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1. 发明授权

US07480888B1 Design structure for facilitating engineering changes in integrated circuits 失效
标题翻译：集成电路工程变更的设计结构
公开(公告)号：US07480888B1
公开(公告)日：2009-01-20
申请号：US12124771
申请日：2008-05-21
申请人： Clarence Rosser Ogilvie , Charles B. Winn , David Wills Milton , Kenneth Anthony Lauricella , Nitin Sharma , Paul Mark Schanely , Robert Dov Herzl , Robert Spencer Horton , Tad Jeffrey Wilder , Douglas P. Nadeau
发明人： Clarence Rosser Ogilvie , Charles B. Winn , David Wills Milton , Kenneth Anthony Lauricella , Nitin Sharma , Paul Mark Schanely , Robert Dov Herzl , Robert Spencer Horton , Tad Jeffrey Wilder , Douglas P. Nadeau
IPC分类号： G06F17/50
CPC分类号： G06F17/5054
摘要： A design structure embodied in a machine-readable medium is disclosed in one embodiment of the invention as including a flexible logic block to facilitate engineering changes at selected locations within an IC. The flexible logic block has a consistent and identifiable structure such that a simple automated process may be used to reconfigure the structure to perform different logical operations. In certain embodiments, the flexible logic block includes a circuit, such as a multiplexer, having multiple inputs and at least one output. A metal interconnect structure is coupled to the inputs and enables connection of each of the inputs to one of several electrical potentials using a focused-ion-beam (FIB) tool. In this way, the circuit may be configured to perform different logical operations after components in the IC exist in hardware.
摘要翻译：在本发明的一个实施例中公开了体现在机器可读介质中的设计结构，包括用于促进在IC内的选定位置进行工程变更的灵活逻辑块。灵活的逻辑块具有一致且可识别的结构，使得可以使用简单的自动化过程来重新配置结构以执行不同的逻辑操作。在某些实施例中，柔性逻辑块包括具有多个输入和至少一个输出的电路，例如多路复用器。金属互连结构耦合到输入端，并且能够使用聚焦离子束（FIB）工具将每个输入端连接到几个电势之一。以这种方式，电路可以被配置为在硬件中存在IC中的部件之后执行不同的逻辑操作。

2. 发明授权

US06300246B1 Method for chemical mechanical polishing of semiconductor wafer 失效
标题翻译：半导体晶片的化学机械抛光方法
公开(公告)号：US06300246B1
公开(公告)日：2001-10-09
申请号：US09718009
申请日：2000-11-21
申请人： Cuc K. Huynh , Paul A. Manfredi , Thomas J. Martin , Douglas P. Nadeau
发明人： Cuc K. Huynh , Paul A. Manfredi , Thomas J. Martin , Douglas P. Nadeau
IPC分类号： H01L21461
CPC分类号： H01L21/02052 , B24B37/042 , H01L21/30625
摘要： Semiconductor materials are prepared by CMP with a first rough polishing step using an acidic slurry followed by cleaning a the pad and wafer separately. After cleaning a second polishing step with a basic slurry is used which buffs the wafer. Finally the pad and wafer are rinsed while a low pressure is applied to complete the process.
摘要翻译：半导体材料通过CMP使用酸性浆料进行第一粗抛光步骤制备，然后分别清洗焊盘和晶片。在用基础浆料清洗第二抛光步骤之后，其使用抛光晶片。最后，在施加低压以冲洗该垫片和晶片以完成该过程。

