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1. 发明专利

JP2010087367A Method of manufacturing semiconductor 审中-公开
标题翻译：制造半导体的方法
公开(公告)号：JP2010087367A
公开(公告)日：2010-04-15
申请号：JP2008256625
申请日：2008-10-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： WATANABE TOMOYUKI , YAMANAKA TAKESHI , EDA AKINORI
IPC分类号： H01L23/40 , H01L23/473
CPC分类号： H01L2224/32225 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device for suppressing the warpage of each part material by a simple means when bonding members whose coefficients of linear expansion are different mutually. SOLUTION: The process S100 of manufacturing a semiconductor device includes: a brazing process S110 for heating a wax material when a substrate made from ceramics having a predetermined coefficient of linear expansion and a cooler made from aluminum having a larger coefficient of linear expansion than the coefficient of linear expansion of the substrate are bonded with a wax material filled between the substrate and the cooler; and a cooling process S115 for cooling the substrate, the cooler, the wax material, and the like. Further, the cooling process S115 includes: a first cooling process S116 in which an apparent coefficient of linear expansion cools the small member side firstly; and a second cooling process S117 in which an apparent coefficient of linear expansion cools the large member side later. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体器件的制造方法，用于当线性膨胀系数相互不同的接合部件时，通过简单的手段来抑制各部件材料的翘曲。解决方案：制造半导体器件的工艺S100包括：当由具有预定线性膨胀系数的陶瓷制成的衬底和由具有较大线性膨胀系数的铝制成的冷却器时，用于加热蜡材料的钎焊工艺S110 比基板的线膨胀系数与填充在基板和冷却器之间的蜡材料结合; 以及用于冷却基板，冷却器，蜡材料等的冷却工序S115。此外，冷却过程S115包括：第一冷却过程S116，其中线性膨胀的表观系数首先冷却小部件侧; 和第二冷却过程S117，其中线性膨胀的表观系数稍后冷却大部件侧。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2006081373A Connector attached directly to equipment 有权
标题翻译：连接器直接连接到设备
公开(公告)号：JP2006081373A
公开(公告)日：2006-03-23
申请号：JP2004265538
申请日：2004-09-13
申请人： Toyota Industries Corp , Toyota Motor Corp , Yazaki Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機 , 矢崎総業株式会社
发明人： MATSUMOTO MITSUHIRO , FUKUSHIMA HIROTAKA , TSUKAMOTO SETSU , SHIBA KENSHIRO , WATANABE TOMOYUKI , OKAMOTO KOJI
IPC分类号： H02K5/22 , B60L11/18 , H01R13/405 , H02K11/00
CPC分类号： H02M7/003 , H01R13/42 , H01R25/162 , H01R29/00 , H01R31/065
摘要： PROBLEM TO BE SOLVED: To reduce the size of an invertor (equipment) connecting two motors and a connection structure. SOLUTION: The connector that is to be attached directly to equipment is provided with six independent bus bars 21 to 26 for connecting two auxiliary machines for three-phase alternating current to one piece of equipment, wherein two U-electrode terminal parts 11, 12 of three-phase alternating current connected to the equipment, two V-electrode terminal parts 13, 14, and two W-electrode terminal parts 15, 16, are arranged mutually adjacent to each other; while terminal parts 11 to 16 are provided on one terminal side of each bus bar 21 to 26, and one each terminal part 31 to 33, 34 to 36 of the U-electrode, V-electrode and W-electrode that are to be connected to the two auxiliary machines are arranged in two sets, mutually adjacent on the other end side of each bus bar, each being separated from each other. The bus bars 22, 25 have extension parts 22c, 25c extended between the two sets of terminal parts 31 to 33, 34 to 36 on the other end side. The bus-bars 21 to 26 are molded into an insulating resin part. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：减少连接两台电机和连接结构的变频器（设备）的尺寸。
