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51. 发明申请

US20080295963A1 Gas supply system and gas supply accumulation unit of semiconductor manufacturing apparatus 审中-公开
标题翻译：半导体制造装置的供气系统和气体供应蓄积单元
公开(公告)号：US20080295963A1
公开(公告)日：2008-12-04
申请号：US12068029
申请日：2008-01-31
申请人： Shuji Moriya , Ken Nakao
发明人： Shuji Moriya , Ken Nakao
IPC分类号： C23F1/08 , C23C16/00 , C23C14/34
CPC分类号： C23C16/4402 , C23C16/4404 , C23C16/45561 , C30B25/14 , C30B31/16 , H01J37/3244 , Y02E60/34
摘要： A gas supply system 200 is a system that supplies a predetermined gas from a gas supply source 210 to a processing part 110 of a semiconductor manufacturing apparatus 100. The gas supply system 200 includes a gas supply passage apparatus 220 that is connected to the gas supply source 210 and the processing part 110. The gas supply passage apparatus 220 is provided with a plurality of fluid controllers (a hand valve 231, a pressure reducing valve 232, a manometer 233, a check valve 234, a first shutoff valve 235, a second shutoff valve 236, a massflow controller 237, and a gas filter 238), and passage structuring members (passage blocks 241 to 249) that are connected to positions between the respective fluid controllers 231 to 238 and form gas passages 221 to 229. The passage structuring members are made of a carbon material. Thus, when a corrosive gas is supplied to the processing part 110, mixture of a metal contaminant into a substrate to be processed W can be prevented as much as possible.
摘要翻译：气体供给系统200是将预定气体从气体供给源210供给到半导体制造装置100的处理部110的系统。气体供给系统200包括气体供给通道装置220，其与气体供给源210和处理部110.气体供给通道装置220设置有多个流体控制器（手动阀231，减压阀232，压力计233，止回阀234，第一截止阀235，第二截止阀236，质量流量控制器237和气体过滤器238）以及与各个流体控制器231至238之间的位置连接并形成气体通道221至229的通道结构构件（通道块241至249）。通道结构构件由碳材料制成。因此，当向处理部110供给腐蚀性气体时，可以尽可能地防止金属污染物混入待处理基板W。

52. 发明申请

US20080245306A1 Vaporizer and semiconductor processing system 有权
标题翻译：汽化器和半导体加工系统
公开(公告)号：US20080245306A1
公开(公告)日：2008-10-09
申请号：US12076765
申请日：2008-03-21
申请人： Ken Nakao , Hitoshi Kato , Tsuneyuki Okabe , Shigeyuki Okura
发明人： Ken Nakao , Hitoshi Kato , Tsuneyuki Okabe , Shigeyuki Okura
IPC分类号： C23C16/00
CPC分类号： C23C16/4486
摘要： A vaporizer for generating a process gas from a liquid material includes a heat-exchange lower block having a hollow internal space and disposed below the spray port of an injector inside the container. A run-up space for the atomized liquid material is defined between the spray port and the heat-exchange lower block, and an annular space continuous to the run-up space is defined between an inner surface of the container and the heat-exchange lower block. An internal heater is disposed in the internal space of the heat-exchange lower block and includes a carbon wire formed of woven bundles of carbon fibers and sealed in a ceramic envelope. The internal heater is configured to heat the atomized liquid material flowing through the annular space to generate the process gas.
摘要翻译：用于从液体材料产生处理气体的蒸发器包括具有中空内部空间并设置在容器内的喷射器的喷雾口下方的热交换下部块。雾化的液体材料的起始空间被限定在喷射口和热交换下部块之间，并且在容器的内表面和热交换器下部之间限定与起动空间连续的环形空间块。内部加热器设置在热交换下部块的内部空间中，并且包括由编织的碳纤维束形成并密封在陶瓷外壳中的碳线。内部加热器被配置为加热流过环形空间的雾化液体材料以产生处理气体。

