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    • 51. 发明申请
    • Electronic data memory device for a high read current
    • 用于高读取电流的电子数据存储器件
    • US20060022248A1
    • 2006-02-02
    • US11167386
    • 2005-06-27
    • Bjorn FischerFranz HofmannRichard LuykenAndreas Spitzer
    • Bjorn FischerFranz HofmannRichard LuykenAndreas Spitzer
    • H01L27/108
    • H01L27/10873H01L29/7851
    • Electronic data memory device for a high read current The invention provides a memory device arranged on a substrate (401) and having at least one memory cell (100) The memory cell comprises a storage capacitor (200) for storing an electrical charge and a selection transistor (300) for selecting the memory cell (100). The selection transistor comprises a first conduction electrode (301), a second conduction electrode (302) and a control electrode (303) , the control electrode (303) being provided by a gate unit (400) having a fin (405) projecting from the substrate (401), which fin is surrounded by a gate oxide layer (406) and a gate electrode layer (403) in such a way that first and second gate elements (408a, 408b) are provided at opposite lateral areas of the fin (405), a third gate element (408c) being provided at an area of the fin (405) that is parallel to the surface of the substrate (401).
    • 用于高读取电流的电子数据存储器件本发明提供一种布置在衬底(401)上并具有至少一个存储单元(100)的存储器件。存储单元包括用于存储电荷的存储电容器(200) 晶体管(300),用于选择存储单元(100)。 选择晶体管包括第一导电电极(301),第二导电电极(302)和控制电极(303),控制电极(303)由栅极单元(400)提供,栅极单元(400)具有从 基板(401),其被栅极氧化物层(406)和栅极电极层(403)包围,使得第一和第二栅极元件(408a,408b)设置在第一和第二栅极元件(408a,408b)的相对侧向区域 所述翅片(405),第三栅极元件(408c)设置在所述鳍状物(405)的与所述基板(401)的表面平行的区域。
    • 55. 发明申请
    • Semiconductor memory with vertical memory transistors and method for fabricating it
    • 具有垂直存储晶体管的半导体存储器及其制造方法
    • US20050199942A1
    • 2005-09-15
    • US11073205
    • 2005-03-05
    • Franz HofmannErhard LandgrafRichard LuykenThomas SchulzMichael Specht
    • Franz HofmannErhard LandgrafRichard LuykenThomas SchulzMichael Specht
    • H01L21/28H01L21/336H01L29/423H01L29/792
    • H01L21/28282H01L29/66833H01L29/792H01L29/7923H01L29/7926
    • The invention relates to a semiconductor memory having a multiplicity of memory cells and a method for forming the memory cells. The semiconductor memory generally includes a semiconductor layer arranged on a substrate surface that includes a normally positioned step between a deeper region and a higher region. The semiconductor memory further includes doped contact regions, channel regions, a trapping layer arranged on a gate oxide layer, and at least one gate electrode. The method for forming the memory cells includes patterning a semiconductor layer to form a deeper semiconductor region and a higher semiconductor region having a step positioned between the regions. The method further includes forming a first oxide layer and a trapping layer, and then removing portions of the trapping layer and the first oxide layer and applying a second oxide layer at least regions of a doped region, the trapping layer, and the step area, and applying a gate electrode to the second oxide layer and doping, at least in regions, of the deeper semiconductor region and the higher semiconductor region to form a deeper contact region and a higher contact region.