解决方案：要直接连接到设备的连接器设有六个独立的母线21至26，用于将两个用于三相交流的辅助设备连接到一个设备，其中两个U电极端子部分11 连接到设备的三相交流电的12个，两个V电极端子部分13,14和两个W电极端子部分15,16彼此相邻地布置; 而端子部11至16设置在每个汇流条21至26的一个端子侧，并且将要连接的U电极，V电极和W电极的每个端子部分31至33,34至36中的一个两个辅助机器被布置成两组，每个母线的另一端相互相邻，每个彼此分离。母线22,25具有在另一端侧的两组端子部31〜33,34〜36之间延伸的延伸部22c，25c。母线21至26被模制成绝缘树脂部分。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005026628A Semiconductor device packaging method 有权
标题翻译：半导体器件封装方法
公开(公告)号：JP2005026628A
公开(公告)日：2005-01-27
申请号：JP2003270782
申请日：2003-07-03
申请人： Mitsui High Tec Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社三井ハイテック
发明人： WATANABE TOMOYUKI , EDA AKINORI , MORITA TAKESHI , YAMAGUCHI KAZUTOSHI , SHIOYAMA TAKAO , HIRASHIMA TETSUYUKI
IPC分类号： H01L21/52
CPC分类号： H01L24/32 , H01L24/743 , H01L24/83 , H01L2224/32225 , H01L2224/743 , H01L2224/83 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To highly accurately control a packaging position while suppressing costs low in a semiconductor device packaging method for packaging a semiconductor device on a substrate by soldering.
SOLUTION: The semiconductor device packaging method for packaging a semiconductor device 2 on the substrate by soldering includes the steps of: setting the semiconductor device 2 on a substrate 1 on which a fixing tape 5 is stuck, and temporarily fixing the packaging position of the semiconductor device 2 using the fixing tape 5; pressing the fixing tape 5 to solder foil thickness and thermosetting the fixing tape by press-welding the set semiconductor device 2 onto the substrate 1; and soldering the semiconductor device 2 and the substrate 1 using reflowing.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了在通过焊接将半导体器件封装在衬底上的半导体器件封装方法中抑制成本低的同时高度准确地控制封装位置。解决方案：通过焊接将半导体器件2封装在衬底上的半导体器件封装方法包括以下步骤：将半导体器件2设置在其上固定有固定带5的衬底1上，并临时固定封装位置使用固定带5的半导体器件2; 按压固定带5以焊接箔厚度并通过将设置的半导体器件2压焊到衬底1上来固化固定带; 以及使用回流焊接半导体器件2和衬底1。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2008206363A Semiconductor power converter and manufacturing method of same 有权
标题翻译：半导体功率转换器及其制造方法
公开(公告)号：JP2008206363A
公开(公告)日：2008-09-04
申请号：JP2007042205
申请日：2007-02-22
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： NAKAMURA HIDEO , WATANABE TOMOYUKI , ONO HIROTAKA , INAGAKI NOBUAKI
IPC分类号： H02M7/00
CPC分类号： H01L25/072 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/77272 , H01L2224/83801 , H01L2224/84801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H02M7/003 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a wiring connection structure for electrically and directly bonding electrodes in semiconductor elements and a bus bar, and mitigating a thermal stress at a bonded section between them. SOLUTION: The bus bar 200a has a lead section 210a and a bus bar section 205a which are integrally molded. The lead section 210a is provided so as to be formed into branches from the bus bar section 205a. A portion of the lead section 210a forms the bonded region 215a electrically and directly bonded to the transistor electrode 150 and the diode electrode 164 by a bonding material 160 such as a solder. A thickness t2 of the lead section 210a including the bonded region 215a is smaller than a thickness t1 of the bus bar section 205a (t2 COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在半导体元件和母线中电和直接接合电极的布线连接结构，并且减轻它们之间的接合部分处的热应力。汇流条200a具有一体成型的引线部210a和汇流条部205a。引线部分210a设置成从母线部分205a形成分支。引线部分210a的一部分通过诸如焊料的接合材料160形成电连接并直接接合到晶体管电极150和二极管电极164的接合区域215a。包括接合区域215a的引线部分210a的厚度t2小于汇流条部分205a的厚度t1（t2

