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1. 发明申请

US20070187257A1 Electrolytic processing apparatus and electrolytic processing method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070187257A1
公开(公告)日：2007-08-16
申请号：US10592673
申请日：2005-03-16
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
IPC分类号： B23H7/00
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00 , H01L21/32125
摘要： An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal
摘要翻译：电解处理装置可以保持工件表面中的凹部和凸起部之间的电阻差，从而提供具有改善的平坦度的加工表面。电解处理装置包括：能够与工件接触或闭合的处理电极; 用于向工件供电的供电电极; 设置在工件与处理电极和供电电极中的至少一个之间的接触构件，通过从工件施加的接触载荷为微小的所述接触构件的变形程度为小

2. 发明申请

US20140030826A1 POLISHING METHOD 审中-公开
标题翻译：抛光方法
公开(公告)号：US20140030826A1
公开(公告)日：2014-01-30
申请号：US13556568
申请日：2012-07-24
申请人： Shinrou Ohta , Toshikazu Nomura , Takeshi Iizumi
发明人： Shinrou Ohta , Toshikazu Nomura , Takeshi Iizumi
IPC分类号： H01L21/66
CPC分类号： H01L22/14 , B24B37/013 , B24B37/042 , B24B49/105 , H01L21/02074 , H01L21/3212 , H01L21/7684 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： A method of polishing a wafer having a Ru film and a Ta film or TaN film beneath the Ru film is provided. This polishing method includes: polishing the Ru film by bringing the wafer into sliding contact with a polishing pad; measuring a thickness of the Ru film by a film thickness sensor while polishing the Ru film; calculating a derivative value of an output value of the film thickness sensor; detecting a predetermined point of change in the derivative value; and determining a removal point of the Ru film from a point of time when the point of change is detected.
摘要翻译：提供了在Ru膜下方研磨具有Ru膜和Ta膜或TaN膜的晶片的方法。该抛光方法包括：通过使晶片与抛光垫滑动接触来研磨Ru膜; 在研磨Ru膜的同时通过膜厚传感器测量Ru膜的厚度; 计算膜厚传感器的输出值的导数值; 检测所述导数值的预定变化点; 并且从检测到变化点的时间点确定Ru膜的去除点。

3. 发明申请

US20070272562A1 Electrolytic Processing Apparatus and Electrolytic Processing Method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070272562A1
公开(公告)日：2007-11-29
申请号：US10560623
申请日：2004-07-14
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
IPC分类号： H01L21/3063
CPC分类号： C25F3/00 , C25F7/00
摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can effectively prevent the formation of pits that would impair the quality of the processed product. The electrolytic processing apparatus including: a processing electrode (210) for processing a workpiece; a feeding electrode (212) for feeding electricity to the workpiece; a power source (232) for applying a voltage between the processing electrode (210) and the feeding electrode (212); a pressure tight container (200) housing the processing electrode (210) and the feeding electrode (212) therein; and a high-pressure liquid supply system (204) for supplying a high-pressure liquid into the pressure tight container (210).
摘要翻译：本发明提供一种电解处理装置和电解处理方法，其可以有效地防止会影响加工产品质量的凹坑的形成。电解处理装置包括：处理工件的处理电极; 用于向工件供电的供电电极（212）; 用于在处理电极（210）和馈电电极（212）之间施加电压的电源（232）; 容纳所述处理电极（210）和所述馈电电极（212）的压力容器（200）; 以及用于将高压液体供应到耐压容器（210）中的高压液体供给系统（204）。

4. 发明申请

US20050035001A1 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050035001A1
公开(公告)日：2005-02-17
申请号：US10914190
申请日：2004-08-10
申请人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
发明人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
IPC分类号： B23H3/00 , C25D5/02 , C25F7/02
CPC分类号： C25F7/02
摘要： There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.
摘要翻译：提供一种电解处理装置和电解处理方法，其可以以提高的离子交换容量的再生速率再生离子交换器，而不会不利地影响装置的生产量。电解处理装置包括：用于保持工件的保持器; 电极部分，包括电极，接触部件和用于在处理期间从工件中取出的金属离子放电到接触部件中的放电部分，所述电极部分靠近或与保持件保持的工件接触或接触在液体存在下对工件进行加工; 以及能够靠近或与接触构件接触的再生虚拟电极。

