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    • 1. 发明申请
    • Fabrication method for memory cell
    • 存储单元制造方法
    • US20050032311A1
    • 2005-02-10
    • US10899436
    • 2004-07-26
    • Franz HofmannErhard LandgrafHannes Luyken
    • Franz HofmannErhard LandgrafHannes Luyken
    • H01L21/8247H01L21/28H01L21/336H01L21/8246H01L27/115H01L29/423H01L29/788H01L29/792
    • H01L27/11568H01L21/28282H01L27/115H01L29/66833H01L29/792
    • Method of fabricating a memory cell, in which a storage layer, which is designed for programming by charge carrier trapping, and a gate electrode, which is electrically insulated from a semiconductor material, are fabricated at a top side of a semiconductor body or a semiconductor layer structure above a channel region provided between doped source-drain regions. The method includes the steps of fabricating at least one trench in the top side, providing at least portions of the trench walls which adjoin the source-drain regions to be fabricated with the storage layer, depositing a material provided for the gate electrode into the trench, forming the source-drain regions by covering the gate electrode, removing, on both sides of the trench, the semiconductor material down to an intended depth, and implanting dopant, and applying an insulation layer to the source-drain region, and fabricating an electrical connection for the gate electrode.
    • 制造存储单元的方法,其中设计用于通过电荷载流子捕获进行编程的存储层和与半导体材料电绝缘的栅电极制造在半导体本体或半导体的顶侧 在设置在掺杂源极 - 漏极区之间的沟道区域之上的层结构。 该方法包括以下步骤:在顶侧制造至少一个沟槽,提供沟槽壁的至少部分,其邻接待制造的源极 - 漏极区域与存储层,将为栅电极提供的材料沉积到沟槽 通过覆盖栅极电极形成源极 - 漏极区域,在沟槽的两侧将半导体材料去除到预期深度,并且注入掺杂剂,并且向源极 - 漏极区域施加绝缘层,并且制造 栅电极的电连接。
    • 2. 发明授权
    • Fabrication method for memory cell
    • 存储单元制造方法
    • US06982202B2
    • 2006-01-03
    • US10899436
    • 2004-07-26
    • Franz HofmannErhard LandgrafHannes Luyken
    • Franz HofmannErhard LandgrafHannes Luyken
    • H01L21/336
    • H01L27/11568H01L21/28282H01L27/115H01L29/66833H01L29/792
    • Method of fabricating a memory cell, in which a storage layer, which is designed for programming by charge carrier trapping, and a gate electrode, which is electrically insulated from a semiconductor material, are fabricated at a top side of a semiconductor body or a semiconductor layer structure above a channel region provided between doped source-drain regions. The method includes the steps of fabricating at least one trench in the top side, providing at least portions of the trench walls which adjoin the source-drain regions to be fabricated with the storage layer, depositing a material provided for the gate electrode into the trench, forming the source-drain regions by covering the gate electrode, removing, on both sides of the trench, the semiconductor material down to an intended depth, and implanting dopant, and applying an insulation layer to the source-drain region, and fabricating an electrical connection for the gate electrode.
    • 制造存储单元的方法,其中设计用于通过电荷载流子捕获进行编程的存储层和与半导体材料电绝缘的栅电极制造在半导体本体或半导体的顶侧 在设置在掺杂源极 - 漏极区之间的沟道区域之上的层结构。 该方法包括以下步骤:在顶侧制造至少一个沟槽,提供沟槽壁的至少部分,其邻接待制造的源极 - 漏极区域与存储层,将为栅电极提供的材料沉积到沟槽 通过覆盖栅极电极形成源极 - 漏极区域,在沟槽的两侧将半导体材料去除到预期深度,并且注入掺杂剂,并且向源极 - 漏极区域施加绝缘层,并且制造 栅电极的电连接。