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    • 2. 发明专利
    • Manufacturing method of electronic component, and electronic component
    • 电子元件的制造方法和电子元件
    • JP2008251752A
    • 2008-10-16
    • JP2007089900
    • 2007-03-29
    • Tdk CorpTdk株式会社
    • KUWAJIMA HAJIMEOKUBO HITOSHIOTA MANABU
    • H01G4/30H01G4/252H01G13/00
    • H01G4/248H01C1/148H01C17/281H01G4/232Y10T29/49128Y10T29/49156Y10T29/49163Y10T29/4979Y10T156/1052
    • PROBLEM TO BE SOLVED: To provide a highly reliable terminal electrode on the outer surface of a chip precisely in an arbitrary position and shape. SOLUTION: A manufacturing method of electronic components comprises: a tentative adhesion process for tentatively adhering (for example, vacuum-pressing) a first surface of a substrate to a support plate via an adhesive sheet (for example, made of resin dissolved in a solvent); a substrate dividing process for forming a groove for dividing a substrate into individual chips by forming a notching reaching one portion of the thickness of the support plate from a second surface side at a side opposite to the first surface on the substrate; a continuous electrode formation process for forming a continuous electrode on a second surface and on the circumferential face of a chip positioned in the groove by sputtering; and a component separation process (for example, for applying ultrasonic waves by dipping into a solvent) for separating the chip from the support plate. Before the tentative adhesion process, a first surface electrode formation process for forming an electrode on the first surface of the substrate is further included. In the continuous electrode formation process, an electrode formed on the circumferential face of electronic components is connected to an electrode formed in a first surface electrode formation process. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:在芯片的外表面上精确地设置任意位置和形状的高度可靠的端子电极。 电子部件的制造方法包括:暂时粘合(例如,将基板的第一表面真空按压)到支撑板上的粘合片(例如,由树脂溶解 在溶剂中) 基板分割处理,用于通过从与基板上的第一表面相对的一侧的第二表面侧形成开始到达支撑板的厚度的一部分的开槽,形成用于将基板分割成单个芯片的凹槽; 用于通过溅射在位于槽中的芯片的第二表面和周面上形成连续电极的连续电极形成工艺; 和组分分离处理(例如,通过浸渍到溶剂中来施加超声波),用于将芯片与支撑板分离。 在临时粘合处理之前,还包括用于在基板的第一表面上形成电极的第一表面电极形成工艺。 在连续电极形成工序中,将形成在电子部件的周面上的电极与形成在第一表面电极形成工序中的电极连接。 版权所有(C)2009,JPO&INPIT
    • 5. 发明专利
    • Method for forming fracture start section of ductile metallic components and apparatus for forming fracture initiation section
    • 破碎金属部件断裂开始部分的形成方法及形成断裂部分的装置
    • JP2005144467A
    • 2005-06-09
    • JP2003382052
    • 2003-11-12
    • Yasunaga Corp株式会社安永
    • HASE KOICHI
    • B23K26/00B23D31/00B23K26/04B23K26/38B23P19/00B23P19/02
    • F16C9/045B23D31/003B23K26/389Y10T29/49288Y10T29/4979Y10T29/49796Y10T29/49821Y10T29/49824
    • PROBLEM TO BE SOLVED: To provide a method for forming fracture start sections of ductile metallic components by which neat fracture surfaces can be obtained, and an apparatus for forming the fracture start sections. SOLUTION: In the method for forming the fracture start sections of the ductile metallic components on the inner peripheral surfaces of through-holes of the ductile metallic components having the predetermined through-holes by irradiating the opposite positions of the inner peripheral surfaces of the through-holes with a laser beam and fabricating a number of recessed parts parted at a specified distance from the apertures on one side of the through-holes to the apertures on the other side at predetermined intervals, the inner peripheral surface of each through-hole is irradiated with the laser beam by defocusing the laser beam by the specified amount from the inner peripheral surface of the through-hole in place of irradiating the inner peripheral surface of the through-hole with the laser beam by exactly focusing the laser beam to the inner peripheral surface of the through-hole and simultaneously each recessed part is formed by supplying assist gas to the inner peripheral surface of the through-hole and while the inner peripheral surface of the through-hole is irradiated with the laser beam at a specified pulse, the laser beam is linearly moved from the aperture on one side of the inner peripheral surface of the through-hole to the aperture on the other side of the inner peripheral surface at a prescribed velocity. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种用于形成能够获得整体断裂面的延性金属部件的断裂起始部分的方法和用于形成断裂起始部分的装置。 解决方案:在具有预定通孔的延性金属部件的通孔的内周面上形成延性金属部件的断裂起始部分的方法中,通过照射内周面的相对位置 所述通孔具有激光束,并且以预定间隔制造多个凹陷部分,所述多个凹部与所述通孔的一侧上的所述孔分隔成特定距离,所述通孔的每个通孔的内周表面, 通过使来自通孔的内周面的规定量的激光束使激光束照射而不是通过将激光束精确地聚焦到激光束来照射通孔的内周面而将激光束照射到孔 通孔的内周面和同时的每个凹部通过向内周面供给辅助气体而形成 的通孔,并且当以指定的脉冲对激光束照射通孔的内周面时,激光束从通孔的内周面的一侧的孔直线移动到 以规定的速度在内周面的另一侧的孔。 版权所有(C)2005,JPO&NCIPI
    • 10. 发明专利
    • Manufacturing method of air bag cover, air bag cover and air bag module
    • 空气袋盖,空气袋盖和空气袋模块的制造方法
    • JP2005289254A
    • 2005-10-20
    • JP2004109085
    • 2004-04-01
    • Takata Corpタカタ株式会社
    • SOEJIMA NAOKI
    • B60R21/20B60R21/2165
    • B60R21/2165Y10T29/4979
    • PROBLEM TO BE SOLVED: To provide technology effective for rationally constructing an air bag cover to cover an air bag for a vehicle. SOLUTION: The air bag cover 100 is processed so that a cross-section shape of a tear line 102 becomes "a zigzag-cut shape", "a sealer-cut shape" or "a stepped-cut shape", and so that the shape, in plan view, of the tear line 102 becomes a "meandering-cut shape" in forming the tear line 102 on which a groove of a depth within an area of the plate thickness of the air bag cover 100 by processing the air bag cover by using an ultrasonic processing blade 216. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供有效地合理构建气囊盖以覆盖车辆的气囊的技术。 解决方案:气囊盖100被加工成使得撕裂线102的横截面形状变成“锯齿形”,“切割形状”或“阶梯形状”,并且 使得在平面图中,撕裂线102的形状在形成撕裂线102时成为“曲折形状”,在该撕裂线102上通过加工形成深度在安全气囊罩100的板厚的区域内的凹槽 通过使用超声波处理刀片216,安全气囊罩。版权所有(C)2006,JPO&NCIPI