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1. 发明公开

KR20070074363A SEMICONDUCTOR PACKAGE IMPROVING SOLDER JOINT RELIABILITY AND MANUFACTURING METHOD THE SAME 无效
标题翻译：提高焊接接头可靠性和制造方法的SEMICONDUCTOR PACKAGE
公开(公告)号：KR20070074363A
公开(公告)日：2007-07-12
申请号：KR20060002379
申请日：2006-01-09
申请人： SAMSUNG ELECTRONICS CO LTD
发明人： KIM SHIN , OH SE YONG
IPC分类号： H01L21/60
CPC分类号： H01L23/49816 , H01L23/3677 , H01L23/49827 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/15183 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K3/3436 , H05K2201/09572 , H05K2201/10666 , H05K2203/1394 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package with an improved solder joint reliability and a manufacturing method thereof are provided to enhance thermal and mechanical shock characteristics of the semiconductor package itself by using a solder connection part. A semiconductor package includes a PCB(Printed Circuit Board) on which a PSR(Photo Solder Resist) is coated, an adhesive member, a semiconductor chip and a solder connection part. The PCB includes a plurality of metal line layers(107) and a plurality of through holes. The adhesive member(104) is attached on an upper surface of the PCB. The semiconductor chip(102) is electrically connected with the metal line layers of the PCB. The semiconductor chip is mounted on the adhesive member. The solder connection part(110) is filled in the through hole.
摘要翻译：提供了具有改进的焊点可靠性的半导体封装及其制造方法，以通过使用焊料连接部来提高半导体封装本身的热和机械冲击特性。半导体封装包括其上涂覆有PSR（光阻焊）的PCB（印刷电路板），粘合构件，半导体芯片和焊料连接部。 PCB包括多个金属线层（107）和多个通孔。粘合剂构件（104）附着在PCB的上表面上。半导体芯片（102）与PCB的金属线层电连接。半导体芯片安装在粘合部件上。焊料连接部（110）填充在通孔中。

2. 发明授权

KR100244965B1 인쇄회로기판과 볼 그리드 어레이 패키지의 제조 방법 失效
标题翻译：制造PCB和BGA封装的方法
公开(公告)号：KR100244965B1
公开(公告)日：2000-02-15
申请号：KR1019970038466
申请日：1997-08-12
申请人： 삼성전자주식회사
发明人： 안은철 , 하웅기 , 이영민
IPC分类号： H01L23/02
CPC分类号： H01L21/486 , H01L23/055 , H01L23/3677 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/0201 , H05K1/0206 , H05K3/28 , H05K3/3457 , H05K3/3484 , H05K3/42 , H05K2201/09572 , H05K2203/041 , Y10T29/49144 , Y10T29/49158 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A BGA package includes a semiconductor chip, and a PCB having a board body, a plurality of circuit patterns, a plurality of signal via holes, a solder resist, and a plurality of thermal emissive vias. The thermal emissive vias are holes located beneath a chip attach area, and these holes are filled with metal having a low melting point. The metal prevents moisture from being absorbed, while effectively transferring heat. The semiconductor chip is attached to the chip attach area of the PCB and is connected to circuit patterns of the PCB with bonding wires. The bonding wires and the semiconductor chip are encapsulated to protect them from external environmental stress. Solder bumps are formed on circuit patterns of the PCB. The BGA package has advantages in that it prevents moisture from penetrating to the chip through the thermal emissive vias, and effectively transfers the heat generated by the chip to the outside.

