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    • 42. 发明授权
    • Preparation of polymer, and resist composition using the polymer
    • 聚合物的制备和使用聚合物的抗蚀剂组合物
    • US06835804B2
    • 2004-12-28
    • US10003121
    • 2001-12-06
    • Takanobu TakedaOsamu Watanabe
    • Takanobu TakedaOsamu Watanabe
    • C08F606
    • G03F7/0392C08F8/12C08F2800/20C08F212/14
    • A polymer comprising recurring units of formula (2) is prepared by effecting deblocking reaction on a polymer comprising recurring units of formula (1) in the presence of an acid catalyst. In the formulae, R1 and R4 are H or methyl, R2 and R3 are C1-C10 alkyl, or R2 and R3 may form a ring, R5 is H, hydroxyl, alkyl, alkoxy or halogen, R6 and R7 are H, methyl, alkoxycarbonyl, cyano or halogen, R8 is C4-C20 tertiary alkyl, n is an integer of 0 to 4, p is a positive number, q and r each are 0 or a positive number, exclusive of q=r=0, p1 is a positive number, p2 is 0 or a positive number, and p1+p2=p. The polymer thus produced has a narrower molecular weight distribution than polymers produced by the prior art methods. A resist composition comprising the polymer as a base resin has advantages including a dissolution contrast of resist film, high resolution, exposure latitude, process flexibility, good pattern profile after exposure, and minimized line edge roughness.
    • 包含式(2)的重复单元的聚合物通过在酸催化剂存在下对包含式(1)的重复单元的聚合物进行解封反应来制备。在式中,R 1和R 4是H 或甲基,R 2和R 3是C 1 -C 10烷基,或R 2和R 3可以形成环,R 5是H,羟基,烷基,烷氧基或卤素, 6>和R 7是H,甲基,烷氧基羰基,氰基或卤素,R 8是C 4 -C 20叔烷基,n是0至4的整数,p是正数,q和r各自为0 或正数,不包括q = r = 0,p1为正数,p2为0或正数,p1 + p2 = p。 如此制备的聚合物具有比通过现有技术方法制备的聚合物更窄的分子量分布。 包含聚合物作为基础树脂的抗蚀剂组合物具有抗蚀剂膜的溶解对比度,高分辨率,曝光宽容度,工艺柔韧性,曝光后的良好图案轮廓和最小化线边缘粗糙度的优点。