5. 发明专利

JP2008159946A Cooling device of semiconductor module, and manufacturing method therefor 审中-公开
标题翻译：半导体模块的冷却装置及其制造方法
公开(公告)号：JP2008159946A
公开(公告)日：2008-07-10
申请号：JP2006348465
申请日：2006-12-25
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： NAKAMURA HIDEO , WATANABE TOMOYUKI , ONO HIROTAKA
IPC分类号： H01L23/36 , H01L23/473 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To solve the problems of the conventional cooling devices of a semiconductor module, having the entire surface on the other side of an insulating substrate bonded with a heat slinger so that warpage deformations are generated due to a large difference of the linear expansion coefficient between the insulating substrate and the heat slinger, and increase in the number of component parts of the cooling device due to a large number of the parts present between a power semiconductor element 111 and a cooler 103. SOLUTION: The cooling device 1 of a semiconductor module comprises a semiconductor module 2 having a power semiconductor element 11 bonded via an electrode plate 13 on one side surface of an insulating substrate 12, and a top plate 32 of a cooling device 3 having an opening part 32 formed and a fitting dent part 32b for fitting in the insulating substrate 12 provided in the peripheral portion of the opening part 32a so that the peripheral portion on the other side surface of the insulating substrate 12 is bonded with the fitting dent part 32b of the top plate 32. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了解决半导体模块的传统冷却装置的问题，其绝缘基板的另一侧的整个表面与散热板接合，从而由于差异较大而产生翘曲变形的绝缘基板和热抛油环之间的线膨胀系数，并且由于在功率半导体元件111和冷却器103之间存在大量部件而使冷却装置的部件数量增加。解决方案：半导体模块的冷却装置1包括半导体模块2，其具有通过绝缘基板12的一个侧面上的电极板13接合的功率半导体元件11和具有开口部的冷却装置3的顶板32 32形成，并且配合凹部32b用于安装在设置在开口部32a的周边部分中的绝缘基板12中，使得周边部分绝缘基板12的另一侧表面与顶板32的嵌合凹部32b接合。（C）2008，JPO＆INPIT

6. 发明专利

JP2007081200A Insulated circuit board with cooling sink section 审中-公开
标题翻译：绝缘电路板，带冷却水槽部分
公开(公告)号：JP2007081200A
公开(公告)日：2007-03-29
申请号：JP2005268093
申请日：2005-09-15
申请人： Mitsubishi Materials Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱マテリアル株式会社
发明人： KUROMITSU YOSHIO , CHOKAI MAKOTO , NAGATOMO YOSHIYUKI , ISHIZUKA HIROYA , BABA YOICHIRO , WATANABE TOMOYUKI , YASUI TAKUYA
IPC分类号： H01L23/40 , H01L23/473
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To reduce total thermal resistance in a stacking direction without reducing joining reliability between constituents. SOLUTION: An insulated circuit board 10a with a cooling sink section is provided with an insulated circuit board 20 provided with an insulated plate 11, a circuit board 12 joined to one surface of the insulated plate 11 and a metal plate 13 joined to the other surface of the insulated plate 11; and a cooling sink section 31 provided on the lower surface of the metal plate 13 which is opposite to the surface joined to the insulated plate 11. The circuit board 10a has a configuration in which a semiconductor chip 30 is joined to the surface of the circuit board 12 via a first solder layer 14, and the metal plate 13 is joined to the cooling sink section 31 by a second solder layer 15 containing Sn having Young's modulus of 35 GPa or more, 0.2% proof stress of 30 MPa or more and tensile strength of 40 MPa or more as a main component. