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    • 2. 发明公开
    • 비평면 반도체 디바이스의 도핑
    • 抛光非平面半导体器件
    • KR1020140025286A
    • 2014-03-04
    • KR1020130098552
    • 2013-08-20
    • 어드밴스드 이온 빔 테크놀로지 인크.
    • 탕,다니엘옌,츄-시
    • H01L21/265
    • H01L29/66803H01L21/26586H01L21/823431H01L29/785
    • In doping a non-planar semiconductor device, a substrate formed on a non-planar semiconductor body is obtained. A first ion implantation is performed on the region of the non-planar semiconductor body. The first ion implantation has first implantation energy and a first implantation angle. A second ion implantation is performed on the same region of the non-planar semiconductor body. The second implantation has second plantation energy and a second implantation angle. The first plantation energy may be different from the second plantation energy. In addition, the first implantation angle may be different from the second implantation angle. [Reference numerals] (102) Obtain a substrate on which a pin is formed; (104) Perform first ion implantation; (106) Perform second ion implantation
    • 在非平面半导体器件的掺杂中,形成在非平面半导体本体上的衬底。 在非平面半导体本体的区域上执行第一离子注入。 第一离子注入具有第一注入能和第一注入角。 在非平面半导体本体的相同区域上执行第二离子注入。 第二植入具有第二种植园能量和第二植入角度。 第一种植园能量可能与第二种植园能量不同。 此外,第一注入角度可以不同于第二注入角度。 (102)获得形成销的基板; (104)进行第一次离子注入; (106)进行第二离子注入
    • 4. 发明公开
    • 정전 척 클리닝 방법
    • 静电吸盘清洁方法
    • KR1020170049429A
    • 2017-05-10
    • KR1020160140827
    • 2016-10-27
    • 어드밴스드 이온 빔 테크놀로지 인크.
    • 니위-호강쥔-진양제-런
    • H01L21/683H01L21/265H01L21/02H01L21/67
    • H01J37/30B08B7/00B08B7/0035H01J37/20H01J37/304H01J2237/022H01J2237/2002H01J2237/30466H01L21/6833H02N13/00
    • 본발명은정전척 클리닝방법을공개한것이다. 정전척의작업표면에어떠한가공물도지지고정되지않았을때, 이온빔을정전척의작업표면으로전송하여, 물리적충격및/또는화학적결합과같은이온빔과작업표면상의증착물의상호작용을통해, 증착물을정전척의작업표면으로부터제거한다. 이를통해, 정전척에가공물이지지고정되지않았을때, 가공물로부터탈락된포토레지스트또는공정반응챔버에부유하는파티클등등을막론하고, 정전척의작업표면에나타나는증착물이정전척과가공물사이의실제고정력에미치는영향을개선할수 있다. 이온빔의전류량, 에너지와이온의종류는모두증착물의구조, 두께와재료등에의해결정된다. 예를들어저에너지이온빔을사용하여정전척의작업표면이손상될가능성을감소시키고, 산소이온또는불활성기체이온등을사용하여한편으로는증착물을제거하고다른한편으로는정전척 작업표면의유전매질층의전도성에미치는영향을감소시킬수 있다.
    • 本发明公开了一种静电吸盘清洁方法。 静电卡盘的操作时的表面上的任何工件也是支持不固定,以使离子束通过的静电卡盘工作表面,一个物理冲击和/或通过离子束沉积相互作用和工作表面,诸如化学结合,静电沉积卡盘工作转交 从表面移除。 这允许,在当他们不固定于支承上的静电卡盘的工件,悬浮在光致抗蚀剂或从工件和静电卡盘沉积物的静电卡盘和工件分离的过程中反应室而与粒子的等之间的实际保持力出现在工作表面上 效果可以得到改善。 离子束的电流量,能量和离子类型全部由沉积材料的结构,厚度和材料决定。 例如,使用低能量离子束,以减少在静电吸盘中,工作表面,用氧离子,或惰性气体离子等电介质层的导电性损失的可能性,同时euroneun除去沉积物和在另一方面euroneun卡盘的工件表面 效果可以降低。
    • 5. 发明公开
    • 스캔 헤드 및 이를 이용한 스캔 암
    • 扫描头和扫描ARM使用它
    • KR1020140146525A
    • 2014-12-26
    • KR1020140038432
    • 2014-04-01
    • 어드밴스드 이온 빔 테크놀로지 인크.
    • 맥레이,리차드에프.
