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    • 42. 发明申请
    • Method of forming fine patterns using double patterning process
    • 使用双重图案化工艺形成精细图案的方法
    • US20080113511A1
    • 2008-05-15
    • US11730264
    • 2007-03-30
    • Sang-joon ParkYong-hyun KwonJun SeoSung-il ChoChang-jin KangJae-kyu Ha
    • Sang-joon ParkYong-hyun KwonJun SeoSung-il ChoChang-jin KangJae-kyu Ha
    • H01L21/311
    • H01L21/0337H01L21/0338H01L21/31144H01L21/76816H01L21/76897
    • A double pattern method of forming a plurality of contact holes in a material layer formed on a substrate is disclosed. The method forms a parallel plurality of first hard mask patterns separated by a first pitch in a first direction on the material layer, a self-aligned parallel plurality of second hard mask patterns interleaved with the first hard mask patterns and separated from the first hard mask patterns by a buffer layer to form composite mask patterns, and a plurality of upper mask patterns in a second direction intersecting the first direction to mask selected portions of the buffer layer in conjunction with the composite mask patterns. The method then etches non-selected portions of the buffer layer using the composite hard mask patterns and the upper mask patterns as an etch mask to form a plurality of hard mask holes exposing selected portions of the material layer, and then etches the selected portions of the material layer to form the plurality of contact holes.
    • 公开了一种在形成在基板上的材料层中形成多个接触孔的双重图案方法。 该方法形成在材料层上沿第一方向以第一间距分开的平行多个第一硬掩模图案,与第一硬掩模图案交错并与第一硬掩模分离的自对准并行多个第二硬掩模图案 通过缓冲层形成图案以形成复合掩模图案,以及与第一方向相交的第二方向的多个上掩模图案,以与复合掩模图案一起掩蔽缓冲层的选定部分。 然后,该方法使用复合硬掩模图案和上掩模图案作为蚀刻掩模蚀刻缓冲层的未选择部分,以形成暴露材料层的选定部分的多个硬掩模孔,然后蚀刻所选择的部分 所述材料层形成所述多个接触孔。
    • 44. 发明授权
    • Asymmetric source/drain transistor employing selective epitaxial growth (SEG) layer and method of fabricating same
    • 采用选择性外延生长(SEG)层的不对称源极/漏极晶体管及其制造方法
    • US07221023B2
    • 2007-05-22
    • US11067410
    • 2005-02-25
    • Hyeoung-Won SeoNak-Jin SonDu-Heon SongJun Seo
    • Hyeoung-Won SeoNak-Jin SonDu-Heon SongJun Seo
    • H01L27/01H01L27/12H01L31/0392
    • H01L29/66636H01L29/78Y10S438/942
    • According to some embodiments of the invention, a method includes preparing a semiconductor substrate having an active region, doping channel ions in the active region, forming a planarized selective epitaxial growth (SEG) layer in a predetermined region of the active region doped with the channel ions, sequentially forming a gate insulating layer, a gate conductive layer and a gate hard mask layer on the semiconductor substrate having the planarized SEG layer, forming a gate pattern crossing the active region by sequentially patterning the gate hard mask layer and the gate conductive layer, the planarized SEG layer being located at one side of the gate pattern, and forming source/drain regions by implanting impurity ions using the gate pattern as an ion implantation mask. Accordingly, there is provided an asymmetric source/drain transistor capable of preventing a leakage current by diffusing the channel ions into the SEG layer.
    • 根据本发明的一些实施例,一种方法包括制备具有有源区的半导体衬底,在有源区中掺杂沟道离子,在掺杂有沟道的有源区的预定区域中形成平面化选择性外延生长(SEG)层 离子,在具有平坦化SEG层的半导体衬底上依次形成栅极绝缘层,栅极导电层和栅极硬掩模层,通过顺序构图栅极硬掩模层和栅极导电层形成与有源区交叉的栅极图案 ,平面化SEG层位于栅极图案的一侧,并且通过使用栅极图案作为离子注入掩模注入杂质离子来形成源极/漏极区域。 因此,提供了一种不对称源/漏晶体管,其能够通过将沟道离子扩散到SEG层中来防止漏电流。
    • 45. 发明申请
    • High power light emitting diode package
    • 大功率发光二极管封装
    • US20070075325A1
    • 2007-04-05
    • US11541658
    • 2006-10-03
    • Jong BaekJe ParkGeun RyoJun SeoJung Park
    • Jong BaekJe ParkGeun RyoJun SeoJung Park
    • H01L33/00
    • H01L25/0753F21K9/68H01L33/60H01L33/64H01L33/642H01L2224/48091H01L2224/48137H01L2924/00014H01L2924/00
    • The invention relates to a high power LED package having excellent light efficiency and heat dissipating characteristics. The LED package includes a base member, a reflector unit arranged on the base member and having a plurality of first reflectors, a plurality of LED chips mounted on the base member and surrounded by the first reflectors, and a connection unit arranged on the base member, for electrically connecting the LED chips to an outside. The reflector unit also includes a second reflector surrounding the first reflectors. The second reflector is arranged to surround the first reflectors in order to completely prevent any interference of emission lights and collect the emission lights together, thereby enabling excellent light efficiency. Furthermore, with the first reflectors surrounding the individual LED chips, it is possible to maximize heat dissipating efficiency of the lead frame, thereby stabilizing operating characteristics of the package.
    • 本发明涉及具有优异的光效率和散热特性的大功率LED封装。 所述LED封装包括基底构件,布置在所述基底构件上并具有多个第一反射器的反射器单元,安装在所述基座构件上并被所述第一反射器包围的多个LED芯片,以及布置在所述基座构件上的连接单元 ,用于将LED芯片电连接到外部。 反射器单元还包括围绕第一反射器的第二反射器。 第二反射器被布置为围绕第一反射器以完全防止发射光的任何干扰并将发射光聚集在一起,从而实现优异的光效率。 此外,通过围绕各个LED芯片的第一反射器,可以使引线框架的散热效率最大化,从而稳定封装的工作特性。
    • 49. 发明申请
    • Methods of Fabricating Field Effect Transistors Having Protruded Active Regions
    • 制造具有突出活动区域的场效应晶体管的方法
    • US20110095345A1
    • 2011-04-28
    • US12977811
    • 2010-12-23
    • Ji-Young LeeJun Seo
    • Ji-Young LeeJun Seo
    • H01L29/78
    • H01L29/1037H01L21/76229H01L27/105H01L29/66621H01L29/7834
    • Provided are a field effect transistor, a method of manufacturing the same, and an electronic device including the field effect transistor. The field effect transistor may have a structure in which a double gate field effect transistor and a recess channel array transistor are formed in a single transistor in order to improve a short channel effect which occurs as field effect transistors become more highly integrated, a method of manufacturing the same, and an electronic device including the field effect transistor. The field effect transistor can exhibit stable device characteristics even when more highly integrated in such a manner that both the length and width of a channel increase and particularly the channel can be significantly long, and can be manufactured simply.
    • 提供了场效应晶体管,其制造方法以及包括场效应晶体管的电子器件。 场效应晶体管可以具有在单个晶体管中形成双栅极场效应晶体管和凹槽沟道阵列晶体管的结构,以便改善随着场效应晶体管变得更高度集成而发生的短沟道效应, 制造它们,以及包括场效应晶体管的电子器件。 即使当以通道的长度和宽度都增加并且特别是通道可以显着长的方式更高度集成时,场效应晶体管也可以表现出稳定的器件特性,并且可以简单地制造。