3. 发明公开

KR1020090039411A 솔더 볼과 칩 패드가 접합된 구조를 갖는 반도체 패키지,모듈, 시스템 및 그 제조방법 无效
标题翻译：半导体封装，模块，具有连接在芯片上的焊球的系统及其制造方法
公开(公告)号：KR1020090039411A
公开(公告)日：2009-04-22
申请号：KR1020070105040
申请日：2007-10-18
申请人： 삼성전자주식회사
发明人： 김혜진
IPC分类号： H01L23/488
CPC分类号： H01L23/49816 , H01L23/3128 , H01L23/49827 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/05001 , H01L2224/05568 , H01L2224/05644 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06558 , H01L2225/06565 , H01L2924/00014 , H01L2924/01327 , H01L2924/15311 , H01L2924/181 , H05K3/3436 , H05K2201/09572 , H05K2201/10666 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A module, a system and a semiconductor package having a structure in which a solder ball and a chip pad are welded in order to arrange a conductor and the solder ball to the penetration hole of the circuit board are provided to exclude the effect of under fill by directly contacting the chip pad on the circuit substrate. A semiconductor package(100) comprises a circuit board(110), a conductor(112), a solder ball(105) and a semiconductor chip(120). The circuit board has a plurality of penetration holes. Conductors surround the side wall of the penetration holes of the circuit board. Solder balls are filled with the penetration holes of the circuit board in order to contact with conductors. The semiconductor chip has chip pad. The semiconductor chip is arranged on the circuit board. The chip pad of the semiconductor chips directly contact solder balls. The semiconductor device module comprises the module PCB and semiconductor packages Semiconductor packages are settled in the module PCB.
摘要翻译：为了排除导体和焊球到电路板的贯通孔，提供焊接有焊球和芯片焊盘的结构的模块，系统和半导体封装，以排除填充的影响通过直接接触电路基板上的芯片焊盘。半导体封装（100）包括电路板（110），导体（112），焊球（105）和半导体芯片（120）。电路板具有多个贯通孔。导体围绕电路板穿透孔的侧壁。焊球填充有电路板的穿透孔，以便与导体接触。半导体芯片具有芯片焊盘。半导体芯片布置在电路板上。半导体芯片的芯片焊盘直接接触焊球。半导体器件模块包括模块PCB和半导体封装。半导体封装安装在模块PCB中。

4. 发明公开

KR1020020074073A 아이씨 방열구조 无效
标题翻译： IC的散热结构
公开(公告)号：KR1020020074073A
公开(公告)日：2002-09-28
申请号：KR1020020012078
申请日：2002-03-07
申请人： 엘지전자 주식회사
发明人： 김종식
IPC分类号： H01L23/36
CPC分类号： H05K1/0206 , H01L23/3677 , H01L2924/0002 , H05K1/0204 , H05K3/341 , H05K3/3447 , H05K3/3468 , H05K3/4038 , H05K2201/0305 , H05K2201/09572 , H05K2201/10416 , H05K2201/10689 , H05K2201/2036 , H01L2924/00
摘要： PURPOSE: A heat-sink structure of an IC(Integrated Circuit) is provided to emit efficiently heat from the IC to the outside by using a solder instead of a heat-sink plate. CONSTITUTION: A plurality of holes(14) are formed on a printed circuit board. A solder land(16) is formed on the printed circuit board. A solder(17) is adhered to the solder land(16). The heat generated from a small package IC(2) is transmitted to the solder(17) contacted with a lower side of the small package IC(2). The solder(17) is formed by a metallic material such as a mixed material of lead, zinc, and tin. The solder(17) is adhered to the solder land(16). The heat is transmitted to the metallic solder(17) adhered to a hole of a lower side of the printed circuit board. The metallic solder(17) is used for performing a function of a heat-sink plate. The heat is emitted through the metallic solder(17) contacted with air.
摘要翻译：目的：提供IC（集成电路）的散热结构，通过使用焊料代替散热板，有效地将IC散热到IC外部。构成：在印刷电路板上形成多个孔（14）。焊盘（16）形成在印刷电路板上。焊料（17）粘附到焊盘（16）上。从小封装IC（2）产生的热量被传送到与小封装IC（2）的下侧接触的焊料（17）。焊料（17）由诸如铅，锌和锡的混合材料的金属材料形成。焊料（17）粘附到焊盘（16）上。热量传递到粘附到印刷电路板的下侧的孔的金属焊料（17）。金属焊料（17）用于执行散热板的功能。热量通过与空气接触的金属焊料（17）发射。

