专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013062282A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2013062282A
公开(公告)日：2013-04-04
申请号：JP2011198048
申请日：2011-09-12
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： INAGAKI NOBUAKI
IPC分类号： H01L23/34 , H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： H01L24/33 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having an improved heat radiation performance.SOLUTION: A present semiconductor device comprises: a semiconductor module; an insulating plate arranged on a principal surface of the semiconductor module via a first filling material; and a cooler arranged on the insulating plate via a second filling material. The insulating plate includes a recess on a surface facing the principal surface of the semiconductor module.
摘要翻译：要解决的问题：提供具有改进的散热性能的半导体器件。解决方案：本半导体器件包括：半导体模块; 绝缘板，其经由第一填充材料布置在所述半导体模块的主表面上; 以及通过第二填充材料布置在绝缘板上的冷却器。绝缘板包括在面向半导体模块的主表面的表面上的凹部。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2008206363A Semiconductor power converter and manufacturing method of same 有权
标题翻译：半导体功率转换器及其制造方法
公开(公告)号：JP2008206363A
公开(公告)日：2008-09-04
申请号：JP2007042205
申请日：2007-02-22
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： NAKAMURA HIDEO , WATANABE TOMOYUKI , ONO HIROTAKA , INAGAKI NOBUAKI
IPC分类号： H02M7/00
CPC分类号： H01L25/072 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/77272 , H01L2224/83801 , H01L2224/84801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H02M7/003 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a wiring connection structure for electrically and directly bonding electrodes in semiconductor elements and a bus bar, and mitigating a thermal stress at a bonded section between them. SOLUTION: The bus bar 200a has a lead section 210a and a bus bar section 205a which are integrally molded. The lead section 210a is provided so as to be formed into branches from the bus bar section 205a. A portion of the lead section 210a forms the bonded region 215a electrically and directly bonded to the transistor electrode 150 and the diode electrode 164 by a bonding material 160 such as a solder. A thickness t2 of the lead section 210a including the bonded region 215a is smaller than a thickness t1 of the bus bar section 205a (t2 COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在半导体元件和母线中电和直接接合电极的布线连接结构，并且减轻它们之间的接合部分处的热应力。汇流条200a具有一体成型的引线部210a和汇流条部205a。引线部分210a设置成从母线部分205a形成分支。引线部分210a的一部分通过诸如焊料的接合材料160形成电连接并直接接合到晶体管电极150和二极管电极164的接合区域215a。包括接合区域215a的引线部分210a的厚度t2小于汇流条部分205a的厚度t1（t2

3. 发明专利

JP2014022452A Spin coating device 有权
标题翻译：旋涂设备
公开(公告)号：JP2014022452A
公开(公告)日：2014-02-03
申请号：JP2012157678
申请日：2012-07-13
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： TANIGUCHI MAKOTO , KOMINAMI YOSHIAKI , INAGAKI NOBUAKI
IPC分类号： H01L21/027 , B05C11/08
摘要： PROBLEM TO BE SOLVED: To provide a spin coating device capable of applying coating liquid, in as uniform thickness as possible, to the whole area of a space in a workpiece having its top and bottom blocked.SOLUTION: Provided is a spin coating device 10 for applying coating liquid to a space K with its top and bottom blocked in a workpiece W which has an opening A communicating with the space K and is the object to be processed, said device comprising a jig 3 for fixing the workpiece W, an actuator 7 for rotating the jig 3, and a nozzle 6 for discharging the coating liquid. The nozzle 6 gets into the opening A and discharges the coating liquid to the space K. At least by reason that the workpiece W revolves, part of the coating liquid discharged to the space K having its top and bottom blocked is sprayed, so that the coating liquid is coated in the form of a film.
摘要翻译：要解决的问题：提供一种能够将涂布液以尽可能均匀的厚度涂覆到其顶部和底部被阻塞的工件的空间的整个区域中的旋涂装置。解决方案：提供一种旋涂装置10 用于将涂覆液体施加到空间K，其顶部和底部被阻塞在具有与空间K连通并且是待处理物体的开口A的工件W中，所述装置包括用于固定工件W的夹具3，致动器用于旋转夹具3的喷嘴7和用于排出涂布液的喷嘴6。喷嘴6进入开口A并将涂布液排出到空间K.至少由于工件W旋转，喷射到其顶部和底部被封闭的空间K中的部分涂布液被喷射，使得涂布液以膜的形式被涂覆。

