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41. 发明申请

US20080314763A1 Method and device for regenerating ion exchanger, and electrolytic processing apparatus 有权
标题翻译：再生离子交换器的方法和装置，以及电解处理装置
公开(公告)号：US20080314763A1
公开(公告)日：2008-12-25
申请号：US12222733
申请日：2008-08-14
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiro Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiro Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： C25F1/00 , C25F7/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

42. 发明授权

US07427345B2 Method and device for regenerating ion exchanger, and electrolytic processing apparatus 有权
公开(公告)号：US07427345B2
公开(公告)日：2008-09-23
申请号：US10432397
申请日：2002-11-29
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： C25D17/00 , C25B15/00 , B23H3/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

43. 发明申请

US20070272562A1 Electrolytic Processing Apparatus and Electrolytic Processing Method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070272562A1
公开(公告)日：2007-11-29
申请号：US10560623
申请日：2004-07-14
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
IPC分类号： H01L21/3063
CPC分类号： C25F3/00 , C25F7/00
摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can effectively prevent the formation of pits that would impair the quality of the processed product. The electrolytic processing apparatus including: a processing electrode (210) for processing a workpiece; a feeding electrode (212) for feeding electricity to the workpiece; a power source (232) for applying a voltage between the processing electrode (210) and the feeding electrode (212); a pressure tight container (200) housing the processing electrode (210) and the feeding electrode (212) therein; and a high-pressure liquid supply system (204) for supplying a high-pressure liquid into the pressure tight container (210).
摘要翻译：本发明提供一种电解处理装置和电解处理方法，其可以有效地防止会影响加工产品质量的凹坑的形成。电解处理装置包括：处理工件的处理电极; 用于向工件供电的供电电极（212）; 用于在处理电极（210）和馈电电极（212）之间施加电压的电源（232）; 容纳所述处理电极（210）和所述馈电电极（212）的压力容器（200）; 以及用于将高压液体供应到耐压容器（210）中的高压液体供给系统（204）。

44. 发明授权

US06899592B1 Polishing apparatus and dressing method for polishing tool 失效
标题翻译：抛光装置和抛光工具的修整方法
公开(公告)号：US06899592B1
公开(公告)日：2005-05-31
申请号：US10636915
申请日：2003-08-08
申请人： Shunichiro Kojima , Kazuto Hirokawa , Akira Kodera
发明人： Shunichiro Kojima , Kazuto Hirokawa , Akira Kodera
IPC分类号： B24B37/04 , B24B53/007 , B49D1/00
CPC分类号： B24B37/245 , B24B53/017 , Y10S451/91
摘要： In a polishing apparatus, a polishing tool including abrasive particles and a binder for bonding together the abrasive particles is pressed against a substrate to polish the substrate. The polishing apparatus has a light source for irradiating a polishing surface with light rays for weakening a bond force of the binder for bonding together the abrasive particles, and a waste matter removing mechanism for forcefully removing waste matter produced by polishing or waste matter produced by irradiation. By irradiating the polishing surface with the light rays, dressing of the polishing surface is performed, and products resulting from dressing and the like are removed. The polishing apparatus supplies abrasive particles to the polishing surface stably by dressing and allows high-speed polishing of the substrate.
摘要翻译：在抛光装置中，包括研磨颗粒和用于将磨料颗粒粘合在一起的粘合剂的抛光工具被压在衬底上以抛光衬底。抛光装置具有用于对研磨面照射光线的光源，用于削弱用于将磨料颗粒粘合在一起的粘合剂的粘合力;以及废物除去机构，用于强制除去由抛光产生的废物或通过照射产生的废物。通过用光线照射抛光表面，进行抛光表面的修整，并且除去由敷料等产生的产品。抛光装置通过修整将磨料颗粒稳定地提供给抛光表面，并允许基板的高速抛光。

45. 发明申请

US20050035001A1 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050035001A1
公开(公告)日：2005-02-17
申请号：US10914190
申请日：2004-08-10
申请人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
发明人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
IPC分类号： B23H3/00 , C25D5/02 , C25F7/02
CPC分类号： C25F7/02
摘要： There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.
摘要翻译：提供一种电解处理装置和电解处理方法，其可以以提高的离子交换容量的再生速率再生离子交换器，而不会不利地影响装置的生产量。电解处理装置包括：用于保持工件的保持器; 电极部分，包括电极，接触部件和用于在处理期间从工件中取出的金属离子放电到接触部件中的放电部分，所述电极部分靠近或与保持件保持的工件接触或接触在液体存在下对工件进行加工; 以及能够靠近或与接触构件接触的再生虚拟电极。

