 , H01L24/29 , H01L24/32 , H01L24/97 , H01L25/18 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29384 , H01L2224/29444 , H01L2224/29469 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/8319 , H01L2224/838 , H01L2224/83951 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2924/00 , H01L2224/13111 , H01L2924/00014
摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
摘要翻译：为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

2. 发明授权

US06328844B1 Filmy adhesive for connecting circuits and circuit board 有权
标题翻译：用于连接电路和电路板的薄膜粘合剂
公开(公告)号：US06328844B1
公开(公告)日：2001-12-11
申请号：US09230017
申请日：1999-08-24
申请人： Itsuo Watanabe , Kenzo Takemura , Osamu Watanabe , Naoyuki Shiozawa , Akira Nagai , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
发明人： Itsuo Watanabe , Kenzo Takemura , Osamu Watanabe , Naoyuki Shiozawa , Akira Nagai , Kazuyoshi Kojima , Toshiaki Tanaka , Kazunori Yamamoto
IPC分类号： C09J16302
CPC分类号： H01L24/29 , C08L2666/02 , C09J163/00 , H01B1/22 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/45124 , H01L2224/45144 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , Y10T29/49128 , Y10T29/4913 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/48
摘要： A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40° C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.
摘要翻译：一种用于连接电路的热活性粘合剂，其用于通过加热和加压电极来将电路电极沿按压方向彼此面对地电连接。粘合剂在粘合后在40℃下的弹性模量为100-2000MPa。粘合剂可以含有至少一种环氧树脂，丙烯酸橡胶和潜在性固化剂。作为丙烯酸橡胶，优选使用缩水甘油醚基作为分子的丙烯酸橡胶。

3. 发明授权

US06184577B2 Electronic component parts device 有权
标题翻译：电子元器件
公开(公告)号：US06184577B2
公开(公告)日：2001-02-06
申请号：US09308525
申请日：1999-08-30
申请人： Kenzo Takemura , Itsuo Watanabe , Akira Nagai , Osamu Watanabe , Kazuyoshi Kojima , Akishi Nakaso , Kazunori Yamamoto , Yoshiyuki Tsuru , Teiichi Inada , Yasushi Shimada
发明人： Kenzo Takemura , Itsuo Watanabe , Akira Nagai , Osamu Watanabe , Kazuyoshi Kojima , Akishi Nakaso , Kazunori Yamamoto , Yoshiyuki Tsuru , Teiichi Inada , Yasushi Shimada
IPC分类号： H01L2363
CPC分类号： H05K1/0271 , H01L21/563 , H01L23/145 , H01L23/5383 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07811 , H01L2924/1301 , H01L2924/13034 , H05K3/323 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0133 , H05K2201/068 , H05K2201/10674 , H01L2924/00 , H01L2924/00014
摘要： In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.
摘要翻译：对于其上安装有半导体芯片的封装基板，双面覆铜玻璃环氧树脂层压片的表面铜箔进行电路形成和内层结合，然后将具有铜的环氧树脂粘合膜箔通过压力叠层结合到内层电路的表面，并且通过片形成通孔，接着进行无电镀铜，通过减法处理形成外层电路，并获得焊料涂层以获得封装基板。半导体芯片的凸起电极和封装基板通过粘合膜连接。

4. 发明授权

US10322572B2 Adhesive agent, adhesive material using the same, and method of use thereof 有权
公开(公告)号：US10322572B2
公开(公告)日：2019-06-18
申请号：US13445420
申请日：2012-04-12
申请人： Katsuyuki Masuda , Takehiro Fukuyama , Eiichi Shinada , Masashi Okoshi , Kazunori Yamamoto , Masatoshi Yamaguchi , Yasushi Ooyama , Yuuki Yanagita , Mitsuo Katayose
发明人： Katsuyuki Masuda , Takehiro Fukuyama , Eiichi Shinada , Masashi Okoshi , Kazunori Yamamoto , Masatoshi Yamaguchi , Yasushi Ooyama , Yuuki Yanagita , Mitsuo Katayose
IPC分类号： C09J177/06 , C09J179/08 , B32B43/00 , C08G69/26 , C08G69/40 , C08G73/14
摘要： An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; and (2) the condensation resin has a polyoxyalkanediyl group.

