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1. 发明申请

US20120263946A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER 审中-公开
标题翻译：半导体器件，制造半导体器件的方法和具有粘合层的半导体器件
公开(公告)号：US20120263946A1
公开(公告)日：2012-10-18
申请号：US13509362
申请日：2010-11-10
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
IPC分类号： B32B7/12 , C09J7/02 , H01L21/50
CPC分类号： H01L24/27 , C08F220/30 , H01L21/565 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/27002 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83201 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/93 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , Y10T428/2809 , Y10T428/31935 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/27 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.
摘要翻译：本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。

2. 发明申请

US20110121435A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：光敏性粘合剂组合物，胶粘剂，粘合片，粘合剂图案，具有粘合层的半导体滤波器，半导体器件以及用于制造半导体器件的方法
公开(公告)号：US20110121435A1
公开(公告)日：2011-05-26
申请号：US12863068
申请日：2009-01-09
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： H01L25/00 , C08J3/28 , B32B3/30 , H01L21/50
CPC分类号： C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.
摘要翻译：一种感光性粘合剂组合物，其包含（A）具有羧基和/或羟基的树脂，（B）热固性树脂，（C）辐射聚合性化合物和（D）光引发剂，其中，3％组合物中的整个光引发剂混合物为200℃或更高。

3. 发明申请

US20090279394A1 DISC PROCESSING DEVICE AND CONTROL METHOD FOR DISC PROCESSING DEVICE 有权
标题翻译：盘加工装置及盘加工装置的控制方法
公开(公告)号：US20090279394A1
公开(公告)日：2009-11-12
申请号：US12437503
申请日：2009-05-07
申请人： Hidetoshi Maeshima , Toshihiko Yanagisawa , Junichi Otsuka , Takashi Kawamori
发明人： Hidetoshi Maeshima , Toshihiko Yanagisawa , Junichi Otsuka , Takashi Kawamori
IPC分类号： G11B17/22 , G11B7/28
CPC分类号： G11B19/10 , G11B7/28 , G11B17/08 , G11B17/225 , G11B17/228
摘要： The effect of detection errors when detecting if a disc recording medium is in a disc drive is eliminated. A control unit 17 detects if an optical disc 11 was supplied to an optical disc drive 13 based on the operation of the transportation unit 16, causes the optical disc drive 13 to detect if an optical disc 11 is inside the disc drive, and compares the results of these detection operations. If the results do not match, the control unit 17 causes the optical disc drive 13 to repeat the operation discharging and loading the optical disc 11, and causes the optical disc drive 13 to again detect if an optical disc 11 is present after the discharge and loading operation. The control unit 17 then determines if the new detection result from the optical disc drive 13 and the detection result related to supplying the optical disc 11 to the optical disc drive 13 match, and based on the result of this evaluation detects an optical disc drive 13 operating error.
摘要翻译：检测盘记录介质是否在盘驱动器中时的检测误差的影响被消除。控制单元17基于传送单元16的操作来检测是否将光盘11提供给光盘驱动器13，使得光盘驱动器13检测光盘11是否在盘驱动器内部，并将这些检测操作的结果。如果结果不匹配，则控制单元17使光盘驱动器13重复放电并加载光盘11的操作，并且使光盘驱动器13再次检测在放电之后是否存在光盘11，加载操作。然后，控制单元17确定来自光盘驱动器13的新检测结果和与将光盘11提供给光盘驱动器13相关的检测结果是否一致，并且基于该评估结果检测光盘驱动器13 操作错误。

4. 发明申请

US20080176167A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
标题翻译：感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件
公开(公告)号：US20080176167A1
公开(公告)日：2008-07-24
申请号：US11969358
申请日：2008-01-04
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/004 , G03F7/26
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

5. 发明申请

US20120202015A1 METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN 审中-公开
标题翻译：用于制造粘合体的方法，用粘合剂图案制造基材的方法和具有粘合剂图案的基材
公开(公告)号：US20120202015A1
公开(公告)日：2012-08-09
申请号：US13365311
申请日：2012-02-03
申请人： Aya IKEDA , Shinjiro Fujii , Takashi Kawamori , Takashi Masuko
发明人： Aya IKEDA , Shinjiro Fujii , Takashi Kawamori , Takashi Masuko
IPC分类号： B32B3/00 , B44C1/22
CPC分类号： C09J5/00 , C09J7/35 , C09J2201/28 , C09J2201/61 , C09J2479/086 , H01L21/6835 , H01L2924/10253 , Y10T428/24802
摘要： The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.
摘要翻译：根据本发明的粘合体的制造方法是通过粘合剂图案将第一被粘物和第二被粘物彼此接合的粘合体的制造方法，包括以下步骤：提供含有热固性第一被粘物上的成分; 在与第一被粘物接触的表面相对的粘合剂层的表面上设置在用于保护粘合剂层的预定部分的保护层不被蚀刻的状态下通过蚀刻粘合剂层来形成粘合剂图案的步骤 ; 以及在除去保护层之后将第二被粘物粘接到粘合剂图案的步骤。