5. 发明授权

KR1019900004636B1 집적회로 패키지 失效
标题翻译：集成电路封装
公开(公告)号：KR1019900004636B1
公开(公告)日：1990-06-30
申请号：KR1019810005217
申请日：1981-12-29
申请人： 허니웰인포오메이션시스템즈인코오포레이티드
发明人： 찬들리에이취막이버
IPC分类号： H01L23/12
CPC分类号： H05K1/0206 , H01L23/3736 , H01L23/3737 , H01L23/42 , H01L24/01 , H01L2924/14 , H01L2924/3011 , H05K3/0061 , H05K3/305 , H05K3/42 , H05K2201/0209 , H05K2201/09572 , H05K2201/10681 , H01L2924/00
摘要： The IC chip has an active face on which is positioned a number of input and output terminals. The chip is mounted on a pad on the top surface of a substrate, around which outer lead pads are positioned. On the back face of the substrate a heat sink pad is located. The position of the sink pad on the substrate is directly opposite that of the chip pad. At least one thermal passage is formed through the substrate to interconnect the chip pad and the heat sink pad on opposite sides. The passage is filled with a good thermally conductive material, and a heat sink is bonded to the heat sink pad.
摘要翻译： IC芯片具有主动面，其上定位有多个输入和输出端子。芯片安装在基板的顶表面上的焊盘上，外部引线焊盘围绕该焊盘定位。在基板的背面设有散热垫。接头焊盘在衬底上的位置与芯片焊盘的位置直接相反。通过基板形成至少一个热通道，以将芯片焊盘和相对两侧的散热垫相互连接。通道填充有良好的导热材料，散热片与散热片接合。

6. 发明公开

KR1020130040140A 커넥터 无效
标题翻译：连接器
公开(公告)号：KR1020130040140A
公开(公告)日：2013-04-23
申请号：KR1020120113019
申请日：2012-10-11
申请人： 타이코 일렉트로닉스 저팬 지.케이.
发明人： 테라지마,케이타
IPC分类号： H01R12/51 , H05K1/14 , H05K1/18
CPC分类号： H01R43/0256 , H01R4/027 , H01R12/58 , H01R13/533 , H05K3/4046 , H05K3/42 , H05K2201/09572 , H05K2201/10242
摘要： PURPOSE: A connector is provided to improve hermeticity by combining a bar-shaped member with a through-hole by soldering. CONSTITUTION: An insulating substrate(11) includes a surface(11a), a rear surface(11b), and a through-hole(11h). A conductive pattern(15) covers an inner wall of the through-hole. A bar-shaped member(16) is stretched to a direction crossing the surface in the through-hole. A first terminal(16a) of the bar-shaped member is protruded from the surface. The first terminal and a second terminal(16b) of the bar-shaped member are in the through-hole. Solder(17) covers the second terminal while sealing a gap of the bar-shaped member and the inner wall of the through-hole.
摘要翻译：目的：通过焊接将棒状构件与通孔组合来提供连接器以提高气密性。构成：绝缘基板（11）包括表面（11a），后表面（11b）和通孔（11h）。导电图案（15）覆盖通孔的内壁。棒状构件（16）被拉伸到与通孔中的表面交叉的方向。棒状构件的第一端子（16a）从表面突出。杆状构件的第一端子和第二端子（16b）位于通孔中。焊接（17）覆盖第二端子，同时密封棒状构件和通孔的内壁的间隙。