5. 发明授权

US08449828B2 Blower type chemical diffusing apparatus, and chemical cartridge and chemical impregnated body used therefor 有权
标题翻译：鼓风式化学扩散装置，用于其的化学药筒和化学浸渍体
公开(公告)号：US08449828B2
公开(公告)日：2013-05-28
申请号：US13010499
申请日：2011-01-20
申请人： Kazunori Yamamoto , Shinya Kawamura , Satoshi Yamasaki , Yasuharu Takei , Takao Jo
发明人： Kazunori Yamamoto , Shinya Kawamura , Satoshi Yamasaki , Yasuharu Takei , Takao Jo
IPC分类号： A62B7/08 , A24F25/00 , A61L9/04 , A01G27/00 , B05B3/08
CPC分类号： A61L9/042 , A01M1/2033 , A01M1/2055 , A61L9/122
摘要： A chemical cartridge for a blower-type chemical diffusing apparatus includes a chemical-impregnated body including an air-permeable and liquid-absorptive sheet impregnated with a chemical, and a retainer receptacle for containing the chemical-impregnated body. The retainer receptacle includes a liquid pool recess formed at a central area thereof such that liquid chemical stored in the liquid pool recess is permeable towards a peripheral area of the sheet.
摘要翻译：用于鼓风机型化学扩散装置的化学药筒包括浸渍有化学药剂的透气性和液体吸收性片材的化学浸渍体和用于容纳化学浸渍体的保持器容器。保持器容器包括在其中心区域处形成的液体池凹部，使得储存在液体池凹部中的液体化学药品朝向片材的周边区域是可渗透的。

6. 发明申请

US20100253821A1 Solid state imaging device, imaging apparatus, electronic apparatus, AD converter, and AD conversion method 有权
标题翻译：固态成像装置，成像装置，电子装置，AD转换器和AD转换方法
公开(公告)号：US20100253821A1
公开(公告)日：2010-10-07
申请号：US12659469
申请日：2010-03-10
申请人： Kazunori Yamamoto
发明人： Kazunori Yamamoto
IPC分类号： H04N5/335
CPC分类号： H04N5/378 , H03K4/02 , H03M1/123 , H03M1/56 , H04N5/3575 , H04N5/367 , H04N5/374
摘要： A solid state imaging device includes: an AD conversion section having a comparing section, which receives a reference signal from a predetermined reference signal generating section and which compares the reference signal with an analog signal to be processed, and a counter section, which receives a count clock for AD conversion and performs a count operation on the basis of a comparison result of the comparing section, and acquiring digital data of the signal on the basis of output data of the counter section; a count operation period control section controlling an operation period of the counter section on the basis of the comparison result; and a driving control section controlling the reference signal generating section and the AD conversion section such that for the signal to be processed, data of upper N−M bits is acquired in first processing and data of lower M bits is acquired in second processing.
摘要翻译：固态成像装置包括：AD转换部分，具有比较部分，其从预定参考信号产生部分接收参考信号，并将参考信号与待处理的模拟信号进行比较;以及计数器部分，其接收用于AD转换的计数时钟，并且基于比较部分的比较结果执行计数操作，并且基于计数器部分的输出数据获取信号的数字数据; 计数运算周期控制部，根据比较结果控制计数部的运算周期; 以及驱动控制部分，控制参考信号产生部分和AD转换部分，使得对于要处理的信号，在第一处理中获取上位N-M位的数据，并且在第二处理中获取较低M位的数据。

7. 发明申请

US20100233011A1 METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTICLE DISPERSED SLURRY USED THEREIN 审中-公开
标题翻译：形成铜线图案的方法和使用的铜氧化物颗粒分散浆料
公开(公告)号：US20100233011A1
公开(公告)日：2010-09-16
申请号：US12739228
申请日：2008-10-20
申请人： Hideo Nakako , Kazunori Yamamoto , Youichi Machii , Yasushi Kumashiro , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
发明人： Hideo Nakako , Kazunori Yamamoto , Youichi Machii , Yasushi Kumashiro , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
IPC分类号： B22F7/04 , B22F1/02 , B32B15/02
CPC分类号： H05K3/102 , H01B1/026 , H01B1/22 , H01L21/4867 , H01L23/49866 , H01L2924/0002 , H01L2924/09701 , H05K3/105 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , Y10T428/12181 , H01L2924/00
摘要： There are provided are a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained; and a copper oxide particle dispersed slurry used therein.The method is a method for forming a copper wiring pattern including the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.
摘要翻译：提供了一种方法，其中对现有技术中的铜颗粒进行抗氧化和分散是必需的表面处理剂几乎不被使用，但是导致电迁移少的材料和材料的价格率小的铜颗粒本身用于形成低电阻铜布线图案，同时抑制其中的裂纹的产生; 和其中使用的氧化铜颗粒分散浆料。该方法是一种形成铜布线图案的方法，包括使用其中分散有铜氧化物表面的铜基颗粒在基底上形成任何图案的分散浆料的步骤，以及还原铜的氧化铜表面的步骤以原子形式形成氢以将氧化物返回到铜，以及烧结通过还原并将颗粒彼此结合而产生的铜金属的颗粒。