46. 发明授权

US5357162A Spindle motor using dynamic pressure bearings 失效
标题翻译：主轴电机采用动压轴承
公开(公告)号：US5357162A
公开(公告)日：1994-10-18
申请号：US22134
申请日：1993-02-25
申请人： Shunichi Aiyoshizawa , Kazuto Hirokawa , Kazuyuki Kasahara , Tohru Maruyama
发明人： Shunichi Aiyoshizawa , Kazuto Hirokawa , Kazuyuki Kasahara , Tohru Maruyama
IPC分类号： F16C17/10 , F16C17/04 , F16C33/10 , F16C33/24 , H02K5/16 , F16C32/06 , H02K7/08
CPC分类号： F16C17/107 , F16C33/107 , H02K5/1677
摘要： A spindle motor with an H-type pneumatic dynamic bearing has a high durability against repeated starts and stops of rotation. The H-type bearing is composed of a radial bearing member, thrust plates firmly fixed to opposite ends of the radial bearing member and a cylindrical radial sleeve, which form a radial pneumatic dynamic bearing and thrust pneumatic dynamic bearings. A stator core is fixedly secured around a rotary member, which is in turn fixedly secured around the cylindrical radial sleeve. A total thrust clearance a+a' of the thrust bearings is represented by an inequality of (a+a')/A
摘要翻译：具有H型气动动力轴承的主轴电机对反复启动和停止转动具有高耐久性。 H型轴承由径向轴承构件组成，推力板牢固地固定在径向轴承构件的相对端和圆柱形径向套筒上，形成径向气动动力轴承和推力气动动力轴承。定子芯固定地固定在旋转构件周围，旋转构件又固定地固定在圆柱形径向套筒周围。推力轴承的总推力间隙a + a'由每个推力板的滑动面直径A（a + a'）/ A <2.5 / 104的不等式表示，a和总径向间隙b + b 基于径向轴承部件的滑动面直径B，径向轴承的“（b + b'）/ B <5/104”的不等式表示。

47. 发明授权

US4998033A Gas dynamic bearing for spindle motor 失效
标题翻译：主轴电机气动轴承
公开(公告)号：US4998033A
公开(公告)日：1991-03-05
申请号：US506183
申请日：1990-04-09
申请人： Yasushi Hisabe , Noriyuki Osada , Toshihiro Ohtani , Masahiko Kishi , Yoshio Sato , Daisuke Konno , Sachihiko Miwa , Toshiya Kanamori , Shunichi Aiyoshizawa , Kazuyuki Kasahara , Kazuto Hirokawa , Yumiko Noda
发明人： Yasushi Hisabe , Noriyuki Osada , Toshihiro Ohtani , Masahiko Kishi , Yoshio Sato , Daisuke Konno , Sachihiko Miwa , Toshiya Kanamori , Shunichi Aiyoshizawa , Kazuyuki Kasahara , Kazuto Hirokawa , Yumiko Noda
IPC分类号： G11B19/20 , H02K5/16
CPC分类号： F16C17/107 , F16C25/045 , F16C27/08 , G11B19/2009 , H02K5/1677 , F16C2206/40 , F16C2370/12 , F16C27/063
摘要： A spindle motor comprising a stator including a support shaft positioned on a base, a cap-shaped rotor rotatably and concentrically disposed around the support shaft, thrust and radial bearings disposed between the stator and the rotor, a stator coil secured to the stator, and a rotor magnet member secured to the rotor opposing the stator coil. The thrust and radial bearings are hydrodynamic bearings. A movable piece that constitutes a part of the thrust bearing is secured to the lower end of a cylindrical portion of the rotor and extended outwardly or inwardly from the cylindrical portion, or is disposed above the rotor. The stator coil is secured to the outer peripheral portion of the support shaft above or below the radial bearing. The rotor magnet member is securd to the inner peripheral surface or inner top surface of the rotor. Either a radial or axial gap is provided between the stator coil and the rotor magnet member.

