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    • 19. 发明授权
    • Semiconducting polycrystalline diamond electronic devices employing an
insulating diamond layer
    • 使用绝缘金刚石层的半导体多晶金刚石电子器件
    • US5173761A
    • 1992-12-22
    • US646848
    • 1991-01-28
    • David L. DreifusKumar DasKoichi MiyataKoji Kobashi
    • David L. DreifusKumar DasKoichi MiyataKoji Kobashi
    • C23C14/06C30B29/04H01L21/04H01L21/205H01L21/265H01L29/16H01L29/78H01L29/80H01L29/861
    • H01L29/1602H01L29/6603H01L29/66045Y10S257/921
    • A method and apparatus for contructing diamond semiconductor structures made of polycrystalline diamond thin films is disclosed. The use of a polycrystalline diamond deposition on a substrate material provides an advantage that any substrate material may be used and the ability to use polycrystalline diamond as a material is brought about through the use of an undoped diamond layer acting as an insulating layer which is formed on a boron-doped layer. Because of the structure, ion implantation can be employed to reduce the ohmic contact resistance. The ion implantation also provides that the entire structure can be made using a deep implant to form a channel layer which allows the insulating gate structure to be formed as an integral part of the device. The buried channel can be doped through the use of several implantation steps through the insulating undoped layer. As a result, the process and device is able to provide active polycrystallline diamond devices which have excellent resistance and reverse voltage characteristics while having an increased temperature capacity and increased range of operational environmental conditions when contrasted with the silicon technology. Furthermore with the disclosed process and devices, there is no requirement for a single crystal diamond substrate.
    • 公开了一种用于构造由多晶金刚石薄膜制成的金刚石半导体结构的方法和装置。 在衬底材料上使用多晶金刚石沉积提供了可以使用任何衬底材料的优点,并且通过使用形成绝缘层的未掺杂的金刚石层来形成使用多晶金刚石作为材料的能力 在硼掺杂层上。 由于结构,可以使用离子注入来降低欧姆接触电阻。 离子注入还提供了整个结构可以使用深度注入来形成沟道层,其允许绝缘栅极结构形成为器件的组成部分。 可以通过使用几个注入步骤穿过绝缘未掺杂层来掺杂掩埋沟道。 因此,与硅技术相比,该工艺和器件能够提供具有优异的电阻和反向电压特性的活性多晶金刚石器件,同时具有增加的温度容量和增加的操作环境条件的范围。 此外,通过公开的方法和装置,不需要单晶金刚石基底。