7. 发明公开

KR1020090108954A 반도체 패키지 및 그 제조 방법 无效
标题翻译：半导体器件的制造和制造半导体器件的方法
公开(公告)号：KR1020090108954A
公开(公告)日：2009-10-19
申请号：KR1020080034318
申请日：2008-04-14
申请人： 삼성전자주식회사
发明人： 한성찬 , 양진규 , 이동춘 , 천광호
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H05K1/112 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K3/3436 , H05K3/429 , H05K2201/09472 , H05K2201/09509 , H05K2201/09572 , H05K2201/10666 , H05K2203/0455 , Y02P70/613
摘要： PURPOSE: A semiconductor package is provided to reduce the damage of the solder ball caused by the external shock. CONSTITUTION: A semiconductor package includes substrates(110,120) and a connection terminal(130). The substrate has socket portions. The connection terminals have the solder ball and the supporting part. The solder ball is located on the top of the substrate. The supporting part supports the solder ball by being inserted into the socket portion and extended from the solder ball. The socket portion includes a depression or a hole. The depression is defined by the side wall and the bottom part. The hole passes through the substrate. The substrate is the multilayer board in which the insulating layer and the inner wire are repeated or the printed circuit board which has the inner wire.
摘要翻译：目的：提供半导体封装，以减少由外部冲击引起的焊球的损坏。构成：半导体封装包括衬底（110,120）和连接端子（130）。基板具有插座部分。连接端子具有焊球和支撑部。焊球位于基板的顶部。支撑部分通过插入插座部分并从焊球延伸来支撑焊球。插座部分包括凹陷或孔。凹陷由侧壁和底部限定。孔穿过衬底。衬底是重复绝缘层和内部电线的多层板或具有内部电线的印刷电路板。

8. 发明授权

KR100698526B1 방열층을 갖는 배선기판 및 그를 이용한 반도체 패키지 失效
标题翻译：具有散热层的基板和使用其的半导体封装
公开(公告)号：KR100698526B1
公开(公告)日：2007-03-22
申请号：KR1020050065905
申请日：2005-07-20
申请人： 삼성전자주식회사
发明人： 조상귀
IPC分类号： H01L23/36
CPC分类号： H05K1/0206 , H01L23/36 , H01L23/3677 , H01L23/3735 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/181 , H05K2201/09572 , H05K2203/049 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： 본 발명은 표면 금속층을 방열층으로 사용하는 배선기판 및 그를 이용한 반도체 패키지에 관한 것이다. 종래의 방열판을 갖는 반도체 패키지의 경우, 반도체 패키지 제조 공정이 완료된 이후에 수지 봉합부 상에 방열판을 부착하는 공정을 별도로 진행하기 때문에, 반도체 패키지의 생산성이 떨어졌다. 아울러 방열판은 반도체 패키지를 박형화하는 데 걸림돌로 작용하고, 수지 봉합부에 부착된 방열판은 열 방출 효율이 높지 않았다.
따라서 본 발명은 반도체 칩이 실장되는 제 1 면에 반대되는 제 2 면 전체에 방열층이 형성되어 있고, 칩 실장 영역과 방열층은 히트 파이프로 연결된 구조를 갖는 배선기판을 제공함으로써, 반도체 패키지의 두께 증가를 최소화하면서 반도체 칩에서 발생되는 열을 효과적으로 외부로 방출시킬 수 있다. 방열층을 형성하는 공정이 배선기판의 제조 공정 중에 진행되기 때문에, 종래와 같이 별도의 방열판 추가에 따른 비용적인 부담과 반도체 패키지의 생산성이 떨어지는 문제를 해소할 수 있다. 더욱이 칩 실장 영역의 상부면에 반도체 칩과 직접 접촉할 수 있는 금속 돌기를 균일하게 형성함으로써, 반도체 칩에서 발생되는 열을 더욱 신속하게 외부로 방출시킬 수 있고, 칩 실장 영역에 도포된 액상의 접착제가 반도체 칩의 활성면을 침범하는 것을 억제할 수 있다.
방열, 방열층, 히트 싱크(heat sink), 히트 스프레더(heat spreader), 배선기판

