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1. 发明专利

JP2014207250A ウェハ分離装置及びこれを用いたウェハの製造方法审中-公开
标题翻译： WAFER分离器及其制造方法
公开(公告)号：JP2014207250A
公开(公告)日：2014-10-30
申请号：JP2011176830
申请日：2011-08-12
申请人：株式会社安永 , Yasunaga Corp
发明人： HAYAKAWA AKIO , ICHIMI KIYOHIDE
IPC分类号： H01L21/677 , H01L21/304
CPC分类号： H01L21/67092 , B28D5/0082
摘要：【課題】シリコンインゴットを切断してなる多数枚のウェハ群を液体通過後に確実に一枚ずつのウェハに分離して次工程に供給可能なウェハ分離装置及びこれを用いたウェハの製造方法を提供する。【解決手段】液槽内に、シリコンインゴットを切断して横置きに層状に積載された多数枚のウェハ群Wに向けて横方向に液流を噴射する液流噴射ノズル(50)と、液流噴射ノズルの下方に液流噴射ノズルとウェハ群Wとの間に気泡を吐出させ上昇させる気泡吐出装置(60)とを設ける。【選択図】図1
摘要翻译：要解决的问题：提供一种晶片分离器，其能够可靠地将通过将硅锭切割成每片晶片形成的多个晶片组，并通过液体提供下一步，并提供制造晶片的工艺使用相同的方法。晶片分离器包括在液体罐中：液流喷射喷嘴（50），其通过切割水平状态在横向方向上朝向多个以水平状态装载的层的晶片组W喷射液体电流硅锭; 以及在液流喷射喷嘴和晶片组W之间朝向液流喷射喷嘴的下方排出气泡的气泡排出装置（60）。