3. 发明授权

US5778481A Silicon wafer cleaning and polishing pads 失效
标题翻译：硅晶片清洗和抛光垫
公开(公告)号：US5778481A
公开(公告)日：1998-07-14
申请号：US690284
申请日：1996-07-26
申请人： Michael R. Amsden , Richard A. Bartley , Cuc Huynh , Paul A. Manfredi , Douglas P. Nadeau
发明人： Michael R. Amsden , Richard A. Bartley , Cuc Huynh , Paul A. Manfredi , Douglas P. Nadeau
IPC分类号： B08B1/04 , B24B37/26 , H01L21/00 , B08B11/00
CPC分类号： B24B37/26 , B08B1/04 , H01L21/67028
摘要： Disc shaped cleaning/polishing pads are disclosed for use on a cleaning/polishing apparatus wherein the surface of the cleaning/polishing pad comprises resilient members arranged in patterns which will facilitate the movement of fluids (deoinized water, chemical slurry, etc.) from the center region of the pad to the periphery of the pad. Arrangement of the resilient members on the pads may be spiral, swirl, concentric or any other suitable pattern which will direct fluids to the periphery of the pad upon rotation of the pad.
摘要翻译：公开了用于清洁/抛光装置的盘形清洁/抛光垫，其中清洁/抛光垫的表面包括布置成图案的弹性构件，其将有利于流体（脱水的水，化学浆料等）的运动垫的中心区域到垫的周边。弹性构件在衬垫上的布置可以是螺旋形，漩涡形，同心或任何其它合适的图案，其在衬垫旋转时将流体引导到衬垫的周边。

4. 发明授权

US5894622A Brush conditioner wing 失效
标题翻译：刷子调理机翼
公开(公告)号：US5894622A
公开(公告)日：1999-04-20
申请号：US1733
申请日：1997-12-31
申请人： Paul A. Manfredi , Douglas P. Nadeau , Raymond G. Morris , Richard A. Bartley , Michael R. Amsden, deceased
发明人： Paul A. Manfredi , Douglas P. Nadeau , Raymond G. Morris , Richard A. Bartley , Michael R. Amsden, deceased
IPC分类号： B08B1/00 , B08B1/04 , H01L21/00 , B08B11/02
CPC分类号： H01L21/67046 , B08B1/00 , B08B1/007 , B08B1/04
摘要： A brush conditioner for a semiconductor wafer cleaning tool including a pair if opposed, rotating flexible brushes. The conditioner is a wing-like structure having a leading edge and a trailing edge. The leading edge is forced against the rotating brushes flexing them to assist in removal of foreign material. The trailing edge tapers to a point and provides stability to the wing.
摘要翻译：一种用于半导体晶片清洁工具的刷子调节器，包括一对相对的旋转柔性刷子。护发素是具有前缘和后缘的翼状结构。前缘被迫靠着旋转的刷子弯曲，以帮助去除异物。后缘逐渐变细，并为机翼提供稳定性。

5. 发明授权

US06432823B1 Off-concentric polishing system design 失效
标题翻译：非同心抛光系统设计
公开(公告)号：US06432823B1
公开(公告)日：2002-08-13
申请号：US09433681
申请日：1999-11-04
申请人： Cuc K. Huynh , Paul A. Manfredi , Thomas J. Martin , Douglas P. Nadeau , Yutong Wu
发明人： Cuc K. Huynh , Paul A. Manfredi , Thomas J. Martin , Douglas P. Nadeau , Yutong Wu
IPC分类号： H01L21302
CPC分类号： B24B37/042 , B24B27/0076
摘要： An apparatus and method of planarizing objects, particularly electronic components. The off-concentric polishing system of the present invention comprises at least two polishing platens positioned adjacent each other such that the polishing portions of the platens are substantially co-planar. At least one wafer carrier is moveably mounted over the at least two platens such that a wafer may be polished by more than one platen substantially simultaneously. The platen configurations may be in a linear or non-linear configuration such that the wafer being polished is no longer centrally disposed over a single platen but is off-concentrically positioned over multiple platens. The off-concentric positioning of the wafer provides enhanced slurry distribution and endpoint detection. The present invention reduces time and cost in manufacturing electronic components by engaging several polishing conditions simultaneously without the need for sequential polishing.
摘要翻译：平面化物体，特别是电子部件的装置和方法。本发明的非同心抛光系统包括至少两个彼此相邻定位的抛光台，使得压板的抛光部分基本上是共面的。至少一个晶片载体可移动地安装在所述至少两个压板上，使得晶片可以被多于一个压板基本上同时抛光。压板构造可以是线性或非线性构造，使得被抛光的晶片不再居中地设置在单个压板上，而是在多个压板上偏心地定位。晶片的非同心定位提供了增强的浆料分布和端点检测。本发明通过同时接合多个抛光条件来减少制造电子部件的时间和成本，而不需要顺序抛光。