7. 发明申请

US20110065260A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
公开(公告)号：US20110065260A1
公开(公告)日：2011-03-17
申请号：US12950398
申请日：2010-11-19
申请人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi KAWAMORI , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： H01L21/78 , B29C65/52
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

8. 发明申请

US20100143673A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：光敏胶粘剂组合物，薄膜粘合剂，粘合片，粘合剂图案，带粘合层的半导体滤波器，半导体器件和半导体器件制造方法
公开(公告)号：US20100143673A1
公开(公告)日：2010-06-10
申请号：US12594461
申请日：2008-03-19
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： G03F7/085 , B32B3/10
CPC分类号： C09J4/06 , C08G59/686 , C08L63/00 , C08L2666/22 , C09J11/06 , C09J163/00 , C09J179/08 , H01L23/24 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/09701 , H01L2924/15311 , Y10T428/24851 , H01L2924/00014 , H01L2924/00
摘要： The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation.
摘要翻译：本发明的感光性粘合剂组合物包含（A）碱溶性树脂，（B）环氧树脂，（C）可辐射聚合化合物和（D）光引发剂，其中（D）光引发剂至少含有（D1 ）光引发剂，其具有通过暴露于辐射促进环氧树脂的聚合和/或固化反应的功能。

9. 发明授权

US09309446B2 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device 有权
标题翻译：光敏粘合剂组合物，薄膜状粘合剂，粘合片，粘合剂图案，具有粘合剂层的半导体晶片，半导体器件
公开(公告)号：US09309446B2
公开(公告)日：2016-04-12
申请号：US13410702
申请日：2012-03-02
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： G03F7/00 , G03F7/004 , C09J7/02 , H01L23/00 , G03F7/027 , G03F7/037 , G03F7/038 , C08G73/10 , C09J179/08 , H01L21/683 , H01L25/065 , H01L23/29 , H01L23/31
CPC分类号： C09J7/0203 , C08G73/105 , C08L63/00 , C09J7/35 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/08 , G03F7/027 , G03F7/037 , G03F7/038 , H01L21/6836 , H01L23/293 , H01L23/3128 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/68377 , H01L2224/05554 , H01L2224/27002 , H01L2224/27416 , H01L2224/27436 , H01L2224/27622 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , Y10T428/24802 , Y10T428/2817 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
摘要翻译：本发明涉及一种感光性粘合剂组合物，其通过曝光和显影进行图案化后具有对粘合剂的热压粘合性，并且能够进行碱显影，其中在曝光和进一步热固化后110℃下的储能弹性模量不小于10 MPa。

10. 发明授权

US09247652B2 Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition 有权
标题翻译：粘合剂组合物，电子元件安装基板和使用粘合剂组合物的半导体器件
公开(公告)号：US09247652B2
公开(公告)日：2016-01-26
申请号：US12680923
申请日：2008-10-02
申请人： Kaoru Konno , Hiroki Hayashi , Takashi Kawamori
发明人： Kaoru Konno , Hiroki Hayashi , Takashi Kawamori
IPC分类号： B32B15/02 , H01B1/02 , H01B1/22 , H05K3/32 , B22F1/00 , B23K35/02 , B23K35/26 , B23K35/30 , B23K35/36 , B23K35/362 , B23K35/365 , C09J9/02 , C09J11/04 , H01L23/00 , C08K3/00 , C08K3/08 , H05K1/14
CPC分类号： H01L24/16 , B22F1/0059 , B22F2001/0066 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/302 , B23K35/3613 , B23K35/3618 , B23K35/362 , B23K35/365 , C08K3/017 , C08K3/08 , C09J9/02 , C09J11/04 , H01B1/22 , H01L24/12 , H01L2224/05568 , H01L2224/13099 , H01L2224/1329 , H01L2224/13347 , H01L2224/13439 , H01L2224/16 , H01L2224/16225 , H01L2224/16265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/15747 , H01L2924/19043 , H01L2924/20107 , H05K1/141 , H05K3/321 , H05K2201/0272 , H05K2203/0425 , Y10T428/31511 , Y10T428/31678 , H01L2924/00 , H01L2224/05599
摘要： There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).
摘要翻译：提供了一种粘合剂组合物，其保持储存稳定性，并进一步得到固化产物，其中在固化产物润湿其组分并令人满意地在组分（或部分）之间铺展的状态下形成金属粘合剂，由此转变粘合性能优异，导电性和安装的可靠性，如TCT电阻或耐高温电阻; 使用该基板的电子元件安装基板; 和半导体器件。粘合剂组合物包括导电颗粒（A）和粘合剂组分（B），其中导电颗粒（A）包括熔点等于或高于回流温度并且不含铅的金属（a1）和金属（a2），其熔点低于回流温度，不含铅，粘合剂成分（B）含有热固性树脂组合物（b1）和脂肪族二羟基羧酸（b2）。

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