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：降低堆叠方向的总热阻而不降低组分之间的接合可靠性。解决方案：具有冷却槽部分的绝缘电路板10a设置有绝缘电路板20，绝缘电路板20设置有绝缘板11，连接到绝缘板11的一个表面的电路板12和连接到绝缘板11的金属板13 绝缘板11的另一个表面; 以及设置在与连接到绝缘板11的表面相对的金属板13的下表面上的冷却槽部分31.电路板10a具有其中半导体芯片30接合到电路的表面的构造板12通过第一焊料层14，并且金属板13通过包含具有35GPa以上的杨氏模量，30MPa以上的0.2％屈服应力和30MPa以上的Sn的Sn的第二焊料层15接合到冷却吸收部31，强度为40MPa以上为主要成分。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2004273487A Semiconductor element mounting module 审中-公开
公开(公告)号：JP2004273487A
公开(公告)日：2004-09-30
申请号：JP2003058027
申请日：2003-03-05
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： WATANABE TOMOYUKI
IPC分类号： H01L23/40 , H01L23/36 , H01L23/473 , H01L25/04 , H01L25/18
CPC分类号： H01L2224/45124 , H01L2224/48137 , H01L2224/48139 , H01L2224/48472 , H01L2224/73265 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor element mounting module reduced in cost, by reducing the unit prices, number, and assembling man-hour of components. SOLUTION: This semiconductor element mounting module 101 is provided with a cooler 105, an insulating-powder coating film 107 formed on the surface 105H of the cooler 105 and composed of insulating powder, and a thermal diffusion plate 109 placed on the coating film 107. This module 101 is also provided with semiconductor elements 103 and 104 joined to the surface of the thermal diffusion plate 109 through solder 111, and an elastic insulating resin 113 piled up on the cooler 105 so as to cover the thermal diffusion plate 109 and semiconductor elements 103 and 104. In addition, heat radiating grease 115 is interposed between the coating film 107 and thermal diffusion plate 109. COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2009218440A Semiconductor module 审中-公开
标题翻译：半导体模块
公开(公告)号：JP2009218440A
公开(公告)日：2009-09-24
申请号：JP2008061731
申请日：2008-03-11
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： WATANABE TOMOYUKI , EDA AKINORI , NAKAMURA HIDEO , IYO TOSHIO
IPC分类号： H01L23/40 , H01L25/07 , H01L25/18 , H05K7/20
CPC分类号： H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/4846 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve a problem wherein, when a housing is jointed to a cooler in a conventional semiconductor module, it becomes difficult to entirely seal the whole circumference between the housing and the cooler and to secure an adhesive having a necessary thickness if warpage occurs in the cooler. SOLUTION: This semiconductor module 1 is provided with: a module unit 2 composed by jointing a board 22 with a semiconductor element 21 mounted thereon on a cooler 10; and a housing 3 stuck on the cooler 10 of the module unit 2 through an adhesive 25. Adhesive application grooves 12a for applying the adhesive 25 thereto are formed on a sticking surface of the cooler 10 to the housing 3 along sticking parts; ribs 31a projecting into the adhesive application grooves 12a in a state separated from the inner peripheral surfaces of the adhesive application grooves 12a by a predetermined dimension (d) are formed on a sticking surface of the housing 3 to the cooler 10; an inner support part and an outer support part are formed on both side parts of each rib 31a on the sticking surface of the housing 3 to the cooler 10. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题为了解决在将现有的半导体模块中的壳体接合到冷却器时的问题，难以将壳体与冷却器之间的整个周边完全密封，并且固定具有冷却器发生翘曲时必要的厚度。解决方案：该半导体模块1设置有：模块单元2，其通过将板22与安装在其上的半导体元件21接合在冷却器10上而构成; 以及通过粘合剂25粘贴在模块单元2的冷却器10上的壳体3.用于将粘合剂25施加到其上的粘合剂施加槽12a沿着粘着部分形成在冷却器10的粘贴表面上; 以与胶粘剂涂敷槽12a的内周面分离预定尺寸（d）的状态，突出到胶粘剂施加槽12a中的肋31a形成在壳体3的粘贴表面上至冷却器10; 在壳体3的粘贴表面上的每个肋31a的两侧部分上形成内部支撑部分和外部支撑部分到冷却器10.版权所有：（C）2009，JPO＆INPIT

