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    • 74. 发明授权
    • Resist composition and pattern forming method using the same
    • 抗蚀剂组合物和图案形成方法使用其
    • US08092976B2
    • 2012-01-10
    • US11863562
    • 2007-09-28
    • Sou KamimuraKenji Wada
    • Sou KamimuraKenji Wada
    • G03F7/004G03F7/028G03F7/039
    • G03F7/0045G03F7/0392G03F7/0397Y10S430/12Y10S430/122
    • A resist composition containing: a polymer having a group capable of decomposing under an action of an acid and having a weight average molecular weight of from 1,000 to 5,000, of which solubility in an alkali developer increases under an action of an acid; and a compound capable of generating a compound having a structure represented by the following formula (A-I) upon irradiation with actinic rays or radiation: Q1-X1—NH—X2-Q2  (A-I) wherein Q1 and Q2 each independently represents a monovalent organic group, provided that either one of Q1 and Q2 has a proton acceptor functional group, Q1 and Q2 may be combined with each other to form a ring and the ring formed may have a proton acceptor functional group; and X1 and X2 each independently represents —CO— or —SO2—.
    • 一种抗蚀剂组合物,其含有具有能够在酸作用下分解的重均分子量为1,000〜5000的聚合物,其在碱性显影剂中的溶解度在酸的作用下增加; 以及能够在用光化射线或辐射照射时产生具有下式(AI)表示的结构的化合物的化合物:Q1-X1-NH-X2-Q2(AI)其中Q1和Q2各自独立地表示一价有机基团 条件是Q1和Q2中的任一个具有质子受体官能团,Q1和Q2可以彼此结合形成环,形成的环可以具有质子受体官能团; 且X 1和X 2各自独立地表示-CO-或-SO 2 - 。
    • 78. 发明授权
    • Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus
    • 多层结构形成方法,布线基板的制造方法以及电子设备的制造方法
    • US07723243B2
    • 2010-05-25
    • US11707022
    • 2007-02-16
    • Tsuyoshi ShintateToshiaki MikoshibaKenji WadaKazuaki SakuradaJun Yamada
    • Tsuyoshi ShintateToshiaki MikoshibaKenji WadaKazuaki SakuradaJun Yamada
    • H01L21/31
    • H05K3/4664H05K3/125H05K2203/013Y10S257/921
    • There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
    • 提供一种多层结构形成方法,包括:(A)在基板上形成含有第一光固化材料的第一绝缘材料层; (B)通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; (C)通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴,在半硬化的第一绝缘材料层上形成导电材料层; (D)形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和(E)形成第一绝缘层,位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层,导电材料层和覆盖第一绝缘层和导电层的第二绝缘层 第二绝缘材料层。