6. 发明授权

US06287178B1 Wafer carrier rinsing mechanism 失效
标题翻译：晶圆载体清洗机构
公开(公告)号：US06287178B1
公开(公告)日：2001-09-11
申请号：US09357252
申请日：1999-07-20
申请人： Cuc Kim Huynh , Paul A. Manfredi , Thomas J. Martin , Douglas P. Nadeau , Joseph M. Weatherwax, Jr.
发明人： Cuc Kim Huynh , Paul A. Manfredi , Thomas J. Martin , Douglas P. Nadeau , Joseph M. Weatherwax, Jr.
IPC分类号： B24B5512
CPC分类号： H01L21/67051 , B08B3/02 , B24B37/34
摘要： A carrier rinse unit comprising a plurality of nozzles prepositioned to eject a cleaning fluid against a surface of a wafer while the wafer is rotated within a wafer carrier. The prepositioned nozzles may be angled to spray a leading edge, a trailing edge, an outer edge of the wafer, or any desired point on the surface of the wafer.
摘要翻译：一种载体漂洗单元，包括多个喷嘴，所述喷嘴被预定为当晶片在晶片载体内旋转时将清洁流体喷射到晶片表面。预定位的喷嘴可以成角度以喷射晶片的前缘，后缘，外边缘或晶片表面上的任何所需点。

7. 发明授权

US06273797B1 In-situ automated CMP wedge conditioner 失效
标题翻译：原位自动化CMP楔形调理剂
公开(公告)号：US06273797B1
公开(公告)日：2001-08-14
申请号：US09444285
申请日：1999-11-19
申请人： Kent R. Becker , Scott R. Cline , Paul A. Manfredi , Douglas P. Nadeau
发明人： Kent R. Becker , Scott R. Cline , Paul A. Manfredi , Douglas P. Nadeau
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B53/12
摘要： An apparatus and method of conditioning a CMP polishing pad to ensure consistent polishing throughout the polishing process. In particular, the apparatus consists of a translatable wedge-shaped conditioning plate, having a three point adjustable contact to ensure proper alignment with the polishing pad; a high pressure conditioning spray nozzle to clean the polishing pad and conditioning assembly throughout polishing; and a slurry dispensing nozzle to enhance planarization of the wafer. Further, the frequency of oscillation may be varied by the operator to prevent grooves from forming in the polishing pad.
摘要翻译：调整CMP抛光垫的装置和方法，以确保在整个抛光过程中一致的抛光。特别地，该装置由可平移的楔形调节板组成，具有三点可调接点以确保与抛光垫的正确对准; 高压调节喷嘴清洁抛光垫和调理组件，整个抛光; 以及浆料分配喷嘴，以增强晶片的平坦化。此外，振动频率可以由操作者改变，以防止在抛光垫中形成凹槽。

8. 发明授权

US5974868A Downstream monitor for CMP brush cleaners 失效
标题翻译： CMP洗刷机下游监视器
公开(公告)号：US5974868A
公开(公告)日：1999-11-02
申请号：US136835
申请日：1998-08-20
申请人： Donald M. Decain , Cuc K. Huynh , Robert A. Jurjevic , Douglas P. Nadeau , Marc A. Taubenblatt
发明人： Donald M. Decain , Cuc K. Huynh , Robert A. Jurjevic , Douglas P. Nadeau , Marc A. Taubenblatt
IPC分类号： B08B3/00 , G01N33/00 , H01L21/00 , B05C11/00 , B03D3/00 , G01N15/02
CPC分类号： H01L21/67253 , B08B3/00 , H01L21/67046 , G01N2033/0095
摘要： The present invention is a contamination measuring device and method of using the same according to a Chemical Mechanical Polishing (CMP) brush cleaner equipment/technology. A collection device is mounted in a brush cleaning device for collecting effluent which flows off of a wafer. The effluent is passed to a particle counter which measures the contamination levels of the effluent. A computer stores the data collected by the particle counter and computes the particles per liter of effluent and provides real time data. The contamination of the effluent corresponds to the contamination of the brushes in the cleaning device and therefore is means for predicting when the brushes in the cleaning device should be replaced.
摘要翻译：本发明是根据化学机械抛光（CMP）刷清洁器设备/技术的污染测量装置及其使用方法。收集装置安装在刷清洁装置中，用于收集从晶片流出的流出物。流出物被传递到测量流出物污染水平的颗粒计数器。计算机存储由颗粒计数器收集的数据，并计算每升流出物的颗粒数，并提供实时数据。流出物的污染物对应于清洁装置中的刷子的污染，因此是用于预测何时应该更换清洁装置中的刷子的装置。

