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    • 59. 发明申请
    • Method of estimating substrate temperature
    • 基板温度估算方法
    • US20060126701A1
    • 2006-06-15
    • US10691500
    • 2003-10-24
    • Katsuya NozawaTohru SaitohTeruhito Ohnishi
    • Katsuya NozawaTohru SaitohTeruhito Ohnishi
    • G01K13/00
    • G01K11/02Y10S438/933
    • A method of estimating substrate temperature according to this invention includes the steps of epitaxially growing a Si-containing layer (103) on a SiGe layer (102) formed on a substrate for temperature estimation (101) constituted of a Si substrate under a reaction control condition; finding a relationship between a rate of growth of the Si-containing layer and a substrate temperature of the substrate for temperature estimation; epitaxially growing a Si-containing layer on a substrate for device fabrication as a subject of substrate temperature estimation under a reaction control condition; and estimating a substrate temperature of the substrate for device fabrication based on the rate of growth of the latter Si-containing layer and the relationship between the rate of growth of the former Si-containing layer (103) and the substrate temperature of the substrate for temperature estimation.
    • 根据本发明的估计衬底温度的方法包括以下步骤:在反应控制下由Si衬底构成的用于温度估计的衬底上形成的SiGe层(102)上外延生长含Si层(103) 条件; 发现含Si层的生长速率与用于温度估计的衬底的衬底温度之间的关系; 在用于器件制造的衬底上外延生长含Si层,作为在反应控制条件下的衬底温度估计的对象; 以及基于后面的含Si层的生长速率和前述含Si层(103)的生长速度与衬底的衬底温度之间的关系,估计用于器件制造的衬底的衬底温度 温度估计。