4. 发明专利

JP2011114872A Power conversion apparatus 审中-公开
标题翻译：功率转换装置
公开(公告)号：JP2011114872A
公开(公告)日：2011-06-09
申请号：JP2009265814
申请日：2009-11-23
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： INAGAKI NOBUAKI
IPC分类号： H02M7/48 , H05K7/06
摘要： PROBLEM TO BE SOLVED: To provide a power conversion apparatus that can be miniaturized and reduced in the number of parts. SOLUTION: The power conversion apparatus 1 includes: a housing 10; a control board 12 having a high voltage detection circuit 64; a fixing screw 14 to fix the control board 12 to a housing 10 by being fastened to a fastening part 36 of a control board arranged at the housing 10; a screw insertion hole 66 arranged at the control board 12 for inserting the fixing screw 14; and a positive bus bar 16 for electrically connecting to a power supply. In the power conversion apparatus 1, an internal wiring 70 in the board electrically connects the screw insertion hole 66 to the high voltage detection circuit 64; the screw insertion hole 66 is constituted as a through-hole; and the positive bus bar 16 is electrically connected to the fixing screw 14. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以小型化并减少部件数量的电力转换装置。电源转换装置1包括：壳体10; 具有高电压检测电路64的控制板12; 固定螺钉14，通过紧固在布置在壳体10上的控制板的紧固部分36固定控制板12到壳体10; 布置在控制板12上用于插入固定螺钉14的螺钉插入孔66; 以及用于电连接到电源的正母线16。在电力转换装置1中，板内的内部配线70将螺钉插入孔66电连接到高电压检测电路64; 螺钉插入孔66构成为贯通孔; 正母线16与固定螺丝14电连接。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2006278591A Soldering jig and soldering method 审中-公开
标题翻译：焊接和焊接方法
公开(公告)号：JP2006278591A
公开(公告)日：2006-10-12
申请号：JP2005093423
申请日：2005-03-29
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： INAGAKI NOBUAKI
IPC分类号： H01L23/40 , H01L23/36 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide technology for suppressing dispersion of thickness of a semiconductor module in a double-sided side cooling type.
SOLUTION: In a soldering jig 40, the inner face of a surface-side conduction board 12 is reflow-soldered to a surface-side electrode 18 of an assembly member, where the rear-face side electrode of a semiconductor element 11 is connected and fixed to an inner-face of a rear face-side conduction board 14. The soldering jig 40 is provided with a lower jig 42, an upper jig 46, a regulating means, and an abutting mechanism. The lower jig 42 supports one conduction board of the rear-face side or a surface-side in a state, where an outer face turns downward. The upper jig 46 is placed on the outer face of the other conduction board of the rear-face side 14 and the surface-side 12, in a state where a solder material 66 for reflow soldering is arranged between the inner face of the surface-side conduction board 12 and the surface-side electrode 18 of the assembly member. The regulating means regulates a fall limit, when the solder material melts and the upper jig falls. The abutting mechanism makes the outer face of the other conduction board abut against the upper jig.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决方案的问题：提供抑制双面侧冷却型半导体模块的厚度分散的技术。解决方案：在焊接夹具40中，表面侧导电板12的内表面被回流焊到组装构件的表面侧电极18上，半导体元件11的背面侧电极连接固定在背面侧导电板14的内表面上。焊接夹具40设置有下夹具42，上夹具46，调节机构和抵接机构。下夹具42在外表面向下转动的状态下支撑背面侧的一个导电板或表面侧。上夹具46被放置在背面侧14和表面侧12的另一导电板的外表面上，在用于回流焊接的焊料66设置在表面侧14的内表面之间的状态下，侧导电板12和组装构件的表面侧电极18。当焊料熔化并且上夹具掉落时，调节装置调节下落极限。抵接机构使另一导电板的外表面抵靠上夹具。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2012151198A Structure for jointing bus bar and wiring 审中-公开
