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1. 发明申请

US20070004324A1 Polishing apparatus 审中-公开
标题翻译：抛光设备
公开(公告)号：US20070004324A1
公开(公告)日：2007-01-04
申请号：US10534507
申请日：2003-10-24
申请人： Masayoshi Hirose , Hozumi Yasuda , Kazuto Hirokawa , Ikutarou Noji
发明人： Masayoshi Hirose , Hozumi Yasuda , Kazuto Hirokawa , Ikutarou Noji
IPC分类号： B24B29/00
CPC分类号： B24B37/26 , B24D9/085
摘要： A polishing apparatus includes a polishing object holding mechanism for holding an object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. An elastic sheet 11 is stretched over the upper surface of the table, and a polishing pad 16 having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet 11. Thus, the function performed by an underlayer pad member of a double-layer polishing pad that has heretofore frequently been used in a chemical/mechanical polishing (CMP) apparatus is imparted to the table of the chemical/mechanical polishing (CMP) apparatus, thereby achieving cost reduction of chemical/mechanical polishing (CMP) process and stabilizing process performance such as polishing rate uniformity within a substrate surface to be polished.
摘要翻译：抛光装置包括用于保持待抛光物体的抛光对象保持机构和具有抛光表面的工作台。由抛光对象保持机构保持的研磨物被压在工作台的研磨面上，并通过由保持机构保持的研磨对象物与工作台的研磨面之间的相对移动进行研磨。弹性片材11在桌子的上表面上被拉伸，并且在其上侧具有抛光表面的抛光垫16可更换地拉伸在弹性片材11上。因此，在化学/机械抛光（CMP）装置中已经使用了迄今为止经常被用于化学/机械抛光（CMP）装置的双层抛光垫的底层衬垫构件所执行的功能被赋予到化学/机械抛光（CMP）装置的工作台实现化学/机械抛光（CMP）工艺的成本降低和稳定处理性能，例如待抛光的基板表面内的抛光速率均匀性。

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