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    • 5. 发明授权
    • Positive resist composition
    • 正抗蚀剂组成
    • US07105273B2
    • 2006-09-12
    • US10634954
    • 2003-08-06
    • Shoichiro YasunamiHyou TakahashiKazuyoshi Mizutani
    • Shoichiro YasunamiHyou TakahashiKazuyoshi Mizutani
    • G03F7/04
    • G03F7/0045G03F7/0392G03F7/0397Y10S430/106Y10S430/111
    • A positive resist composition of the present invention achieving significant performance improvements in high energy-beam lithography, which comprises a phenolic polymer having a property of being insoluble or hardly soluble in an aqueous alkali solution and becoming soluble in an aqueous alkali solution by the action of an acid, in which the phenolic polymer includes a repeating unit containing at least one selected from the group consisting of an acetal-protected phenolic hydroxyl group, a ketal-protected phenolic hydroxyl group, a tertiary ester-protected carboxyl group and a tetrahydropyranyl-protected carboxyl group; and a compound having a phenacylsulfonium structure and capable of generating an acid upon irradiation with one of actinic rays and radiation.
    • 本发明的正型抗蚀剂组合物在高能束光刻中获得显着性能改进,其包括具有不溶性或几乎不溶于碱性水溶液的性质的酚醛聚合物,并且通过作用于碱性溶液 一种酸,其中酚类聚合物包括含有选自缩醛保护的酚羟基,缩酮保护的酚羟基,叔酯保护的羧基和四氢吡喃基保护的羧基中的至少一种的重复单元 羧基; 和具有苯甲酰甲基锍结构并能够在用光化射线和辐射之一照射时产生酸的化合物。