8. 发明申请

US20090039114A1 Head Cap for Aerosol Type Atomizer 有权
标题翻译：气雾型雾化器头盖
公开(公告)号：US20090039114A1
公开(公告)日：2009-02-12
申请号：US11795905
申请日：2006-01-18
申请人： Kazunori Yamamoto , Shin Kanematsu , Satoshi Yamasaki
发明人： Kazunori Yamamoto , Shin Kanematsu , Satoshi Yamasaki
IPC分类号： B65D83/00
CPC分类号： B65D83/24 , B65D83/205 , B65D83/303
摘要： A head cap for an aerosol type atomizer is proposed in which a residual gas that remains in the container after the use of the aerosol type atomizer is ended are discharged easily and safely, and which is so structured that the aerosol type atomizer cannot be falsely operated while it is being used. It comprises a cap body mounted over a top of a container accommodating its contents, and a movable member for spray operation disposed inside of the cap body and having a fluid channel extending from a stem fitting part for fitting with a stem and leading to a spray port, the movable member for spray operation having a push button such that pushing down the push button to take a spray position sprays contents of the container from the spray port via the fluid channel, wherein the cap body has a side face elastically deformable so that when the push button of the movable member for spray operation is pushed down to take the spray position, pressing the side face of the cap body inwards locks the movable member for spray operation with the side face to hold the movable member for spray operation at the spray position.
摘要翻译：提出了一种用于气溶胶型雾化器的头盖，其中在使用气溶胶型雾化器之后残留在容器中的残留气体被容易且安全地排出，并且其结构使得气溶胶型雾化器不能被错误地操作而正在被使用。它包括安装在容纳其内容物的容器的顶部上的盖体，以及设置在盖体内部的用于喷射操作的可动构件，并且具有从杆配件部分延伸的流体通道，用于与杆配合并导致喷雾用于喷雾操作的可移动部件具有按钮，使得按下按钮以取得喷射位置，经由流体通道从喷雾口喷射容器的内容物，其中盖体具有可弹性变形的侧面，使得当用于喷射操作的可移动部件的按钮被按下以进行喷射位置时，将盖体的侧面向内侧按压侧面的可动部件进行喷雾操作，以将可动部件保持在喷雾操作状态喷雾位置。

9. 发明授权

US07436854B2 Transmitter device for controlling data transmission 有权
标题翻译：用于控制数据传输的发射器装置
公开(公告)号：US07436854B2
公开(公告)日：2008-10-14
申请号：US11040885
申请日：2005-01-21
申请人： Motoharu Miyake , Hiroshi Inamura , Kazunori Yamamoto , Hideharu Suzuki , Osamu Takahashi
发明人： Motoharu Miyake , Hiroshi Inamura , Kazunori Yamamoto , Hideharu Suzuki , Osamu Takahashi
IPC分类号： G06F15/16
CPC分类号： H04L69/16 , H04L1/1825 , H04L1/188 , H04L12/5692 , H04L47/10 , H04L47/14 , H04L47/193 , H04L47/283 , H04L69/163 , H04W24/00 , H04W80/06
摘要： A CPU 41 of a server device 40 measures an elapsed time after transmitting a data segment, and suspends measuring time upon receiving an acknowledgement segment for the data segment. CPU 41 transmits a data segment whose elapsed time has reached a retransmission timeout value. CPU 41 sets, as a retransmission timeout value of a data block, a time value determined according to a monotonically increasing function of a number of transmissions of the data block, during a given time period after the second-time transmission of the data block, while CPU 41 sets a time value which is predetermined and is different from the time value determined by the monotonically increasing function during a period between the first-time transmission and immediately before the second-time transmission of the data block.
摘要翻译：服务器装置40的CPU41测量发送数据段之后的经过时间，并且在接收到数据段的确认段时暂停测量时间。 CPU41发送经过时间达到重传超时值的数据段。作为数据块的重传超时值，CPU41在数据块的第二次发送之后的给定时间段内，设置根据数据块的传输次数的单调递增函数确定的时间值，而CPU41在第一次发送和数据块的第二次发送之间的时段期间设置预定的时间值并且与由单调增加功能确定的时间值不同。

10. 发明申请

US20080062875A1 Communication Terminal, Communication Control Method, and Communication Control Program 有权
标题翻译：通信终端，通信控制方法和通信控制程序
公开(公告)号：US20080062875A1
公开(公告)日：2008-03-13
申请号：US11851064
申请日：2007-09-06
申请人： Kenichi Yamazaki , Kazunori Yamamoto , Hideharu Suzuki , Ken Igarashi
发明人： Kenichi Yamazaki , Kazunori Yamamoto , Hideharu Suzuki , Ken Igarashi
IPC分类号： G08C15/00
CPC分类号： H04L1/187
摘要： Transmission of excess segments to a network can be effectively inhibited. A received byte calculation section 14 calculates, at a sending side, the number of bytes of segments which arrive at a receiving side within a period of a minimum value of RTT measured by a minimum time measurement section 13, a target calculation section 15 calculates a target used for controlling segment transmission based on the number of bytes of the received segments calculated by the received byte calculation section 14, and a send segment control section 16 which controls segment transmission based on the target calculated by the target calculation section 15.
摘要翻译：可以有效地抑制向网络传输多余的段。接收字节计算部分14在发送侧计算在由最小时间测量部分13测量的RTT的最小值的周期内到达接收侧的段的字节数，目标计算部分15计算基于由接收字节计算部分14计算的接收段的字节数用于控制段传输的目标;以及发送段控制部分16，其基于由目标计算部分15计算出的目标来控制段传输。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式