2. 发明专利

JP2013102082A Loader device 审中-公开
标题翻译：装载装置
公开(公告)号：JP2013102082A
公开(公告)日：2013-05-23
申请号：JP2011245569
申请日：2011-11-09
申请人： Yasunaga Corp , 株式会社安永
发明人： ICHIMI KIYOHIDE , HAYAKAWA AKIO
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a loader device capable of efficiently washing and separating sheets of wafers cut off from a silicon ingot and suitable for mass production of the wafers.SOLUTION: The loader device includes: a storage device (30) having a turn table (31) with plural arm members (32) extending radially downward into a liquid tank (2) from the top of the liquid tank (2), in which a loading table (40) loaded with plural sheets of wafers W, which are cut off from a silicon ingot, horizontally in a layer on each of a seat (32a) of the arm members, and the sheets of wafers are transported in order while being rotated in a liquid in one direction and stored in the storage device (30); and a lift unit (10) including a pair of lifters (11, 12) which are operable independently to move loading table support members (13,14) within planes parallel with each other in a biaxial direction including a vertical direction in the liquid. Each of the pair of lifters directly performs transfer of the loading table between a loading table support member and the seat of an arm member at a predetermined stop position of the arm member of the storage device and transports the loading table in a plane in the biaxial direction.
摘要翻译：解决的问题：提供一种能够有效地清洗和分离从硅锭切出的并适合于批量生产晶片的晶片的装载装置。解决方案：装载机装置包括：存储装置（30），具有从液罐（2）的顶部向下延伸到液罐（2）的多个臂部件（32）的转台（31），其中装载有从硅锭切割的多个晶片W的装载台（40）在臂部件的座椅（32a）和晶片片的每一个上的层中水平地传送同时沿着一个方向在液体中旋转并存储在存储装置（30）中; 以及包括一对提升器（11,12）的提升单元（10,12），其可独立地操作以在包括液体中的垂直方向的双轴方向上彼此平行的平面内移动装载台支撑构件（13,14）。所述一对升降机中的每一对升降器直接在装载台支撑构件和臂构件的座位之间在存储装置的臂构件的预定停止位置处执行装载台的传送，并将装载台在双轴的平面中传送方向。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012004194A Wire saw apparatus 审中-公开
标题翻译：线锯装置
公开(公告)号：JP2012004194A
公开(公告)日：2012-01-05
申请号：JP2010135632
申请日：2010-06-15
申请人： Yasunaga Corp , 株式会社安永
发明人： INADA MINORU , IKENAGA KUNINOBU , ABE TAKASHI
IPC分类号： H01L21/304 , B24B27/06 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To provide a wire saw apparatus capable of fabricating a semiconductor wafer efficiently at a low cost while increasing a product yield.SOLUTION: In a wire saw apparatus 1 using a fixed abrasive grain method, a wire is moved in a specific direction relatively to an ingot to cut the ingot and then the wire is moved relatively to the ingot in the opposite direction to remove the wire from the ingot. When the ingot is cut, a coolant for ingot cutting is applied to the cutting portion. When the wire is removed from the ingot, a coolant for removing the wire is applied, which is different from the coolant for ingot cutting. The percentage of ingot cutting dust contained in the coolant for removing the wire is 3% to 0% in suspended solids (SS) concentration.
摘要翻译：要解决的问题：提供一种能够以较低成本有效地制造半导体晶片的线锯装置，同时提高产品产量。解决方案：在使用固定磨粒法的线锯装置1中，线相对于锭移动到特定方向以切割锭，然后线沿相反方向相对于锭移动以移除来自锭的电线。当切割锭时，用于锭切割的冷却剂被施加到切割部分。当钢丝从锭中取出时，应用用于除去钢丝的冷却剂，这与用于锭切割的冷却剂不同。用于除去电线的冷却剂中含有的锭块切屑的百分比在悬浮固体（SS）浓度中为3％至0％。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011000702A Flexible automatic conveyance system between processes 审中-公开
标题翻译：柔性自动输送系统
公开(公告)号：JP2011000702A
公开(公告)日：2011-01-06
申请号：JP2010107796
申请日：2010-05-08
申请人： Yasunaga Corp , 株式会社安永
发明人： NAKAOKA ISAO
IPC分类号： B23Q39/04 , B65G1/137 , G05B19/418
CPC分类号： Y02P90/08 , Y02P90/083 , Y02P90/28
摘要： PROBLEM TO BE SOLVED: To provide a flexible automatic conveyance system between processes, operating at a low cost while enhancing flexibility in changing layout, and suitable for automatically conveying a workpiece.SOLUTION: The flexible automatic conveyance system between processes has: work station kits 100 arranged correspondingly to a plurality of machining centers 10; rail kits 200 for connecting them; turn kits 300 arranged between rail kits or between a rail kit and a work station kit; a workpiece input kit 410 connected to a rail kit or a work station kit; a workpiece discharge kit 420 connected to a rail kit or a work station kit different from the one the workpiece input kit is connected to; and a plurality of workpiece carrier vehicles to move on the kits connected to each other. The rail kit is attachable to and detachable from the work station kit, the turn kit, the workpiece input kit, and the workpiece discharge kit.
摘要翻译：要解决的问题：在工艺之间提供灵活的自动输送系统，以低成本运行，同时增强布局的灵活性，适合自动输送工件。解决方案：工艺之间的灵活自动输送系统有：工作台套件100 相应地设置在多个加工中心10上; 用于连接它们的导轨套件200; 转动套件300布置在轨道套件之间或轨道套件和工作站套件之间; 连接到轨道套件或工作站套件的工件输入套件410; 连接到轨道套件或与工件输入套件连接的工作台套件不同的工作台套件的工件排出套件420; 以及多个工件载体车辆在彼此连接的套件上移动。导轨套件可与工作站套件，转动套件，工件输入套件和工件卸载套件相连并可拆卸。

5. 发明专利

JP2011000692A Metallic component rupture start portion forming method 有权
标题翻译：金属元件破裂开始部分形成方法
公开(公告)号：JP2011000692A
公开(公告)日：2011-01-06
申请号：JP2009147861
申请日：2009-06-22
申请人： Yasunaga Corp , 株式会社安永
发明人： HASE KOICHI
IPC分类号： B23P13/00 , F16C7/02
CPC分类号： F16C9/045 , F16C2240/42 , F16C2240/44 , F16C2360/22
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a metallic component rupture start portion at a low cost to provide a stable rupture surface after rupture.SOLUTION: A metallic component rupture start portion forming method has: a first step of forming a groove portion 11 by machining at a portion corresponding to the rupture start portion of a metallic component 1; and a second step of forming a plurality of recess portions 12 at predetermined intervals on the bottom portion of the groove portion 11. This method provides the metallic component rupture start portion to be formed at a low cost to provide the stable rupture surface after rupture.
摘要翻译：要解决的问题：提供一种以低成本形成金属成分断裂起始部分的方法，以在破裂之后提供稳定的破裂表面。解决方案：金属部件断裂起始部分形成方法具有：第一步骤，形成槽部分在对应于金属部件1的断裂开始部分的部分加工; 以及在槽部11的底部上以预定间隔形成多个凹部12的第二步骤。该方法提供了要以低成本形成的金属部件断裂起始部分，以在破裂之后提供稳定的破裂表面。