5. 发明申请

US20070095659A1 Electrolytic processing apparatus and electrolytic processing method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070095659A1
公开(公告)日：2007-05-03
申请号：US10559724
申请日：2004-07-28
申请人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
发明人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
IPC分类号： C25D17/00
CPC分类号： C25F7/00 , H01L21/32115
摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can perform processing of a substrate without destroying devices formed in the substrate even when a fragile material is employed in the substrate and which can reduce non-uniformity in the contact pressure of an electrode member on a substrate during processing, thereby equalizing the processing amount in the entire processing surface of the substrate and the surface roughness after processing. The electrolytic processing apparatus includes: a substrate holder for holding a substrate; an electrode base provided with an electrode member for contact with the substrate, held by the substrate holder, in the presence of a liquid to effect processing of the substrate; and a support base for floatingly supporting the electrode base by a floating mechanism.
摘要翻译：本发明提供一种电解处理装置和电解处理方法，其即使在基板中使用易碎材料，也可以在不破坏形成在基板中的装置的情况下进行基板的处理，并且可以降低基板的接触压力的不均匀性电极部件在处理时在基板上，从而使基板的整个加工面的加工量与加工后的表面粗糙度相等。电解处理装置包括：用于保持基板的基板保持件; 电极基体，设置有用于与所述基板接触的电极部件，所述电极部件由所述基板保持件保持在所述液体的存在下，以进行所述基板的加工; 以及用于通过浮动机构浮动地支撑电极基座的支撑基座。

6. 发明申请

US20060144711A1 Electrochemical machining device and electrochemical machining method 审中-公开
标题翻译：电化学加工装置和电化学加工方法
公开(公告)号：US20060144711A1
公开(公告)日：2006-07-06
申请号：US10534232
申请日：2003-07-18
申请人： Itsuki Kobata , Masayuki Kumekawa , Osamu Nabeya , Roberto Serikawa , Takayuki Saito , Tsukuru Suzuki , Akira Kodera , Hozumi Yasuda , Takeshi Iizumi , Mitsuhiko Shirakashi
发明人： Itsuki Kobata , Masayuki Kumekawa , Osamu Nabeya , Roberto Serikawa , Takayuki Saito , Tsukuru Suzuki , Akira Kodera , Hozumi Yasuda , Takeshi Iizumi , Mitsuhiko Shirakashi
IPC分类号： B23H7/20
CPC分类号： B23H3/02 , B23H5/08 , B23H9/00
摘要： A object of this invention is to provide an electrolytic processing method and apparatus that can suppress a change in the electric conductivity of a fluid due to contaminants, such as processing products produced in electrolytic processing, so that the fluid can maintain good flattening properties. The electrolytic processing apparatus of this invention includes: a processing electrode (42) that can come into contact with a workpiece (W); a feeding electrode (44) for feeding electricity to the workpiece (W); a holder (22) for holding the workpiece (W); a power source (26) for applying a voltage between the processing electrode (42) and the feeding electrode (44); a fluid supply section (50) for supplying a fluid between the workpiece (W) and at least one of the processing electrode (42) and the feeding electrode (44); a sensor (80) for measuring the electric conductivity of the fluid; and a control section (84) for changing the processing conditions based on the electric conductivity measured by the sensor (80).
摘要翻译：本发明的目的是提供一种电解处理方法和装置，其可以抑制由电解处理中产生的加工产品等污染物引起的流体的导电性变化，使得流体能够保持良好的平坦化性能。本发明的电解处理装置包括：可与工件（W）接触的处理电极（42）; 用于向工件（W）供电的供电电极（44）; 用于保持工件（W）的保持器（22）; 用于在处理电极（42）和馈电电极（44）之间施加电压的电源（26）; 用于在工件（W）和处理电极（42）和馈电电极（44）中的至少一个之间供应流体的流体供应部分（50）; 用于测量流体的电导率的传感器（80）; 以及用于根据由传感器（80）测量的电导率来改变处理条件的控制部分（84）。

