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1. 发明授权

US07250377B2 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
标题翻译：多层结构形成方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US07250377B2
公开(公告)日：2007-07-31
申请号：US11201100
申请日：2005-08-11
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/31
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
摘要翻译：提供一种多层结构形成方法，包括：（A）在基板上形成含有第一光固化材料的第一绝缘材料层; （B）通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; （C）通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴，在半硬化的第一绝缘材料层上形成导电材料层; （D）形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和（E）形成第一绝缘层，位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层，导电材料层和覆盖第一绝缘层和导电层的第二绝缘层第二绝缘材料层。

2. 发明申请

US20070141828A1 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
公开(公告)号：US20070141828A1
公开(公告)日：2007-06-21
申请号：US11707022
申请日：2007-02-16
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/4763
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.

3. 发明申请

US20060040489A1 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
标题翻译：多层结构形成方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US20060040489A1
公开(公告)日：2006-02-23
申请号：US11201100
申请日：2005-08-11
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/4763
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
摘要翻译：提供一种多层结构形成方法，包括：（A）在基板上形成含有第一光固化材料的第一绝缘材料层; （B）通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; （C）通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴，在半硬化的第一绝缘材料层上形成导电材料层; （D）形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和（E）形成第一绝缘层，位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层，导电材料层和覆盖第一绝缘层和导电层的第二绝缘层第二绝缘材料层。

4. 发明授权

US07723243B2 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
标题翻译：多层结构形成方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US07723243B2
公开(公告)日：2010-05-25
申请号：US11707022
申请日：2007-02-16
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/31
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
摘要翻译：提供一种多层结构形成方法，包括：（A）在基板上形成含有第一光固化材料的第一绝缘材料层; （B）通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; （C）通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴，在半硬化的第一绝缘材料层上形成导电材料层; （D）形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和（E）形成第一绝缘层，位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层，导电材料层和覆盖第一绝缘层和导电层的第二绝缘层第二绝缘材料层。

5. 发明授权

US08888229B2 Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate 有权
标题翻译：层的形成方法，有源矩阵基板的制造方法以及多层布线基板的制造方法
公开(公告)号：US08888229B2
公开(公告)日：2014-11-18
申请号：US11467295
申请日：2006-08-25
申请人： Tsuyoshi Shintate , Koichi Mizugaki , Kazuaki Sakurada , Kenji Wada
发明人： Tsuyoshi Shintate , Koichi Mizugaki , Kazuaki Sakurada , Kenji Wada
IPC分类号： B05D7/00 , H01L21/768 , H05K3/12 , H01L27/12 , H01L21/288 , G02F1/1362 , G02F1/1337
CPC分类号： H05K3/125 , G02F1/133711 , G02F2001/136295 , H01L21/288 , H01L21/76838 , H01L27/1214 , H01L27/1292 , H05K2203/013 , H05K2203/095 , H05K2203/1173 , H05K2203/1476
摘要： A method for forming a layer comprises (a) disposing a first droplet to two parts on an underlayer surface so as to form two dot patterns isolated each other on the underlayer surface, (b) fixing the two dot patterns to the underlayer surface, (c) giving lyophilicity with respect to a second droplet to at least the underlayer surface between the two dot patterns, and (d) disposing the second droplet to the underlayer surface between the two dot patterns so as to join the two dot patterns after the step (c).
摘要翻译：一种形成层的方法包括：（a）将第一液滴设置在下层表面上的两个部分上，以在底层表面上形成彼此隔离的两个点图案，（b）将两个点图案固定到底层表面上（ c）将相对于第二液滴的亲液性提供给至少两个点图案之间的底层表面，和（d）将第二液滴设置在两个点图案之间的底层表面上，以便在步骤之后连接两个点图案（C）。

6. 发明申请

US20060292769A1 MULTILAYERED STRUCTURE FORMING METHOD 审中-公开
标题翻译：多层结构形成方法
公开(公告)号：US20060292769A1
公开(公告)日：2006-12-28
申请号：US11425762
申请日：2006-06-22
申请人： Kenji Wada , Tsuyoshi Shintate
发明人： Kenji Wada , Tsuyoshi Shintate
IPC分类号： H01L21/338
CPC分类号： H05K3/4664 , B41M3/006 , B41M3/008 , H05K3/125 , H05K3/4647 , H05K2201/09781 , H05K2201/09881 , H05K2203/013 , H05K2203/1476
摘要： A multilayered structure forming method includes disposing a dummy post on a first insulating pattern as a first inkjet process, disposing a second insulating pattern on the first insulating pattern as a second inkjet process so as to allow the second insulating pattern to surround a side surface of the dummy post, and disposing a first conductive pattern on the second insulating pattern a third inkjet process so as to connect the first conductive pattern to the dummy post. In this method, the first inkjet process includes a process for ejecting a functional liquid containing a first conductive material having high adhesiveness to the first conductive pattern onto the first insulating pattern.
摘要翻译：多层结构形成方法包括将第一绝缘图案上的虚拟柱设置为第一喷墨处理，将第二绝缘图案设置在第一绝缘图案上作为第二喷墨处理，以使第二绝缘图案包围第二绝缘图案的侧表面所述虚拟柱，并且在所述第二绝缘图案上设置第一导电图案以进行第三喷墨处理，以将所述第一导电图案连接到所述虚拟柱。在该方法中，第一喷墨处理包括将含有第一导电图案的具有高粘附性的第一导电材料的功能液喷射到第一绝缘图案上的处理。