9. 发明专利

JP2008108993A Substrate for power module, method of manufacturing the substrate for power module, and power module 有权
标题翻译：电源模块基板，电源模块基板和电源模块的制造方法
公开(公告)号：JP2008108993A
公开(公告)日：2008-05-08
申请号：JP2006292006
申请日：2006-10-27
申请人： Mitsubishi Materials Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱マテリアル株式会社
发明人： KITAHARA JOJI , ISHIZUKA HIROYA , KUROMITSU YOSHIO , WATANABE TOMOYUKI
IPC分类号： H01L23/373 , H01L23/13 , H01L25/07 , H01L25/18
CPC分类号： H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H01L2224/83424 , H05K1/0306 , H05K1/09 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K2201/0355 , H05K2201/068 , H05K2203/0405 , H01L2924/014
摘要： PROBLEM TO BE SOLVED: To increase the bonding reliability of a power module. SOLUTION: A substrate 14 for a power module comprises a ceramics plate 11; a circuit layer 12 which is brazed to the front surface of the ceramic plate; a metal layer 13 which is brazed to the back surface of the ceramic plate; and a semiconductor chip 16 which is solder-bonded to the circuit layer 12. The metal layer 13 is formed of an Al alloy, having overall average purity of 98.0 to 99.9 wt.%. The concentration of Fe contained in a brazing surface 13a side for the ceramic plate 11 is less than 0.1 wt.%, and the concentration of Fe, contained in a surface 13b side opposite to the brazing surface 13a, is 0.1 wt.% or higher. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提高电源模块的接合可靠性。解决方案：用于功率模块的基板14包括陶瓷板11; 电路层12，其钎焊到陶瓷板的前表面; 金属层13，其钎焊到陶瓷板的背面; 以及与电路层12焊接的半导体芯片16.金属层13由Al合金形成，其平均纯度为98.0〜99.9重量％。陶瓷板11的钎焊表面13a侧所含的Fe的浓度小于0.1重量％，与钎焊面13a相反的表面13b侧的Fe的浓度为0.1重量％以上。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2010267769A Soldering method and apparatus 审中-公开
标题翻译：焊接方法和装置
公开(公告)号：JP2010267769A
公开(公告)日：2010-11-25
申请号：JP2009117400
申请日：2009-05-14
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： YAMANAKA TAKESHI , WATANABE TOMOYUKI
IPC分类号： H01L21/52 , B23K1/00 , B23K1/008 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering method and apparatus capable of performing the soldering without scattering foreign matters in a cooler when pressure-reducing with (air pressure-varied) an atmosphere chamber during the soldering of an element relative to a substrate of a cooler equipped with an insulating substrate.
SOLUTION: When a semiconductor element 11 is soldered relative to a substrate 12 of a cooler 10 equipped with an insulating substrate by this soldering apparatus 30, the inside of a chamber 31 is pressure-reduced by a vacuum pump 33 through an intra-chamber exhaustion piping 32 in a state in which couplers 36a, 36b attached to an intra-cooler exhaustion piping 34 connected to the vacuum pump 33 are fitted to the inlet and outlet of the cooler 16.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种焊接方法和装置，其能够在元件相对于一个元件的焊接期间在气氛室中进行压缩（气压变化）而在散热器内不散射异物而进行焊接配备有绝缘基板的冷却器的基板。解决方案：当通过该焊接装置30将半导体元件11相对于配备有绝缘基板的冷却器10的基板12进行焊接时，通过真空泵33通过内部的内部对室31的内部进行减压在连接到与真空泵33连接的冷却器内排气管道34中的联接器36a，36b装配到冷却器16的入口和出口的状态下， - 排气管32。（C）2011 ，JPO＆INPIT

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