48. 发明申请

US20080217164A1 Electrolytic Processing Apparatus 审中-公开
标题翻译：电解处理装置
公开(公告)号：US20080217164A1
公开(公告)日：2008-09-11
申请号：US10585739
申请日：2005-03-24
申请人： Yasushi Toma , Takayuki Saito , Kazuto Hirokawa
发明人： Yasushi Toma , Takayuki Saito , Kazuto Hirokawa
IPC分类号： C25D17/00
CPC分类号： C25F7/00 , B23H5/08 , H01L21/32125
摘要： An electrolytic processing apparatus (50) has feed electrodes (74) to feed a current to a substrate (W), an ion exchanger (76) brought into contact with the substrate (W), and process electrodes (72) to perform an electrolytic process on the substrate (W). The electrolytic processing apparatus (50) has an electrolytic processing liquid source to supply an electrolytic processing liquid between the substrate (W) and the ion exchanger (76), and a regeneration liquid supply source to supply a regeneration liquid to a regeneration liquid chambers (90a, 90b). The electrolytic processing apparatus (50) includes regeneration electrodes (84) spaced from the process electrodes (72). The feed electrode (74) has a potential higher than the process electrode (72) and the same polarity as the process electrode (72). The process electrode (72) has a potential higher than the regeneration electrode (84).
摘要翻译：电解处理装置（50）具有将电流供给到基板（W）的馈电电极（74），与基板（W）接触的离子交换器（76），以及处理电极（72），以进行电解在基板上的工艺（W）。电解处理装置（50）具有电解处理液源，在基板（W）和离子交换器（76）之间供给电解处理液，再生液供给源向再生液室供给再生液 90 a，90 b）。电解处理装置（50）包括与处理电极（72）间隔开的再生电极（84）。馈电电极（74）的电位高于处理电极（72）并具有与处理电极（72）相同的极性。处理电极（72）的电位高于再生电极（84）。

49. 发明申请

US20070173177A1 Substrate polishing apparatus 有权
公开(公告)号：US20070173177A1
公开(公告)日：2007-07-26
申请号：US11727727
申请日：2007-03-28
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

50. 发明申请

US20070004324A1 Polishing apparatus 审中-公开
标题翻译：抛光设备
公开(公告)号：US20070004324A1
公开(公告)日：2007-01-04
申请号：US10534507
申请日：2003-10-24
申请人： Masayoshi Hirose , Hozumi Yasuda , Kazuto Hirokawa , Ikutarou Noji
发明人： Masayoshi Hirose , Hozumi Yasuda , Kazuto Hirokawa , Ikutarou Noji
IPC分类号： B24B29/00
CPC分类号： B24B37/26 , B24D9/085
摘要： A polishing apparatus includes a polishing object holding mechanism for holding an object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. An elastic sheet 11 is stretched over the upper surface of the table, and a polishing pad 16 having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet 11. Thus, the function performed by an underlayer pad member of a double-layer polishing pad that has heretofore frequently been used in a chemical/mechanical polishing (CMP) apparatus is imparted to the table of the chemical/mechanical polishing (CMP) apparatus, thereby achieving cost reduction of chemical/mechanical polishing (CMP) process and stabilizing process performance such as polishing rate uniformity within a substrate surface to be polished.
摘要翻译：抛光装置包括用于保持待抛光物体的抛光对象保持机构和具有抛光表面的工作台。由抛光对象保持机构保持的研磨物被压在工作台的研磨面上，并通过由保持机构保持的研磨对象物与工作台的研磨面之间的相对移动进行研磨。弹性片材11在桌子的上表面上被拉伸，并且在其上侧具有抛光表面的抛光垫16可更换地拉伸在弹性片材11上。因此，在化学/机械抛光（CMP）装置中已经使用了迄今为止经常被用于化学/机械抛光（CMP）装置的双层抛光垫的底层衬垫构件所执行的功能被赋予到化学/机械抛光（CMP）装置的工作台实现化学/机械抛光（CMP）工艺的成本降低和稳定处理性能，例如待抛光的基板表面内的抛光速率均匀性。

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