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    • 27. 发明公开
    • 치환 소스/드레인 FINFET 제조
    • 替代来源/排水FINFET制造
    • KR1020130014041A
    • 2013-02-06
    • KR1020120082804
    • 2012-07-27
    • 어드밴스드 이온 빔 테크놀로지 인크.
    • 탕,다니엘옌,추-시
    • H01L21/336H01L29/78
    • H01L29/66803H01L21/02636H01L29/0673H01L29/66795H01L29/785H01L29/78684
    • PURPOSE: A method for manufacturing a replacement source/drain FINFET is provided to increase the mobility of electrons and holes in a channel by transforming semiconductor in the channel. CONSTITUTION: A FINFET with a pin including a source, a drain region and a channel region is formed. The pin is etched on a semiconductor wafer(302). An insulating layer touches the channel region(304). A gate stack is made of a conductive gate material and touches the insulating layer(304). The source and the drain regions are etched to expose the first region of the pin(306). A part of the first region is doped(1602). [Reference numerals] (1602) Doping the exposed area of the pin structure; (1604) Growing silicon on the sides of a channel in the source and drain areas; (302) Etching a pin structure having a source area, a drain area, and a channel area; (304) Forming a gate; (306) Etching and removing the source and drain areas of the pin structure
    • 目的:提供一种用于制造替代源极/漏极FINFET的方法,以通过在沟道中转换半导体来增加沟道中的电子和空穴的迁移率。 构成:形成具有包括源极,漏极区域和沟道区域的引脚的FINFET。 引脚被蚀刻在半导体晶片(302)上。 绝缘层与沟道区(304)接触。 栅极堆叠由导电栅极材料制成并接触绝缘层(304)。 蚀刻源极和漏极区域以暴露引脚(306)的第一区域。 第一区域的一部分被掺杂(1602)。 (标号)(1602)掺杂针结构的露出面积; (1604)在源区和漏区的通道两侧生长硅; (302)蚀刻具有源极区域,漏极区域和沟道区域的引脚结构; (304)形成门; (306)蚀刻并去除引脚结构的源极和漏极区域