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1. 发明申请

US20170227107A1 CONVEX GEAR TOOTH EDGE BREAK 审中-公开
公开(公告)号：US20170227107A1
公开(公告)日：2017-08-10
申请号：US15412928
申请日：2017-01-23
申请人： Sikorsky Aircraft Corporation
发明人： Edward H. Bittner , Bruce D. Hansen , Christopher John Mussel
IPC分类号： F16H55/08 , B23H9/00 , F16H55/17
CPC分类号： F16H55/088 , B23F1/02 , B23F5/02 , B23F9/02 , B23F19/12 , B23H5/08 , B23H9/003 , F16H1/08 , F16H55/0873 , F16H55/17 , F16H2055/0866
摘要： A method of manufacturing a gear is provided. The method includes forming a plurality of gear teeth in a surface of a gear, the gear teeth having tooth faces defining tooth edges including tooth edge flanks and tooth edge top land and generating a convex contour at an edge break of at least one of the tooth edge flanks and tooth edge top land.

2. 发明申请

US20170144239A1 METHOD AND APPARATUS FOR POLISHING METAL PARTS WITH COMPLEX GEOMETRIES 审中-公开
公开(公告)号：US20170144239A1
公开(公告)日：2017-05-25
申请号：US14952370
申请日：2015-11-25
申请人： General Electric Company
发明人： Yuanfeng Luo , Steven Robert Hayashi , Adegboyega Masud Makinde , Andrew Lee Trimmer
IPC分类号： B23H5/08 , C25F7/00 , C25F3/16 , B23H5/12 , B23H9/10
CPC分类号： B23H5/08 , B23H9/10 , C25F3/16 , C25F7/00
摘要： The polishing system includes a power supply. The polishing system also includes a container including an interior portion. The interior portion includes a conductive material thereon. The conductive material is electrically coupled to the power supply. The polishing system also includes an electrolytic solution disposed within the container. The electrolytic solution includes a plurality of abrasive particles. The polishing system further includes a flexible media disposed within the container. The container is configured to contain an object. The power supply configured to electrically couple to the object. Each of the electrolytic solution, the flexible media, and the abrasive particles is configured to partially polish the object substantially simultaneously.

3. 发明授权

US08506770B2 Electrochemical planarization system comprising enhanced electrolyte flow 有权
标题翻译：电化学平面化系统包括增强的电解质流
公开(公告)号：US08506770B2
公开(公告)日：2013-08-13
申请号：US12645583
申请日：2009-12-23
申请人： Axel Kiesel , Johannes Groschopf
发明人： Axel Kiesel , Johannes Groschopf
IPC分类号： C25F3/16 , C25F7/00 , C25D17/00
CPC分类号： B24B37/042 , B23H5/08
摘要： A polishing pad for an electrochemical planarization tool comprises a patterned surface that forms appropriate electrolyte flow channels for directing an electrolyte from the center to the periphery thereof. Consequently, a continuous electrolyte flow may be established, thereby significantly reducing the accumulation of contaminants in the polishing pad, thereby contributing to enhanced process uniformity so that frequent rinsing of the polishing pad and replacement of the electrolyte solution may be avoided.
摘要翻译：用于电化学平面化工具的抛光垫包括形成适当的电解质流动通道的图案化表面，用于将电解质从中心引导到其周边。因此，可以建立连续的电解质流动，从而显着减少抛光垫中污染物的积聚，从而有助于提高工艺均匀性，从而可以避免抛光垫的频繁冲洗和电解质溶液的更换。

4. 发明授权

US08158532B2 Topography reduction and control by selective accelerator removal 有权
标题翻译：通过选择性促进剂去除的地形减少和控制
公开(公告)号：US08158532B2
公开(公告)日：2012-04-17
申请号：US11602128
申请日：2006-11-20
申请人： Steven T. Mayer , Mark L. Rea , Richard S. Hill , Avishai Kepten , R. Marshall Stowell , Eric G. Webb
发明人： Steven T. Mayer , Mark L. Rea , Richard S. Hill , Avishai Kepten , R. Marshall Stowell , Eric G. Webb
IPC分类号： H01L21/302
CPC分类号： C25D17/14 , B23H5/08 , C25D5/02 , C25D5/06 , C25D5/08 , C25D5/34 , C25D7/123 , C25D17/001 , C25D17/06 , C25F3/16 , C25F3/30 , H01L21/02068 , H01L21/2885 , H01L21/32115 , H01L21/3212 , H01L21/32134 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： Plating accelerator is applied selectively to a substantially-unfilled wide (e.g., low-aspect-ratio feature cavity. Then, plating of metal is conducted to fill the wide feature cavity and to form an embossed structure in which the height of a wide-feature metal protrusion over the metal-filled wide-feature cavity is higher than the height of metal over field regions. Most of the overburden metal is removed using non-contact techniques, such as chemical wet etching. Metal above the wide feature cavity protects the metal-filled wide-feature interconnect against dishing, and improved planarization techniques avoid erosion of the metal interconnect and dielectric insulating layer. In some embodiments, plating of metal onto a substrate is conducted to fill narrow (e.g., high-aspect-ratio feature cavities) in the dielectric layer before selective application of plating accelerator and filling of the wide feature cavity.
摘要翻译：电镀加速器选择性地施加到基本上未填充的宽（例如，低纵横比特征空腔）上，然后进行金属电镀以填充宽特征空腔并形成压花结构，其中宽特征在金属填充的宽特征空腔上的金属突起高于金属在场区域的高度，大多数覆盖层金属被使用非接触技术（例如化学湿法蚀刻）去除，在宽特征腔上方的金属保护金属在一些实施例中，将金属电镀到衬底上以填充狭窄（例如，高纵横比特征腔），并且可以避免金属互连和介电绝缘层的侵蚀。在介电层中选择性地施加电镀加速器和填充宽特征腔。