9. 发明授权

US06647579B2 Brush pressure control system for chemical and mechanical treatment of semiconductor surfaces 失效
公开(公告)号：US06647579B2
公开(公告)日：2003-11-18
申请号：US09739152
申请日：2000-12-18
申请人： Paul A. Manfredi , Douglas P. Nadeau
发明人： Paul A. Manfredi , Douglas P. Nadeau
IPC分类号： A47L2500
CPC分类号： H01L21/67046 , B08B1/04 , Y10S134/902
摘要： A semiconductor wafer chemical mechanical treatment apparatus having a sectional extended arm carrying a head. The sectional arm is comprised of a fixed yoke and an elongated arm positioned in said yoke on a pivot. The elongated arm carries a first means thereon for establishing and maintaining a given loading or pressure on the head. A second means, is positioned on the yoke, adjacent to the elongated arm for temporarily altering the given loading or pressure on the head established by the first means without disturbing the setting of the first means such that when the second means is reset the given head load or pressure established by said first means is automatically restored.

10. 发明授权

US06247368B1 CMP wet application wafer sensor 失效
标题翻译： CMP湿式应用晶片传感器
公开(公告)号：US06247368B1
公开(公告)日：2001-06-19
申请号：US09225149
申请日：1999-01-04
申请人： Scott R. Cline , Willi O. Kalvaitis , Richard J. Lebel , Charles A. McKinney , Douglas P. Nadeau , Theodore G. van Kessel
发明人： Scott R. Cline , Willi O. Kalvaitis , Richard J. Lebel , Charles A. McKinney , Douglas P. Nadeau , Theodore G. van Kessel
IPC分类号： G01N2900
CPC分类号： H01L21/67265 , G01N29/11 , G01N29/28 , G01N29/40 , G01N2291/101 , H01L21/67259
摘要： A semiconductor post-polishing processing apparatus and method employing a non-optical wafer sensor for detecting the presence of a semiconductor wafer within the processing stations. The apparatus comprising a wet processing station, a wafer transport track, and the non-optical sensor. Preferably, the non-optical wafer sensor is a transducer, and most preferably, a piezo element, which emits and detects sound waves. The sound waves are reflected back to the emitter signaling the presence of a semiconductor wafer. The signal is sent to a receiver linked to a processor which is adapted to move a wafer holder situated at the end of the transport track to receive a wafer in the next available empty slot of the holder. The non-optical wafer sensor is impervious to slurry and CMP residue, film build-up, bubbles, wafer color/hue variations, and other wet environment problems.
摘要翻译：一种使用非光学晶片传感器来检测处理站内半导体晶片的存在的半导体后抛光处理装置和方法。该装置包括湿处理站，晶片传输轨道和非光学传感器。优选地，非光学晶片传感器是换能器，最优选地，发射和检测声波的压电元件。声波被反射回发射体，表明存在半导体晶片。信号被发送到连接到处理器的接收器，该处理器适于移动位于传送轨道的端部处的晶片保持器，以在保持器的下一个可用空槽中接收晶片。非光学晶片传感器不受浆料和CMP残留物，膜积聚，气泡，晶片颜色/色调变化和其他湿环境问题的影响。

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