7. 发明授权

US07578920B2 Electrolytic processing method 有权
标题翻译：电解加工方法
公开(公告)号：US07578920B2
公开(公告)日：2009-08-25
申请号：US10948320
申请日：2004-09-24
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
IPC分类号： C25D21/12 , C25F3/02
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus can detect the end point of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus includes: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss. The sensor is disposed not in contact with (or separately) by an insulator from the processing electrode and/or the feeding electrode.
摘要翻译：电解处理装置可以以高精度和相对简单的结构稳定地检测电解处理的终点。电解处理装置包括：处理电极，其能够接近或与处理对象接触; 用于向处理对象供电的馈电电极; 流体供应部分，用于在处理对象与处理电极和馈送电极中的至少一个之间提供流体; 用于在处理电极和馈电电极之间施加电压的处理电源; 驱动部，其用于使处理对象与所述处理电极和所述馈送电极中的至少一个相对移动; 以及用于从涡流损耗的变化中检测加工对象的厚度的涡流传感器。传感器设置成不与来自处理电极和/或馈电电极的绝缘体接触（或单独地）接触。

8. 发明授权

US07476303B2 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07476303B2
公开(公告)日：2009-01-13
申请号：US10914190
申请日：2004-08-10
申请人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
发明人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
IPC分类号： C25F3/16 , B23H5/06 , B23H5/10 , B23H5/14
CPC分类号： C25F7/02
摘要： There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.
摘要翻译：提供一种电解处理装置和电解处理方法，其可以以提高的离子交换容量的再生速率再生离子交换器，而不会不利地影响装置的生产量。电解处理装置包括：用于保持工件的保持器; 电极部分，包括电极，接触部件和用于在处理期间从工件中取出的金属离子放电到接触部件中的放电部分，所述电极部分靠近或与保持件保持的工件接触或接触在液体存在下对工件进行加工; 以及能够靠近或与接触构件接触的再生虚拟电极。

9. 发明申请

US20050067289A1 Electrolytic processing apparatus and electrolytic processing method 有权
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050067289A1
公开(公告)日：2005-03-31
申请号：US10948320
申请日：2004-09-24
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
IPC分类号： C25C7/06 , C25F7/00
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus can detect the endpoint of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus including: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss, said sensor being disposed not in contact with or separately by an insulator from the processing electrode and/or the feeding electrode.
摘要翻译：电解处理装置能够以高精度和相对简单的结构稳定地检测电解加工的终点。该电解处理装置包括：处理电极，其能够接近或与处理对象接触; 用于向处理对象供电的馈电电极; 流体供应部分，用于在处理对象与处理电极和馈送电极中的至少一个之间提供流体; 用于在处理电极和馈电电极之间施加电压的处理电源; 驱动部，其用于使处理对象与所述处理电极和所述馈送电极中的至少一个相对移动; 以及涡流传感器，用于根据涡流损耗的变化来检测加工对象的厚度，所述传感器被设置成不与处理电极和/或馈电电极接触或分离。

10. 发明授权

US07638030B2 Electrolytic processing apparatus and electrolytic processing method 有权
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07638030B2
公开(公告)日：2009-12-29
申请号：US10669468
申请日：2003-09-25
申请人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
发明人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
IPC分类号： C25F7/00 , B23H5/06
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.
摘要翻译：一种在完全消除CMP处理或者尽可能减少CMP处理负荷的电解处理装置可以处理和平坦化形成在基板表面上的导电材料，或者可以除去（清洁）附着的附着物到工件（例如基板）的表面。本发明包括一个电极部分，它包括平行设置的多个电极部件，每个电极部件包括一个电极和一个覆盖电极表面的离子交换器，一个用于保持工件的保持器，它能使工件靠近或与电极部件的离子交换器接触，以及要连接到电极部分的每个电极部件的电极的电源。电极构件的离子交换器包括具有优异表面平滑度的离子交换器和离子交换容量大的离子交换器。

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