9. 发明公开

KR1020070010915A 방열층을 갖는 배선기판 및 그를 이용한 반도체 패키지 失效
标题翻译：具有加热层的基板和使用该散热层的半导体封装
公开(公告)号：KR1020070010915A
公开(公告)日：2007-01-24
申请号：KR1020050065905
申请日：2005-07-20
申请人： 삼성전자주식회사
发明人： 조상귀
IPC分类号： H01L23/36
CPC分类号： H05K1/0206 , H01L23/36 , H01L23/3677 , H01L23/3735 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/181 , H05K2201/09572 , H05K2203/049 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An interconnection substrate having a heat radiation layer is provided to effectively radiate the heat generated from a semiconductor chip to the outside while minimizing a thickness increase of a semiconductor package by forming a heat radiation layer on a second surface of an interconnection substrate wherein the second surface is opposite to a first surface on which a semiconductor chip is mounted and by interconnecting a chip mounting region with a heat radiation layer by a heat pipe. A substrate body(110) has a first surface(112) on which a semiconductor chip is mounted and a second surface(114) confronting the first surface. A metal layer(120) is formed on both surfaces of the substrate body. An interconnection layer(121) includes a chip mounting region(122) formed in the center of the first surface, a plurality of substrate pads(123) formed on the circumference of the chip mounting region, and a terminal pad(124) respectively connected to the substrate pads. A metal layer has a heat radiation layer(125) formed on the entire surface of the second surface. A plurality of heat pipes(130) penetrate the substrate body to connect the chip mounting region with the heat radiation layer. In the heat pipe, a thermal conductive material is filled in a through hole penetrating the substrate body.
摘要翻译：提供具有散热层的互连基板，以通过在互连基板的第二表面上形成散热层来最小化半导体封装的厚度增加，从而有效地将从半导体芯片产生的热辐射到外部，其中第二表面与其上安装半导体芯片的第一表面相对，并且通过热管将芯片安装区域与散热层互连。基板主体（110）具有安装有半导体芯片的第一表面（112）和面对第一表面的第二表面（114）。金属层（120）形成在基板主体的两个表面上。互连层（121）包括形成在第一表面的中心的芯片安装区域（122），形成在芯片安装区域的圆周上的多个基板焊盘（123）和分别连接到基板焊盘。金属层具有形成在第二表面的整个表面上的散热层（125）。多个热管（130）穿透基板主体以将芯片安装区域与散热层连接。在热管中，导热材料填充在贯穿基体的通孔中。

10. 发明公开

KR20180002490A 플렉시블 기판 및 금속 배선 접합 구조의 제법 审中-公开
标题翻译：柔性板和金属布线结构的生产方法
公开(公告)号：KR20180002490A
公开(公告)日：2018-01-08
申请号：KR20170036973
申请日：2017-03-23
IPC分类号： H05K1/02 , H05K3/28 , H05K3/36
CPC分类号： H05K1/028 , H05K1/0281 , H05K1/113 , H05K1/116 , H05K3/363 , H05K3/4038 , H05K2201/09027 , H05K2201/09572 , H05K2201/09909
摘要： 접속용 FPC(75)는, 지지층(751)과피복층(752) 사이에복수의금속배선(750)을가지며, 각금속배선(750)의일단을이루는접점(753)을포함하는노출영역은피복층(752)으로부터노출된다. 지지층(751) 중금속배선(750)이설치되는면과는반대측의면에는, 굽힘위치가이드(760)가설치된다. 굽힘위치가이드(760)의엣지(760a)는, 접속용 FPC(75)를절곡할때의절곡선이되는것이며, 피복층(752)을지지층(751)에투영한피복층투영영역(E)에배치된다. 접속용 FPC(75)를절곡할때, 접속용 FPC(75)는금속배선(750) 중피복층(752)으로피복되는부분, 즉보강되는부분에서절곡된다.
摘要翻译：连接FPC75包括在支撑层751和覆盖层752之间的多个金属线750，并且包括用作金属线750的端部的触点753的暴露区域从覆盖层752露出。弯曲位置引导件760设置在支撑层751的与其上设置有金属线750的表面相对的表面上。弯曲位置引导件760的边缘760a用作连接FPC75弯曲的弯曲线，并设置在覆盖层投影区域E中，其中覆盖层752投影在支撑层751上。连接FPC 75在覆盖有覆盖层752的金属线750的部分处弯曲，即在加强部分处弯曲。

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