5. 发明申请

US20100119811A1 CONDUCTIVE POLISHING PAD AND METHOD FOR MAKING THE SAME 有权
标题翻译：导电抛光垫及其制造方法
公开(公告)号：US20100119811A1
公开(公告)日：2010-05-13
申请号：US12427259
申请日：2009-04-21
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
IPC分类号： B24B29/00 , B05D1/36 , B05D5/00 , B32B3/26
CPC分类号： B24B37/22 , B23H5/08 , B24B37/24 , B32B3/266 , B32B5/022 , B32B27/08 , B32B27/12 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/40 , B32B2255/26 , B32B2307/7265 , B32B2307/728 , D06M15/227 , D06M15/263 , D06M15/507 , D06M15/564 , D06N3/042 , D06N3/045 , D06N3/123 , D06N3/14 , D06N2209/041 , D06N2209/105 , D06N2209/141 , D06N2213/04 , D06P1/5221 , D06P1/5271 , D06P1/5285 , Y10T428/249981
摘要： The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.
摘要翻译：导电性抛光垫及其制造方法技术领域本发明涉及导电性抛光垫及其制造方法。导电抛光垫包括底层，导电膜和抛光层。底层包括第一高聚物和纤维基质。第一高分子聚合物覆盖纤维基底，并具有多个第一孔。导电膜设置在底层上。抛光层设置在导电膜上，并包括第二高聚物。第二高分子具有多个第二孔。即使底层和抛光层是不良导体，其导电性也被导电膜提高，因此抛光垫具有良好的导电性。此外，抛光垫具有柔性表面，其防止抛光时工件表面被抛光而被划伤。

6. 发明授权

US07618529B2 Polishing pad for electrochemical mechanical polishing 失效
标题翻译：抛光垫进行电化学机械抛光
公开(公告)号：US07618529B2
公开(公告)日：2009-11-17
申请号：US10854321
申请日：2004-05-25
申请人： Joseph G. Ameen , David B. James
发明人： Joseph G. Ameen , David B. James
IPC分类号： B23H5/08
CPC分类号： B24B37/24 , B23H5/08 , B24D3/28 , C25F7/00
摘要： The present invention provides polishing pad for electrochemical mechanical polishing. The pad comprises a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm.
摘要翻译：本发明提供了用于电化学机械抛光的抛光垫。衬垫包括覆盖导电衬底的多孔聚合物层，多孔聚合物层具有小于1.5mm的厚度。