    • H01L21/687H01J37/317
    • H01J37/3171H01J37/20H01J2237/20207H01J2237/20228H01J2237/20285
    • A scan head assembled to a scan arm for an ion implanter and a scan arm using the same are provided, wherein the scan head comprises a case, a shaft assembly, an ESC, a first driving mechanism, and a second driving mechanism. The case has a normal center line. The shaft assembly passes through a first side of the case and has a twist axis, a first pivot point fixed relative to the case, and a first end located outside the case. The ESC is fastened on the first end and capable of holding a work piece. The first driving mechanism is capable of driving the shaft assembly, the ESC and the work piece to tilt relative to the normal center line. The second driving mechanism is capable of driving the shaft assembly, the ESC and the work piece to rotate around the twist axis.
    • 提供了组装到用于离子注入机的扫描臂和使用其的扫描臂的扫描头,其中扫描头包括壳体,轴组件,ESC,第一驱动机构和第二驱动机构。 案件有正常的中心线。 轴组件穿过壳体的第一侧并且具有扭转轴线,相对于壳体固定的第一枢转点和位于壳体外部的第一端。 ESC紧固在第一端并能够固定工件。 第一驱动机构能够驱动轴组件,ESC和工件相对于正常中心线倾斜。 第二驱动机构能够驱动轴组件,ESC和工件围绕扭转轴线旋转。
    • 6. 发明公开
    • 멀티-에너지 이온 주입
    • 多功能离子植入
    • KR1020140071264A
    • 2014-06-11
    • KR1020130149538
    • 2013-12-03
    • 어드밴스드 이온 빔 테크놀로지 인크.
    • 완,지민
    • H01L21/265
    • H01J37/3171H01J37/302H01J2237/047H01J2237/30472H01L21/26513H01L21/26586H01L29/66803
    • In a multi-energy ion implantation process, an ion implanting system having an ion source, an extraction assembly, and an electrode assembly is used to implant ions into a target. An ion beam having a first energy may be generated using the ion source and the extraction assembly. A first voltage may be applied to both ends of the electrode assembly. The ion beam may enter the electrode assembly at the first energy, exit the electrode assembly at a second energy, and implant ions into the target at the second energy. A second voltage may be applied to both ends of the electrode assembly. The ion beam may enter the electrode assembly at the first energy, exit the electrode assembly at a third energy, and implants ions into the target at the third energy. The third energy may be different from the second energy.
    • 在多能离子注入工艺中,使用具有离子源,提取组件和电极组件的离子注入系统将离子注入到靶中。 可以使用离子源和提取组件产生具有第一能量的离子束。 第一电压可以施加到电极组件的两端。 离子束可以以第一能量进入电极组件,以第二能量离开电极组件,并以第二能量将离子注入到靶中。 第二电压可以施加到电极组件的两端。 离子束可以以第一能量进入电极组件,以第三能量离开电极组件,并以第三能量将离子注入靶中。 第三能量可能与第二能量不同。
    • 8. 发明公开
    • 만곡 봉자석에 의해 이온빔을 조절하는 장치
    • 用于通过弯曲棒磁体调节离子束的装置
    • KR1020120085633A
    • 2012-08-01
    • KR1020110047244
    • 2011-05-19
    • 어드밴스드 이온 빔 테크놀로지 인크.
    • 젠고-추안완즈민
    • H01J37/317H01J31/08H01J37/141
    • H01J37/3171H01J37/141H01J2237/24542
    • PURPOSE: An apparatus for controlling an ion beam is provided to satisfy a construction progress demand by individually or simultaneously controlling a current passing through a curved rod magnet. CONSTITUTION: An ion source generates an ion beam. An incidence ion beam(67) is a transformed emission ion beam. A substrate holder loads a work-piece to be injected by the ion beam. A first curved rod magnet(61) comprises one or more first coils arranged on a first curved support rod. One or more first currents flow in the first coil. A second curved rod magnet(62) comprises one or more second coils arranged on a second curved support rod. One or more second currents flow in the second coil. Control assembly controls the ion beam in a control space between a mass spectrometer and the substrate holder.
    • 目的:提供一种用于控制离子束的装置,以通过单独或同时控制通过弯曲杆状磁体的电流来满足施工进度要求。 构成:离子源产生离子束。 入射离子束(67)是转变的发射离子束。 衬底支架装载由离子束注入的工件。 第一弯曲杆状磁体(61)包括布置在第一弯曲支撑杆上的一个或多个第一线圈。 一个或多个第一电流在第一线圈中流动。 第二弯曲杆状磁体(62)包括布置在第二弯曲支撑杆上的一个或多个第二线圈。 一个或多个第二电流在第二线圈中流动。 控制组件控制离子束在质谱仪和衬底保持器之间的控制空间中。