专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5431561A Method and apparatus for heat treating 失效
标题翻译：热处理方法和装置
公开(公告)号：US5431561A
公开(公告)日：1995-07-11
申请号：US166014
申请日：1993-12-14
申请人： Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
发明人： Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
IPC分类号： H01L21/324 , C30B31/12 , C30B31/14 , H01L21/22 , H01L21/31 , H01L21/673 , H01L21/683 , F27D5/00
CPC分类号： C30B31/12 , C30B31/14
摘要： A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.
摘要翻译：一种热处理装置中的热处理方法和装置，其特征在于，具有要加入预定气体的加热室，设置在所述加热室周围的加热器和设置在所述加热室中的夹具，用于支撑待处理的多个基板的晶片彼此并联，其中为了使热处理中要处理的基板的晶片的温度分布均匀，形成夹具以确定其尺寸和形状，其具有在根据具有预定形状确定步骤的热处理方法的梯度，使得夹具形成为环状托盘（即，支撑环），用于在周边保持要处理的基板，并且托盘的厚度等于或等于其外周侧比其内周侧厚。

2. 发明授权

US5297956A Method and apparatus for heat treating 失效
标题翻译：热处理方法和装置
公开(公告)号：US5297956A
公开(公告)日：1994-03-29
申请号：US799931
申请日：1991-11-29
申请人： Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
发明人： Kikuo Yamabe , Keitaro Imai , Katsuya Okumura , Ken Nakao , Seikou Ueno
IPC分类号： H01L21/324 , C30B31/12 , C30B31/14 , H01L21/22 , H01L21/31 , H01L21/673 , H01L21/683 , F23D5/00
CPC分类号： C30B31/12 , C30B31/14
摘要： A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.
摘要翻译：一种热处理装置中的热处理方法和装置，其特征在于，具有要加入预定气体的加热室，设置在所述加热室周围的加热器和设置在所述加热室中的夹具，用于支撑待处理的多个基板的晶片彼此并联，其中为了使热处理中要处理的基板的晶片的温度分布均匀，形成夹具以确定其尺寸和形状，其具有在根据具有预定形状确定步骤的热处理方法的梯度，使得夹具形成为环状托盘（即，支撑环），用于在周边保持要处理的基板，并且托盘的厚度等于或等于其外周侧比其内周侧厚。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式