会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • Fabrication method for memory cell
    • 存储单元制造方法
    • US20050032311A1
    • 2005-02-10
    • US10899436
    • 2004-07-26
    • Franz HofmannErhard LandgrafHannes Luyken
    • Franz HofmannErhard LandgrafHannes Luyken
    • H01L21/8247H01L21/28H01L21/336H01L21/8246H01L27/115H01L29/423H01L29/788H01L29/792
    • H01L27/11568H01L21/28282H01L27/115H01L29/66833H01L29/792
    • Method of fabricating a memory cell, in which a storage layer, which is designed for programming by charge carrier trapping, and a gate electrode, which is electrically insulated from a semiconductor material, are fabricated at a top side of a semiconductor body or a semiconductor layer structure above a channel region provided between doped source-drain regions. The method includes the steps of fabricating at least one trench in the top side, providing at least portions of the trench walls which adjoin the source-drain regions to be fabricated with the storage layer, depositing a material provided for the gate electrode into the trench, forming the source-drain regions by covering the gate electrode, removing, on both sides of the trench, the semiconductor material down to an intended depth, and implanting dopant, and applying an insulation layer to the source-drain region, and fabricating an electrical connection for the gate electrode.
    • 制造存储单元的方法,其中设计用于通过电荷载流子捕获进行编程的存储层和与半导体材料电绝缘的栅电极制造在半导体本体或半导体的顶侧 在设置在掺杂源极 - 漏极区之间的沟道区域之上的层结构。 该方法包括以下步骤:在顶侧制造至少一个沟槽,提供沟槽壁的至少部分,其邻接待制造的源极 - 漏极区域与存储层,将为栅电极提供的材料沉积到沟槽 通过覆盖栅极电极形成源极 - 漏极区域,在沟槽的两侧将半导体材料去除到预期深度,并且注入掺杂剂,并且向源极 - 漏极区域施加绝缘层,并且制造 栅电极的电连接。
    • 2. 发明授权
    • Fabrication method for memory cell
    • 存储单元制造方法
    • US06982202B2
    • 2006-01-03
    • US10899436
    • 2004-07-26
    • Franz HofmannErhard LandgrafHannes Luyken
    • Franz HofmannErhard LandgrafHannes Luyken
    • H01L21/336
    • H01L27/11568H01L21/28282H01L27/115H01L29/66833H01L29/792
    • Method of fabricating a memory cell, in which a storage layer, which is designed for programming by charge carrier trapping, and a gate electrode, which is electrically insulated from a semiconductor material, are fabricated at a top side of a semiconductor body or a semiconductor layer structure above a channel region provided between doped source-drain regions. The method includes the steps of fabricating at least one trench in the top side, providing at least portions of the trench walls which adjoin the source-drain regions to be fabricated with the storage layer, depositing a material provided for the gate electrode into the trench, forming the source-drain regions by covering the gate electrode, removing, on both sides of the trench, the semiconductor material down to an intended depth, and implanting dopant, and applying an insulation layer to the source-drain region, and fabricating an electrical connection for the gate electrode.
    • 制造存储单元的方法,其中设计用于通过电荷载流子捕获进行编程的存储层和与半导体材料电绝缘的栅电极制造在半导体本体或半导体的顶侧 在设置在掺杂源极 - 漏极区之间的沟道区域之上的层结构。 该方法包括以下步骤:在顶侧制造至少一个沟槽,提供沟槽壁的至少部分,其邻接待制造的源极 - 漏极区域与存储层,将为栅电极提供的材料沉积到沟槽 通过覆盖栅极电极形成源极 - 漏极区域,在沟槽的两侧将半导体材料去除到预期深度,并且注入掺杂剂,并且向源极 - 漏极区域施加绝缘层,并且制造 栅电极的电连接。
    • 4. 发明申请
    • Semiconductor memory with vertical memory transistors and method for fabricating it
    • 具有垂直存储晶体管的半导体存储器及其制造方法
    • US20050199942A1
    • 2005-09-15
    • US11073205
    • 2005-03-05
    • Franz HofmannErhard LandgrafRichard LuykenThomas SchulzMichael Specht
    • Franz HofmannErhard LandgrafRichard LuykenThomas SchulzMichael Specht
    • H01L21/28H01L21/336H01L29/423H01L29/792
    • H01L21/28282H01L29/66833H01L29/792H01L29/7923H01L29/7926
    • The invention relates to a semiconductor memory having a multiplicity of memory cells and a method for forming the memory cells. The semiconductor memory generally includes a semiconductor layer arranged on a substrate surface that includes a normally positioned step between a deeper region and a higher region. The semiconductor memory further includes doped contact regions, channel regions, a trapping layer arranged on a gate oxide layer, and at least one gate electrode. The method for forming the memory cells includes patterning a semiconductor layer to form a deeper semiconductor region and a higher semiconductor region having a step positioned between the regions. The method further includes forming a first oxide layer and a trapping layer, and then removing portions of the trapping layer and the first oxide layer and applying a second oxide layer at least regions of a doped region, the trapping layer, and the step area, and applying a gate electrode to the second oxide layer and doping, at least in regions, of the deeper semiconductor region and the higher semiconductor region to form a deeper contact region and a higher contact region.
    • 本发明涉及具有多个存储单元的半导体存储器和用于形成存储单元的方法。 半导体存储器通常包括布置在衬底表面上的半导体层,其包括较深区域和较高区域之间的正常定位的台阶。 半导体存储器还包括掺杂接触区域,沟道区域,布置在栅极氧化物层上的俘获层和至少一个栅电极。 形成存储单元的方法包括图案化半导体层以形成较深的半导体区域和具有位于该区域之间的台阶的较高半导体区域。 该方法还包括形成第一氧化物层和俘获层,然后去除俘获层和第一氧化物层的部分,并且至少在掺杂区域,俘获层和台阶区域的区域上施加第二氧化物层, 以及向所述第二氧化物层施加栅电极,并且至少在所述较深半导体区域和所述较高半导体区域的区域中掺杂以形成更深的接触区域和更高的接触区域。