53. 发明授权

US07207123B2 Dry air-supplying apparatus and treating apparatus 失效
标题翻译：干燥供气装置和处理装置
公开(公告)号：US07207123B2
公开(公告)日：2007-04-24
申请号：US10528230
申请日：2003-09-19
申请人： Takashi Tanahashi , Takanobu Asano , Ken Nakao , Katsuhiro Yamashita
发明人： Takashi Tanahashi , Takanobu Asano , Ken Nakao , Katsuhiro Yamashita
IPC分类号： F26B21/06
CPC分类号： F24F3/1423 , B01D53/06 , B01D53/261 , B01D2253/108 , B01D2253/25 , B01D2253/3425 , B01D2257/70 , B01D2257/80 , B01D2259/40007 , B01D2259/40052 , B01D2259/4009 , F24F2203/1032 , F24F2203/1056 , F24F2203/1072 , F24F2203/1084 , F24F2203/1088 , F24F2203/1096
摘要： Two rotors 18a, 18b each housing a honeycomb structure 25 carrying an absorbent is driven for rotation by a common motor 19. Partitioning members 17 define an absorbing zone S and a recovery zone U in the rotor depending on the angular positional relationship between the partitioning members 17 and the rotor corresponding thereto. In the absorbing zone S, the absorbent removes moisture and organic matters from air passing therethrough. In the recovery zone U, recovery of the absorbent deteriorated by absorbing the moisture and the organic matters is preformed by using heated dry air. Air sucked from a transfer space 10 of the processing system sequentially passes through the absorbing zones of both the rotors via a circulation passage 20, thereafter returned to the transfer space. A part of clean dry air having passed through the absorbing zones of both the rotors is supplied into an exhaust passage 21, and is heated by a heater, and passes through the recovery zones of both the rotors.
摘要翻译：每个容纳携带吸收剂的蜂窝结构25的两个转子18a，18b被驱动以便由公共电动机19旋转。分隔构件17根据分隔构件17和与其对应的转子之间的角度位置关系来限定转子中的吸收区域S和恢复区域U. 在吸收区S中，吸收剂从通过其的空气中除去水分和有机物质。在回收区U中，通过吸收水分和有机物而劣化的吸收剂的回收通过使用加热的干燥空气来预处理。从处理系统的传送空间10吸入的空气经由循环通道20依次通过两个转子的吸收区，然后返回到传送空间。已经通过两个转子的吸收区的清洁干燥空气的一部分被供给到排气通道21中，并被加热器加热，并且通过两个转子的回收区。

54. 发明申请

US20070048145A1 Vacuum evacuation device and method, and substrate processing apparatus and method 审中-公开
标题翻译：真空抽气装置及方法，以及基板处理装置及方法
公开(公告)号：US20070048145A1
公开(公告)日：2007-03-01
申请号：US11501793
申请日：2006-08-10
申请人： Katsutoshi Ishii , Ken Nakao , Takanobu Asano , Kota Umezawa , Hiroaki Ogamino , Tadashi Urata , Katsuaki Usui , Masafumi Inoue , Shinichi Sekiguchi , Hironobu Yamasaki
发明人： Katsutoshi Ishii , Ken Nakao , Takanobu Asano , Kota Umezawa , Hiroaki Ogamino , Tadashi Urata , Katsuaki Usui , Masafumi Inoue , Shinichi Sekiguchi , Hironobu Yamasaki
IPC分类号： F04B49/06
CPC分类号： F04D19/042 , F04D27/0261
摘要： A vacuum evacuation device 2 of the invention comprises a vacuum pump 4,5 for exhausting a gas G2 in a process chamber 21 into which a process gas G1 is introduced and in which a process reaction is performed, to form a vacuum in said process chamber 21; and a control means 6 for performing a first control that regulates the rotational speed of said vacuum pump 4,5 such that a pressure condition in said process chamber 21 reaches a pressure condition suitable for said process reaction during said process reaction, wherein said control means 6 calculates a specified rotational speed for said vacuum pump 4,5 based on process information related to said process reaction, and performs a second control that brings said vacuum pump 4,5 to said specified rotational speed before said first control. The vacuum evacuation device 2 is capable of bringing the pressure in a process chamber 21 to the target pressure in a short period without a vacuum pump 4,5 being overloaded, regardless of the process reaction condition.
摘要翻译：本发明的真空排气装置2包括：真空泵4,5，用于在处理室21中排出气体G 2，工艺气体G 1引入到该气体G 2中并进行处理反应，以在所述处理室21; 以及用于执行调节所述真空泵4,5的转速的第一控制的控制装置6，使得所述处理室21中的压力条件达到在所述处理反应期间适用于所述处理反应的压力条件，其中所述控制装置图6基于与所述处理反应相关的处理信息计算出所述真空泵4,5的指定转速，并且执行使所述真空泵4,5在所述第一控制之前达到所述指定转速的第二控制。真空排气装置2能够在不使真空泵4,5过载的情况下在短时间内将处理室21内的压力提高到目标压力，而与过程反应条件无关。