6. 发明专利

JP2005014094A Rupturing device of connecting rod and method of manufacturing ruptured connecting rod 有权
标题翻译：连接件的破碎装置及制造连接件的方法
公开(公告)号：JP2005014094A
公开(公告)日：2005-01-20
申请号：JP2003177743
申请日：2003-06-23
申请人： Yasunaga Corp , 株式会社安永
发明人： NAKAOKA ISAO , KAWARABAYASHI HAJIME
IPC分类号： B26F3/02 , B23P13/00 , F16C7/02
CPC分类号： F16C9/045
摘要： PROBLEM TO BE SOLVED: To provide a rupturing device of a beautifully crackable connecting rod, and a manufacturing method of the ruptured connecting rod. SOLUTION: This rupturing device of the connecting rod has first and second support members 31 and 32 movably arranged in the mutually separating direction on a pallet base 30 for placing the connecting rod, and supporting a large end part and a rod part of the connecting rod, a half-split-shaped mandrel 40 suspended by these support members, and composed of two mandrel half parts 41 and 42 having respective outer peripheral surfaces respectively abutting on and fitting to an opening part inner surface of the large end part, a wedge 25 uniformly separating and expanding the respective mandrel half parts, and an actuator 21 applying a load to the wedge. A universal joint 70 is interposed between the wedge and the actuator, and driving force is transmitted to the wedge from the actuator via the universal joint. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可破裂的连杆的破裂装置，以及破裂连杆的制造方法。解决方案：连接杆的这种破裂装置具有第一和第二支撑构件31和32，该第一和第二支撑构件31和32沿相互分离的方向可移动地布置在用于放置连杆的托盘基座30上，并且支撑大的端部和杆部分连杆，由这些支撑构件悬挂的半剖形心轴40，具有分别与大端部的开口部内表面分别抵接并嵌合的两个心轴半部分41和42，均匀地分离和膨胀相应的心轴半部的楔形件25以及向楔形件施加载荷的致动器21。万向接头70置于楔形件和致动器之间，并且驱动力通过万向接头从致动器传递到楔形件。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004239078A Air pump 审中-公开
公开(公告)号：JP2004239078A
公开(公告)日：2004-08-26
申请号：JP2003026003
申请日：2003-02-03
申请人： Yasunaga Corp , 株式会社安永
发明人： YAMAGUCHI TAMOTSU
IPC分类号： F04B45/047
摘要： PROBLEM TO BE SOLVED: To provide a compact air pump hardly causing pulsation. SOLUTION: The air pump includes an air-pump body 3 of an electromagnetic-vibration diaphragm type discharging alternately compressed air from right and left pump chambers 22, and a casing 2 for airtightly holding the air-pump body 3. The casing 2 is provided with right and left air-chambers 28 storing compressed air discharged from the right and left pump chambers 22, and air suction ports 6a, 12f for letting air into the pump chambers, a straightening path 27 for allowing the right and left air chambers to communicate with each other to straighten and integrate the compressed air in the air chambers, and a discharge port 31 which is provided in the center of the straightening path and discharges the straightened compressed air. COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2004174436A Exhaust gas cleaning equipment 审中-公开
公开(公告)号：JP2004174436A
公开(公告)日：2004-06-24
申请号：JP2002346331
申请日：2002-11-28
申请人： Yasunaga Corp , 株式会社安永
发明人： ISHIKAWA TAKASHI
IPC分类号： B01D47/02 , B01D47/04 , B01D47/06
摘要： PROBLEM TO BE SOLVED: To provide an exhaust gas cleaning equipment with a baffle plate having a simple structure capable of performing the appropriate bubbling action while preventing water from splashing to the outside the equipment.