7. 发明授权

US08404427B2 Photosensitive composition, and pattern-forming method and resist film using the photosensitive composition 有权
标题翻译：光敏组合物，图案形成方法和使用光敏组合物的抗蚀剂膜
公开(公告)号：US08404427B2
公开(公告)日：2013-03-26
申请号：US12786127
申请日：2010-05-24
申请人： Kenji Wada , Kunihiko Kodama
发明人： Kenji Wada , Kunihiko Kodama
IPC分类号： G03F7/028 , G03F7/039 , G03F7/26
CPC分类号： C07D307/33 , C07C381/12 , C07D307/20 , C07D307/32 , C07D307/77 , C07D309/30 , C07D409/12 , C07D409/14 , C07D493/08 , C07D493/14 , G03F7/0045 , G03F7/0046 , G03F7/0382 , G03F7/0392 , G03F7/0395 , G03F7/0397 , G03F7/0758
摘要： A photosensitive composition containing a compound having a specific structure, a pattern-forming method using the photosensitive composition, and a compound having a specific structure used in the photosensitive composition.
摘要翻译：含有具有特定结构的化合物的光敏组合物，使用该感光性组合物的图案形成方法和在感光性组合物中使用的具有特定结构的化合物。

8. 发明授权

US08241840B2 Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method 有权
标题翻译：图案形成方法，图案形成方法中使用的抗蚀剂组合物，图案形成方法中使用的负显影液和用于图案形成方法的负显影用漂洗溶液
公开(公告)号：US08241840B2
公开(公告)日：2012-08-14
申请号：US12825088
申请日：2010-06-28
申请人： Hideaki Tsubaki , Shinji Tarutani , Kazuyoshi Mizuyoshi , Kenji Wada , Wataru Hoshino
发明人： Hideaki Tsubaki , Shinji Tarutani , Kazuyoshi Mizuyoshi , Kenji Wada , Wataru Hoshino
IPC分类号： G03F7/30 , G03F7/004
CPC分类号： G03F7/0397 , G03F7/325 , Y10S430/106 , Y10S430/111
摘要： A pattern forming method includes (a) coating a substrate with a resist composition including a resin that includes a repeating unit represented by a following general formula (NGH-1), and, by the action of an acid, increases the polarity and decreases the solubility in a negative developing solution; (b) exposing; and (d) developing with a negative developing solution: wherein RNGH1 represents a hydrogen atom or an alkyl group; and RNGH2 to RNGH4 each independently represents a hydrogen atom or a hydroxyl group, provided that at least one of RNGH2 to RNGH4 represents a hydroxyl group.
摘要翻译：图案形成方法包括：（a）用包含由以下通式（NGH-1）表示的重复单元的树脂的抗蚀剂组合物涂布基材，并且通过酸的作用增加极性，并降低在负显影液中的溶解度; （b）曝光; 和（d）用负显影液显影：其中RNGH1表示氢原子或烷基; 并且RNGH 2至RNGH 4各自独立地表示氢原子或羟基，条件是RNGH 2至RNGH 4中的至少一个表示羟基。

9. 发明授权

US08110333B2 Resist composition containing novel sulfonium compound, pattern-forming method using the resist composition, and novel sulfonium compound 有权
标题翻译：含有新型锍化合物的抗蚀剂组合物，使用抗蚀剂组合物的图案形成方法和新型锍化合物
公开(公告)号：US08110333B2
公开(公告)日：2012-02-07
申请号：US12184780
申请日：2008-08-01
申请人： Sou Kamimura , Yasutomo Kawanishi , Kenji Wada , Tomotaka Tsuchimura
发明人： Sou Kamimura , Yasutomo Kawanishi , Kenji Wada , Tomotaka Tsuchimura
IPC分类号： G03F7/004 , G03F7/30
CPC分类号： G03F7/0397 , G03F7/0045 , Y10S430/106
摘要： A resist composition includes (A) a compound represented by the following formula (I): wherein each of R1 to R13 independently represents a hydrogen atom or a substituent, provided that at least one of R1 to R13 is a substituent containing an alcoholic hydroxyl group; Z represents a single bond or a divalent linking group; and X− represents an anion containing a proton acceptor functional group.
摘要翻译：抗蚀剂组合物包括（A）由下式（I）表示的化合物：其中R 1至R 13各自独立地表示氢原子或取代基，条件是R 1至R 13中的至少一个为含有醇羟基的取代基 ; Z表示单键或二价连接基团; X表示含有质子受体官能团的阴离子。

10. 发明授权

US08088550B2 Positive resist composition and pattern forming method 失效
标题翻译：正抗蚀剂组成和图案形成方法
公开(公告)号：US08088550B2
公开(公告)日：2012-01-03
申请号：US12181757
申请日：2008-07-29
申请人： Shinji Tarutani , Hideaki Tsubaki , Kenji Wada
发明人： Shinji Tarutani , Hideaki Tsubaki , Kenji Wada
IPC分类号： G03F7/004 , G03F7/30
CPC分类号： G03F7/0397 , G03F7/0045 , G03F7/0392 , G03F7/2022 , G03F7/2041 , Y10S430/111
摘要： A positive resist composition, includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid; (C) a compound capable of decomposing under an action of an acid to generate an acid; and (D) a compound which itself acts as a base for the acids generated from the component (A) and the component (C) but decomposes upon irradiation with actinic rays or radiation to lose a basicity for the acids generated from the component (A) and the component (C).
摘要翻译：正型抗蚀剂组合物包括：（A）在用光化射线或辐射照射时能够产生酸的化合物; （B）在碱性显影剂中的溶解度在酸的作用下增加的树脂; （C）能够在酸的作用下分解以产生酸的化合物; 和（D）本身作为由组分（A）和组分（C）产生的酸的碱的化合物，但是在用光化射线或辐射照射时分解，以失去由组分（A）产生的酸的碱度）和组分（C）。

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