55. 发明授权

US06582649B1 Parsion stabilizing method and system therefor for blow-molding machine 有权
标题翻译：用于吹塑机的波动稳定方法及其系统
公开(公告)号：US06582649B1
公开(公告)日：2003-06-24
申请号：US09709567
申请日：2000-11-13
申请人： Shigeaki Sano , Ken Nakao , Sohei Masaki , Kunihiro Hijikata
发明人： Shigeaki Sano , Ken Nakao , Sohei Masaki , Kunihiro Hijikata
IPC分类号： B29C4916
CPC分类号： B29C49/16 , B29C47/0023 , B29C47/0026 , B29C47/0054 , B29C47/20 , B29C47/28 , B29C49/04 , B29C49/60 , B29K2705/00
摘要： A forced exhaust pipe is connected to an exhaust pipe connected with a cross head so that a negative pressure may be formed within an air passage so as to effect rapid control of air pressure (amount) within a parison, thereby stabilizing the air pressure within the parison. A parison stabilizing method and a system therefor for use in a hollow formation molding machine, according to the present invention, are so formed that a forced air-discharge is carried out through an exhaust pipe connected with the air passage formed within the cross head, so that a negative pressure is formed within the air passage. In this way, the above-mentioned system can effect quick control of an air pressure (amount) within the prison during a pre-blowing treatment, shorten a time period necessary for determining molding conditions, without having to increase the inner diameter of the air passage.
摘要翻译：强制排气管连接到与十字头连接的排气管，从而可以在空气通道内形成负压，以便快速控制型坯内的空气压力（量），从而使空气压力稳定在型坯根据本发明的用于中空成型模塑机的型坯稳定方法及其系统被形成为通过与形成在十字头内的空气通道连接的排气管进行强制排气，使得在空气通道内形成负压。以这种方式，上述系统可以在预吹制处理期间快速控制监狱内的空气压力（量），缩短确定成型条件所需的时间，而不必增加空气的内径通道。

56. 发明授权

US6062853A Heat-treating boat for semiconductor wafers 有权
标题翻译：用于半导体晶圆的热处理船
公开(公告)号：US6062853A
公开(公告)日：2000-05-16
申请号：US125796
申请日：1998-08-31
申请人： Tomohisa Shimazu , Ken Nakao
发明人： Tomohisa Shimazu , Ken Nakao
IPC分类号： H01L21/67 , H01L21/673 , F27D5/00
CPC分类号： H01L21/67309 , H01L21/6875 , H01L21/67115
摘要： An heat-treating ring boat (20) for semiconductor wafers (W) has a top plate (21), a bottom plate (22), six columns (23-28), and 63 ring trays (31). The trays (31) are mounted in grooves (20a) of the columns (23-28). To fix the trays (31), a fixing rod (33) is detachably mounted between the top plate (21) and bottom plate (22). A through hole (21a) and a recessed portion (22a) to mount the fixing rod (33) therein are formed in the top plate (21) and bottom plate (22). Notches (34) to engage with the fixing rod (33) are formed in the trays (31). A notch (32) to engage with the fixing rod (33) is formed in the column (23). A projection (41) is formed on each tray (31) to abut against the side surface of the column (24).
摘要翻译： PCT No.PCT / JP97 / 00526 Sec。 371日期1998年8月31日 102（e）日期1998年8月31日PCT 1997年2月25日PCT公布。公开号WO97 / 32339 日期1997年9月4日，半导体晶片（W）的热处理环舟（20）具有顶板（21），底板（22），六列（23-28）和63个环形托盘（31）。托盘（31）安装在列（23-28）的凹槽（20a）中。为了固定托盘（31），固定杆（33）可拆卸地安装在顶板（21）和底板（22）之间。在顶板（21）和底板（22）上形成有通孔（21a）和安装固定杆（33）的凹部（22a）。在托盘（31）中形成有与固定杆（33）接合的凹口（34）。在柱（23）中形成有与固定杆（33）接合的凹口（32）。在每个托盘（31）上形成突起（41）以抵靠柱（24）的侧表面。

