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1. 发明申请

US20070173177A1 Substrate polishing apparatus 有权
公开(公告)号：US20070173177A1
公开(公告)日：2007-07-26
申请号：US11727727
申请日：2007-03-28
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

2. 发明授权

US07507144B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07507144B2
公开(公告)日：2009-03-24
申请号：US11727727
申请日：2007-03-28
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
摘要翻译：基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。抛光垫在其中形成有通孔。基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。发光和接收装置设置在抛光台中。衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。供给通道具有可拆卸地安装在抛光台上的出口部分。衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。

3. 发明申请

US20060105679A1 Substrate polishing apparatus 有权
公开(公告)号：US20060105679A1
公开(公告)日：2006-05-18
申请号：US11274112
申请日：2005-11-16
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

4. 发明授权

US07214122B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07214122B2
公开(公告)日：2007-05-08
申请号：US11274112
申请日：2005-11-16
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
摘要翻译：基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。抛光垫在其中形成有通孔。基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。发光和接收装置设置在抛光台中。衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。供给通道具有可拆卸地安装在抛光台上的出口部分。衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。

5. 发明申请

US20070042679A1 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US20070042679A1
公开(公告)日：2007-02-22
申请号：US10558257
申请日：2004-05-19
申请人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
发明人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
IPC分类号： B24B49/00 , B24B29/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving device (24) to emit measurement light from the polishing table (12) to the substrate (20) and to receive reflected light from the substrate (20) for measuring a film on the substrate (20), a fluid supply passage (42) for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber (68) provided at a light-emitting and light-receiving position of the polishing table (12), and a fluid supply control device (56, 58) for controlling supply of the measurement fluid to the fluid chamber (68).
摘要翻译：基板研磨装置（10）将基板（20）抛光成平面镜面。基板研磨装置（10）具有：被加压基板（20）的研磨台（12），从研磨台（12）向基板发射测定光的发光和受光装置（24）（20）接收来自基板（20）的反射光，用于测量基板（20）上的薄膜;流体供给通道（42），用于将测量光和反射光通过的测量流体通过，设置在所述研磨台（12）的发光和受光位置处的流体室（68）和用于控制向所述流体室（68）供给所述测量流体的流体供应控制装置（56,58）。

6. 发明授权

US07547242B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07547242B2
公开(公告)日：2009-06-16
申请号：US10558257
申请日：2004-05-19
申请人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
发明人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
IPC分类号： B24B49/00 , B24B29/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.
摘要翻译：基板研磨装置将基板抛光成平面镜面。基板研磨装置具有：被加压基板的研磨台，发光和受光装置，用于将来自研磨台的测量光发射到基板，并接收来自基板的反射光，以测量基板上的膜用于将测量光和反射光通过的测量流体供应到设置在抛光台的发光和光接收位置处的流体室的流体供给通道和用于控制的流体供应控制装置将测量流体供应到流体室。

7. 发明授权

US07101257B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07101257B2
公开(公告)日：2006-09-05
申请号：US10617789
申请日：2003-07-14
申请人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinro Ohta , Yasuo Tsukuda
发明人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinro Ohta , Yasuo Tsukuda
IPC分类号： B24B49/00 , B24B5/02
CPC分类号： B24B37/12 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.
摘要翻译：衬底抛光装置将诸如半导体晶片的衬底抛光成平面镜面。基板研磨装置具有：被加压基板的研磨台和发光和受光装置，用于将来自研磨台的测量光发射到基板，并接收来自基板的反射光，以测量基板上的膜。衬底抛光装置还具有用于将测量光和反射光通过的用于测量的流体供给到设置在抛光台的发光和光接收位置处的流体室的流体供给通道，以及流体供应控制装置，用于控制向流体室供给测量用流体。

8. 发明申请

US20090191790A1 SUBSTRATE POLISHING APPARATUS 有权
标题翻译：基板抛光装置
公开(公告)号：US20090191790A1
公开(公告)日：2009-07-30
申请号：US12372076
申请日：2009-02-17
申请人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi KOBAYASHI , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
摘要翻译：用于抛光基板的抛光表面的基板抛光装置具有用于在抛光期间监测基板的研磨表面上的薄膜的膜厚状态的膜厚监视装置。该装置包括：台子，固定在工作台的表面上的抛光部件，用于将基板按压到研磨部件上的基板支撑部件;光学系统，其由用于向基板的研磨面照射基板的光照射和用于接收在基板的研磨表面上反射的反射光的光纤，用于处理由光学系统接收的反射光的分析的分析处理系统和膜厚监视装置。该台设置有用于将半透明液体供给到设置在抛光构件中的通孔中的供液口。

9. 发明授权

US07438627B2 Polishing state monitoring method 有权
标题翻译：抛光状态监测方法
公开(公告)号：US07438627B2
公开(公告)日：2008-10-21
申请号：US11819453
申请日：2007-06-27
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Junki Ishimoto , Kazunari Shinya
IPC分类号： B24B1/00 , B24B49/00 , B24B51/00
CPC分类号： B24B49/12 , B24B37/013
摘要： A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
摘要翻译：抛光状态监视装置测量被抛光表面的特征值，以确定抛光终点的定时。抛光状态监视装置包括用于将光从光源施加到被抛光的工件的表面的发光单元，用于接收来自工件表面的反射光的光接收单元，用于将反射的由光接收单元接收的多个光具有各自的波长的光;以及用于将检测到的光线累积的光接收元件作为电信息。抛光状态监视装置还包括：光谱数据发生器，用于读取由光接收元件累积的电信息并产生反射光的光谱数据;以及处理器，用于基于工件的表面计算工件表面上的预定特征值光谱数据生成器生成的光谱数据。

10. 发明授权

US07510460B2 Substrate polishing apparatus 有权
公开(公告)号：US07510460B2
公开(公告)日：2009-03-31
申请号：US11806445
申请日：2007-05-31
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

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