SOLUTION: The exhaust gas cleaning equipment has a cylindrical frame 10 communicating with an exhaust duct having an exhaust fan and wherein a perforated plate is provided in the vicinity of the lower end part, a liquid tank 40 arranged at the lower part of the cylindrical frame 10 and wherein liquid is stored, and a baffle plate 30 fixed to the outer wall of the cylindrical frame 10, and in the fixed state, entering the inside of the liquid tank so that the lower end side thereof becomes nearly parallel with a liquid surface inside the liquid tank. In the baffle plate 30, in the fixed state, nearly square-shaped cutout parts 100 cut out at a prescribed width and a prescribed depth in the nearly vertical direction with respect to the lower end side are formed with prescribed intervals. As a result, the appropriate bubbling action is obtained, and splash of water inside the liquid tank to the outside the equipment is effectively prevented due to less generation of turbulent airflow.
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2004025164A Garbage treatment method 审中-公开
公开(公告)号：JP2004025164A
公开(公告)日：2004-01-29
申请号：JP2003026008
申请日：2003-02-03
申请人： Yasunaga Corp , 株式会社安永
发明人： INUI YOSHITAKA
IPC分类号： B09B3/00 , C05F9/00
CPC分类号： Y02A40/214
摘要： PROBLEM TO BE SOLVED: To enable a short-time treatment of garbage by performing the volume reduction and biodegradation of garbage and the rapid removal of moisture in a garbage treatment process.
SOLUTION: The garbage treatment method includes a process for continuously and forcibly stirring garbage and lumpy matter comprising a material harder than the gabrage in a mixed state to physically grind the garbage, a process for always bringing air into contact with the garbage during stirring to biodegrade the garbage by microorganisms naturally produced from the garbage and a process for discharging air to discharge the moisture and a malodor generated at the time of biodegradation.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2014115238A Wafer defect inspection device 有权
标题翻译：防水缺陷检测装置
公开(公告)号：JP2014115238A
公开(公告)日：2014-06-26
申请号：JP2012271014
申请日：2012-12-12
申请人： Yasunaga Corp , 株式会社安永
发明人： KAWASAKI SHINGO , KUSUI KAZUYUKI , IMANAKA HIDESADA , MACHINO TOMOYA
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a wafer defect inspection device that enables a detection of a defect part of a semiconductor wafer from an infrared image even if a surface state of the semiconductor wafer changes.SOLUTION: The wafer defect inspection device comprises: illumination devices (10 and 12) that irradiate a wafer (2) with light; an imaging device (14) that photographs at least any one of transmission light of the wafer having the light irradiated and reflection light thereof; an inspection device (20) that inspects a defect of the wafer on the basis of a photographed wafer image; and a control device (20) that adjusts illuminance of the illumination device. The control device includes: luminance detection means (22) that detects luminance from the wafer image photographed by the imaging device; and illuminance control means (24) that compares judgment luminance calculated on the basis of the luminance detected by the luminance detection means with a prescribed range including optimal luminance serving as reference luminance in an inspection, and, when the judgment luminance does not fall within the prescribed range, adjusts the illuminance of the illumination device so that the judgment luminance falls within the prescribed range.
摘要翻译：要解决的问题：提供一种晶片缺陷检查装置，即使半导体晶片的表面状态发生变化，也能够从红外图像检测半导体晶片的缺陷部分。解决方案：晶片缺陷检查装置包括：照明装置（10和12），用光照射晶片（2）; 成像装置（14），其照射具有所述光照射和所述反射光的所述晶片的透射光中的至少任一种; 检查装置（20），其基于拍摄的晶片图像检查晶片的缺陷; 以及调节照明装置的照度的控制装置（20）。控制装置包括：亮度检测装置，用于检测由成像装置拍摄的晶片图像的亮度; 以及照度控制装置（24），其将根据由所述亮度检测装置检测出的亮度计算出的判定亮度与包括在检查中作为基准亮度的最佳亮度的规定范围进行比较，并且当所述判断亮度不在调整照明装置的照度，判断亮度落在规定范围内。

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