57. 发明授权

US6008477A Heat treatment apparatus 失效
标题翻译：热处理设备
公开(公告)号：US6008477A
公开(公告)日：1999-12-28
申请号：US23769
申请日：1998-02-13
申请人： Ken Nakao , Makoto Kobayashi , Hisaei Osanai
发明人： Ken Nakao , Makoto Kobayashi , Hisaei Osanai
IPC分类号： H05B3/06 , H01L21/00 , H01L21/205 , H01L21/22 , H01L21/31 , H05B3/46 , H05B3/64 , H05B3/66 , F27B5/14
CPC分类号： H01L21/67109 , H05B3/64 , H05B3/66
摘要： A helical heating wire is disposed so as to surround a reaction tube, and is held by a heat insulating structure. Support members are arranged at predetermined pitches on the inner circumference of the heat insulating structure to support the heating wire on the inner circumference of the heat insulating structure so as to enable the heating wire to make thermal expansion and thermal contraction. Fixing means are attached to one loop out of every suitable number of loops of the helical heating wire to fix the heating wire to the heat insulating structure.
摘要翻译：螺旋形加热线设置成围绕反应管，并且由隔热结构保持。支撑构件以隔热结构的内圆周上的预定间距布置，以将热丝支撑在绝热结构的内周上，以使得加热丝能够进行热膨胀和热收缩。固定装置连接到螺旋形加热丝的每个合适数量的环的一个环上，以将加热丝固定到隔热结构。

58. 发明授权

US5813851A Heat treatment method 失效
标题翻译：热处理方法
公开(公告)号：US5813851A
公开(公告)日：1998-09-29
申请号：US708710
申请日：1996-09-05
申请人： Ken Nakao
发明人： Ken Nakao
IPC分类号： H01L21/22 , C23C16/46 , C30B25/12 , C30B31/14 , H01L21/00 , H01L21/31 , H01L21/324 , F27D5/00
CPC分类号： H01L21/67109 , C23C16/46 , C30B25/12 , C30B31/14
摘要： When a wafer boat having wafers, objects to be treated, placed thereon is loaded into a reaction tube, which is then raised in temperature by a heating section at a speed of 50.degree. C./min or more, a pressure reduction degree of the reaction tube is lowered or a hydrogen gas is supplied. A surface roughness of a portion in contact with the wafers on the wafer boat is 50 .mu.m or less. Thereby, a heat transfer coefficient relative to the wafers is improved to suppress an in-plane temperature difference smaller. Accordingly, when the objects to be treated are raised in temperature in the reaction tube for heat treatment, it is possible to suppress the in-plane temperature difference of the substances to be smaller to prevent an occurrence of a slip or warp which leads to the lowering of a yield.
摘要翻译：将具有放置在其上的待处理物体的晶片舟装载到反应管中，然后通过加热部以50℃/分钟以上的速度升温，减压度反应管降低或供应氢气。与晶片舟皿上的晶片接触的部分的表面粗糙度为50μm以下。由此，能够提高相对于晶片的传热系数，能够抑制面内的温度差的变小。因此，当待处理物体在用于热处理的反应管中的温度升高时，可以将物质的面内温度差减小到更小，以防止导致滑动或翘曲的发生降低产量。

