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    • 1. 发明申请
    • Electronic data memory device for a high read current
    • 用于高读取电流的电子数据存储器件
    • US20060022248A1
    • 2006-02-02
    • US11167386
    • 2005-06-27
    • Bjorn FischerFranz HofmannRichard LuykenAndreas Spitzer
    • Bjorn FischerFranz HofmannRichard LuykenAndreas Spitzer
    • H01L27/108
    • H01L27/10873H01L29/7851
    • Electronic data memory device for a high read current The invention provides a memory device arranged on a substrate (401) and having at least one memory cell (100) The memory cell comprises a storage capacitor (200) for storing an electrical charge and a selection transistor (300) for selecting the memory cell (100). The selection transistor comprises a first conduction electrode (301), a second conduction electrode (302) and a control electrode (303) , the control electrode (303) being provided by a gate unit (400) having a fin (405) projecting from the substrate (401), which fin is surrounded by a gate oxide layer (406) and a gate electrode layer (403) in such a way that first and second gate elements (408a, 408b) are provided at opposite lateral areas of the fin (405), a third gate element (408c) being provided at an area of the fin (405) that is parallel to the surface of the substrate (401).
    • 用于高读取电流的电子数据存储器件本发明提供一种布置在衬底(401)上并具有至少一个存储单元(100)的存储器件。存储单元包括用于存储电荷的存储电容器(200) 晶体管(300),用于选择存储单元(100)。 选择晶体管包括第一导电电极(301),第二导电电极(302)和控制电极(303),控制电极(303)由栅极单元(400)提供,栅极单元(400)具有从 基板(401),其被栅极氧化物层(406)和栅极电极层(403)包围,使得第一和第二栅极元件(408a,408b)设置在第一和第二栅极元件(408a,408b)的相对侧向区域 所述翅片(405),第三栅极元件(408c)设置在所述鳍状物(405)的与所述基板(401)的表面平行的区域。
    • 6. 发明申请
    • Integrated semiconductor storage with at least a storage cell and procedure
    • 具有至少一个存储单元和程序的集成半导体存储器
    • US20050041495A1
    • 2005-02-24
    • US10840328
    • 2004-05-07
    • Andreas Spitzer
    • Andreas Spitzer
    • H01L21/334H01L21/8242H01L21/8244H01L21/84H01L27/108H01L27/11H01L27/12H01L29/08H01L29/423G11C7/00
    • H01L27/10861H01L21/84H01L27/10829H01L27/10832H01L27/10873H01L27/10885H01L27/10891H01L27/11H01L27/1203H01L29/0895H01L29/42364H01L29/66181
    • The invention relates to an integrated semiconductor memory (10) with at least one memory cell (1) having at least one transistor (3) which forms an inversion channel (34) in the switched-on state, the transistor (3) having a structure element (4) having a first source/drain region (5), a second source/drain region (6) and a region (4b) arranged between the first (5) and the second source/drain region (6), the structure element (4) being insulated from a semiconductor substrate (20) by an insulation layer (11), a gate dielectric (9) being arranged on the structure element (4) and a word line (16) being arranged on the gate dielectric (9), the gate dielelctric (9) being a high-resistance tunnel contact having a first region (31), the layer thickness (d) of which is so small that, in the switched-off state of the transistor (3), majority charge carriers generated thermally in the structure element (4) pass into the word line (16) by direct tunneling through the gate dielectric (9), and the entire region (4b) of the structure element (4) which region is arranged between the first (5) and the second source/drain region (6) being depleted of majority charge carriers in the switched-on state of the transistor (3). By virtue of the first region of the gate dielectric (9), majority charge carriers are conducted away from the structure element (4) into the word line in the off state of the transistor and parasitic effects which could arise on account of accumulating majority charge carriers are avoided.
    • 本发明涉及具有至少一个存储单元(1)的集成半导体存储器(10),所述至少一个存储单元(1)具有至少一个晶体管(3),所述晶体管在所述导通状态下形成反转通道(34),所述晶体管(3)具有 具有第一源极/漏极区域(5),第二源极/漏极区域(6)和布置在第一源极/漏极区域(6)之间的区域(4b)的结构元件(4) 结构元件(4)通过绝缘层(11)与半导体衬底(20)绝缘,栅极电介质(9)布置在结构元件(4)上,并且字线(16)布置在栅极电介质 (9)中,所述栅极导体(9)是具有第一区域(31)的高电阻隧道触点,所述第一区域(31)的层厚度(d)小到在晶体管(3)的截止状态下, ,在结构元件(4)中热产生的多数电荷载流子通过直接穿过栅极电介质(9)穿过字线(16),并且t 在晶体管(3)的接通状态下,布置在第一(5)和第二源极/漏极区域(6)之间的结构元件(4)的整个区域(4b)被耗尽多数电荷载流子 )。 由于门电介质(9)的第一区域,在晶体管的截止状态下,多数电荷载流子从结构元件(4)导入字线,并且由于累积多数电荷而可能产生寄生效应 承运人被避免。