    • 本发明涉及具有多个存储单元的半导体存储器和用于形成存储单元的方法。 半导体存储器通常包括布置在衬底表面上的半导体层,其包括较深区域和较高区域之间的正常定位的台阶。 半导体存储器还包括掺杂接触区域,沟道区域,布置在栅极氧化物层上的俘获层和至少一个栅电极。 形成存储单元的方法包括图案化半导体层以形成较深的半导体区域和具有位于该区域之间的台阶的较高半导体区域。 该方法还包括形成第一氧化物层和俘获层,然后去除俘获层和第一氧化物层的部分,并且至少在掺杂区域,俘获层和台阶区域的区域上施加第二氧化物层, 以及向所述第二氧化物层施加栅电极,并且至少在所述较深半导体区域和所述较高半导体区域的区域中掺杂以形成更深的接触区域和更高的接触区域。
    • 58. 发明申请
    • Fabrication method for memory cell
    • 存储单元制造方法
    • US20050032311A1
    • 2005-02-10
    • US10899436
    • 2004-07-26
    • Franz HofmannErhard LandgrafHannes Luyken
    • Franz HofmannErhard LandgrafHannes Luyken
    • H01L21/8247H01L21/28H01L21/336H01L21/8246H01L27/115H01L29/423H01L29/788H01L29/792
    • H01L27/11568H01L21/28282H01L27/115H01L29/66833H01L29/792
    • Method of fabricating a memory cell, in which a storage layer, which is designed for programming by charge carrier trapping, and a gate electrode, which is electrically insulated from a semiconductor material, are fabricated at a top side of a semiconductor body or a semiconductor layer structure above a channel region provided between doped source-drain regions. The method includes the steps of fabricating at least one trench in the top side, providing at least portions of the trench walls which adjoin the source-drain regions to be fabricated with the storage layer, depositing a material provided for the gate electrode into the trench, forming the source-drain regions by covering the gate electrode, removing, on both sides of the trench, the semiconductor material down to an intended depth, and implanting dopant, and applying an insulation layer to the source-drain region, and fabricating an electrical connection for the gate electrode.
    • 制造存储单元的方法,其中设计用于通过电荷载流子捕获进行编程的存储层和与半导体材料电绝缘的栅电极制造在半导体本体或半导体的顶侧 在设置在掺杂源极 - 漏极区之间的沟道区域之上的层结构。 该方法包括以下步骤:在顶侧制造至少一个沟槽,提供沟槽壁的至少部分,其邻接待制造的源极 - 漏极区域与存储层,将为栅电极提供的材料沉积到沟槽 通过覆盖栅极电极形成源极 - 漏极区域,在沟槽的两侧将半导体材料去除到预期深度,并且注入掺杂剂,并且向源极 - 漏极区域施加绝缘层,并且制造 栅电极的电连接。
    • 59. 发明授权
    • Integrated circuit with vertical transistors
    • 集成电路与垂直晶体管
    • US06750095B1
    • 2004-06-15
    • US09787966
    • 2001-05-29
    • Emmerich BertagnollFranz HofmannBernd GoebelWolfgang Roesner
    • Emmerich BertagnollFranz HofmannBernd GoebelWolfgang Roesner
    • H01L218242
    • H01L27/10876H01L27/1052H01L27/10823H01L27/112H01L27/11273
    • A method of producing an integrated circuit having a vertical MOS transistor includes doping a substrate to form a layer adjacent to its surface and forming a lower doped layer serving as the transistor's first source/drain region. The transistor's channel region is formed by doping a central layer above the lower layer. A second source/drain region is formed by doping an upper layer above the central layer. The upper, central and lower layers form a layer sequence having opposed first and second faces. A connecting structure is formed on the first face to electrically connect the channel region and the substrate. The connecting structure laterally adjoins at least the central layer and the lower layer, and extends into the substrate. A gate dielectric and adjacent gate electrode are formed on the second face.
    • 制造具有垂直MOS晶体管的集成电路的方法包括:掺杂衬底以形成与其表面相邻的层,并形成用作晶体管的第一源极/漏极区的下掺杂层。 晶体管的沟道区域通过在下层上掺杂中心层而形成。 通过在中心层上方掺杂上层形成第二源/漏区。 上层,中层和下层形成具有相对的第一和第二面的层序列。 在第一面上形成连接结构,以电连接沟道区和衬底。 连接结构至少横向邻接中心层和下层,并延伸到基底中。 在第二面上形成栅电介质和相邻栅电极。