59. 发明授权

US5645419A Heat treatment method and device 失效
标题翻译：热处理方法及装置
公开(公告)号：US5645419A
公开(公告)日：1997-07-08
申请号：US409098
申请日：1995-03-23
申请人： Tetsu Ohsawa , Hiroyuki Iwai , Hisashi Kikuchi , Shingo Watanabe , Keiji Takano , Tsutomu Haraoka , Ken Nakao
发明人： Tetsu Ohsawa , Hiroyuki Iwai , Hisashi Kikuchi , Shingo Watanabe , Keiji Takano , Tsutomu Haraoka , Ken Nakao
IPC分类号： H01L21/00 , H01L21/677 , F23D11/44
CPC分类号： H01L21/67115 , H01L21/67769 , H01L21/67781
摘要： A heat treatment device including a handling chamber that has a carriers feed in/out opening for carriers holding plural sheets of objects to be treated parallelly vertical, a vertical heat treatment furnace for heat treating the objects and a posture changer for swinging the carriers near the carriers feed in/out opening of the handling chamber on a rotational center into a territory of lower sides of the carriers to change the posture of the objects to be treated from the vertical position to the horizontal position. The heat treatment device also has a carriers storage unit disposed above the posture changing means for storing a plural number of posture changed carriers, conveying device for conveying the carriers between the storage unit and the posture changing device and the heat treatment furnace side. Also, provided is a transferrer for transferring the objects-to-be-treated to/from an objects-to-be-treated holder for loading and unloading into/out of the heat treatment furnace side. The posture changer swings the carriers on the rotational center to sides of the carriers to change the carriers' posture from vertical to horizontal so the carriers have postures changed along a swing track of a minimum radius with small bulge amounts and a minimum moving amount. Thus, a conveying distance and a conveying time for conveying the posture changed carriers to the upper storage unit be reduced, and the heat treatment device can be smaller-sized and have improved processing efficiency.
摘要翻译：一种热处理装置，其特征在于，具备搬运室，该处理室具有用于保持待平行放置待处理的多个物体的载体的进/出开口，用于对物体进行热处理的立式热处理炉，以及用于使载体附近的载体摆动的姿势变换器载体将转动中心的处理室的进/出开口输送到载体的下侧的区域中，以将被处理物体的姿态从垂直位置改变到水平位置。该热处理装置还具有：载置体存放部，其设置在姿势变更机构的上方，用于存储多个姿势变化的载体，用于在存放部与姿势变更装置以及热处理炉侧之间输送载体的输送装置。而且，提供了一种转移器，用于将待处理物体转移到待处理的待处理的保持器，用于装载和卸载进入/离开热处理炉侧。姿态变换器将转动中心的载体摆动到载体的侧面，以将载体的姿态从垂直方向转换为水平，使得载体具有沿着具有小凸起量和最小移动量的最小半径的摆动轨道改变的姿势。因此，能够减少用于输送姿势的输送距离和输送时间，使载体向上部存储单元减少，并且热处理装置可以更小尺寸并且具有改善的处理效率。

60. 发明授权

US5431561A Method and apparatus for heat treating 失效
标题翻译：热处理方法和装置
公开(公告)号：US5431561A
公开(公告)日：1995-07-11
申请号：US166014
申请日：1993-12-14
申请人： Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
发明人： Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
IPC分类号： H01L21/324 , C30B31/12 , C30B31/14 , H01L21/22 , H01L21/31 , H01L21/673 , H01L21/683 , F27D5/00
CPC分类号： C30B31/12 , C30B31/14
摘要： A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.
摘要翻译：一种热处理装置中的热处理方法和装置，其特征在于，具有要加入预定气体的加热室，设置在所述加热室周围的加热器和设置在所述加热室中的夹具，用于支撑待处理的多个基板的晶片彼此并联，其中为了使热处理中要处理的基板的晶片的温度分布均匀，形成夹具以确定其尺寸和形状，其具有在根据具有预定形状确定步骤的热处理方法的梯度，使得夹具形成为环状托盘（即，支撑环），用于在周边保持要处理的基板，并且托盘的厚度等于或等于其外周侧比其内周侧厚。

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