7. 发明申请

US20090277867A1 Topography reduction and control by selective accelerator removal 有权
标题翻译：通过选择性促进剂去除的地形减少和控制
公开(公告)号：US20090277867A1
公开(公告)日：2009-11-12
申请号：US11602128
申请日：2006-11-20
申请人： Steven T. Mayer , Mark L. Rea , Richard S. Hill , Avishai Kepten , R. Marshall Stowell , Eric G. Webb
发明人： Steven T. Mayer , Mark L. Rea , Richard S. Hill , Avishai Kepten , R. Marshall Stowell , Eric G. Webb
IPC分类号： B44C1/22 , B05D5/12
CPC分类号： C25D17/14 , B23H5/08 , C25D5/02 , C25D5/06 , C25D5/08 , C25D5/34 , C25D7/123 , C25D17/001 , C25D17/06 , C25F3/16 , C25F3/30 , H01L21/02068 , H01L21/2885 , H01L21/32115 , H01L21/3212 , H01L21/32134 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： Plating accelerator is applied selectively to a substantially-unfilled wide (e.g., low-aspect-ratio feature cavity. Then, plating of metal is conducted to fill the wide feature cavity and to form an embossed structure in which the height of a wide-feature metal protrusion over the metal-filled wide-feature cavity is higher than the height of metal over field regions. Most of the overburden metal is removed using non-contact techniques, such as chemical wet etching. Metal above the wide feature cavity protects the metal-filled wide-feature interconnect against dishing, and improved planarization techniques avoid erosion of the metal interconnect and dielectric insulating layer. In some embodiments, plating of metal onto a substrate is conducted to fill narrow (e.g., high-aspect-ratio feature cavities) in the dielectric layer before selective application of plating accelerator and filling of the wide feature cavity.
摘要翻译：电镀加速器选择性地施加到基本上未填充的宽（例如，低纵横比特征空腔）上，然后进行金属电镀以填充宽特征空腔并形成压花结构，其中宽特征在金属填充的宽特征空腔上的金属突起高于金属在场区域的高度，大多数覆盖层金属被使用非接触技术（例如化学湿法蚀刻）去除，在宽特征腔上方的金属保护金属在一些实施例中，将金属电镀到衬底上以填充狭窄（例如，高纵横比特征腔），并且可以避免金属互连和介电绝缘层的侵蚀。在介电层中选择性地施加电镀加速器和填充宽特征腔。

8. 发明授权

US07576007B2 Method for electrochemically mechanically polishing a conductive material on a substrate 失效
标题翻译：在基板上进行电化学机械研磨导电材料的方法
公开(公告)号：US07576007B2
公开(公告)日：2009-08-18
申请号：US11328958
申请日：2006-01-09
申请人： You Wang , Zhihong Wang , Renhe Jia , Stan D. Tsai , Yongqi Hu
发明人： You Wang , Zhihong Wang , Renhe Jia , Stan D. Tsai , Yongqi Hu
IPC分类号： H01L21/302
CPC分类号： H01L21/7684 , B23H5/08 , H01L21/32125
摘要： Aspects of the present invention include a method and an apparatus that may be utilized to reduce dishing and improve cleaning efficiency of a material layer residue (e.g., copper residual) by varying a substrate potential in a substrate processing system. For example, by utilizing multiple polishing steps and applying different voltages (e.g., while a substrate is being in a polishing station), ECMP can be used to effectively reduce dishing and it can be used to enhance copper residual cleaning as well as minimizing a possibility of arcing, which can occur at the end of the polishing process, when a substrate is moved from a polishing station.
摘要翻译：本发明的方面包括可以通过改变衬底处理系统中的衬底电位来减少凹陷并提高材料层残留物（例如铜残留物）的清洁效率的方法和装置。例如，通过利用多个抛光步骤和施加不同的电压（例如，当衬底处于抛光站中时），ECMP可以用于有效地减少凹陷，并且可以用于增强铜残留清洁以及最小化可能性当抛光工位移动基板时，可能在抛光过程结束时发生电弧。

9. 发明授权

US07569135B2 Electrolytic processing apparatus and substrate processing apparatus and method 失效
标题翻译：电解处理装置及基板处理装置及方法
公开(公告)号：US07569135B2
公开(公告)日：2009-08-04
申请号：US11723934
申请日：2007-03-22
申请人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
发明人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
IPC分类号： C25F3/16 , B23H5/06
CPC分类号： C25F7/00 , B23H3/00 , B23H3/04 , B23H3/08 , B23H5/08 , B24B37/04 , C25F3/00 , C25F5/00 , H01L21/32115 , H01L21/3212
摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.
摘要翻译：本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或者基板和供电电极之间的至少一个的离子交换器，用于在存在的工件的表面进行电解处理通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。

10. 发明授权

US07566391B2 Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media 失效
标题翻译：用有机和/或非水电解介质从微型工件除去材料的方法和系统
公开(公告)号：US07566391B2
公开(公告)日：2009-07-28
申请号：US10933053
申请日：2004-09-01
申请人： Whonchee Lee , Gundu M. Sabde
发明人： Whonchee Lee , Gundu M. Sabde
IPC分类号： C25F3/16
CPC分类号： H01L21/30625 , B23H5/08 , C25F1/00 , C25F3/02 , C25F3/08
摘要： Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.
摘要翻译：公开了从微特征工件中去除材料的方法和系统。根据本发明的一个实施例的方法包括提供具有基底材料和包括难熔金属（例如钽，氮化钽，钛和/或氮化钛）的导电材料的微特征工件。第一和第二电极经由通常有机和/或非水电解介质与导电材料电连通。至少一个电极与工件间隔开。通过使电流沿着包括第一电极，电解介质和第二电极的电路通过电流来去除导电材料的至少一部分。电解去除导电材料可以降低施加到工件的下压力。

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