标题翻译：接线母线和布线的结构
公开(公告)号：JP2012151198A
公开(公告)日：2012-08-09
申请号：JP2011007466
申请日：2011-01-18
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： INAGAKI NOBUAKI
IPC分类号： H01L25/07 , H01L21/60 , H01L21/607 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/48 , H01L2224/48137 , H01L2224/48139 , H01L2224/4846 , H01L2224/48472 , H01L2224/49 , H01L2224/4903 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2224/49111 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a structure for jointing a bus bar and a wiring with improved strength for jointing the wiring to the bus bar.SOLUTION: In a structure for jointing a bus bar and a wiring, a bus bar 40 is insert-molded with resin and embedded in a resin case 50, and one end 70a of a bounding tape 70 is ultrasonic jointed on an upper surface 40a of the bus bar 40 exposed from the resin case 50. In the structure for jointing the bus bar and the wiring, the bus bar 40 has a concave 40d engaged with a hardened convex-shaped resin 51 at a portion opposed to a jointing portion 41 between one end 70a of the bounding tape 70 and the upper surface 40a of the bus bar 40. By this engagement, a force for binding the bus bar 40 to the resin case 50 becomes strong. Therefore, when one end 70a of the bonding tape 70 is ultrasonic jointed, a loss of vibration energy is reduced, and strength for jointing the bonding tape 70 to the bus bar 40 can be made large.
摘要翻译：要解决的问题：提供一种用于将母线和布线接合的结构，其具有改善的强度，用于将布线接合到汇流条。解决方案：在用于连接汇流条和布线的结构中，汇流条40用树脂嵌入成型并嵌入树脂壳体50中，并且边界带70的一端70a超声波接合在上部母线40的表面40a从树脂壳体50露出。在用于接合汇流条和布线的结构中，汇流条40具有与硬化的凸形树脂51接合的凹部40d，在边缘带70的一端70a和汇流条40的上表面40a之间的部分41。通过该接合，用于将汇流条40与树脂壳50结合的力变强。因此，当连接带70的一端70a被超声波接合时，能够减少振动能量的损失，能够使接合带70与汇流条40接合的强度更大。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2008155240A Method for discriminating quality of ultrasonic joining 有权
标题翻译：分辨超声波接合质量的方法
公开(公告)号：JP2008155240A
公开(公告)日：2008-07-10
申请号：JP2006345915
申请日：2006-12-22
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FUNANO SHO , INAGAKI NOBUAKI
IPC分类号： B23K20/10 , G01M99/00
摘要： PROBLEM TO BE SOLVED: To provide a method for discriminating the quality of the ultrasonic joining capable of correctly discriminating the joining quality of a workpiece based on a locus of the displacement of a joining horn.
SOLUTION: In the method for discriminating the quality of the ultrasonic joining, workpieces 5, 6 are subjected to the ultrasonic joining by giving the ultrasonic vibration while pressing superposed workpieces 5, 6 by a joining horn 2. Whether the joining quality is good or bad is correctly discriminated by whether or not the locus of the displacement L of the joining horn 2 passes through a predetermined control range A.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于区分能够根据接合喇叭的位移的轨迹正确地区分工件的接合质量的超声波接合质量的方法。解决方案：在用于区分超声波接合质量的方法中，通过在通过接合喇叭2挤压叠加的工件5,6时提供超声波振动来对工件5,6进行超声波接合。接合质量是否为通过接合喇叭2的位移L的轨迹是否经过预定的控制范围A来正确地区分好或坏。（C）2008，JPO和INPIT

8. 发明专利

JP2007330851A Horn for ultrasonic bonding, ultrasonic bonding apparatus and ultrasonic bonding method 审中-公开
标题翻译：超声波连接用超声波接合装置和超声波接合方法
公开(公告)号：JP2007330851A
公开(公告)日：2007-12-27
申请号：JP2006162709
申请日：2006-06-12
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： INAGAKI NOBUAKI
IPC分类号： B06B1/02 , B23K20/10
摘要： PROBLEM TO BE SOLVED: To provide a horn for ultrasonic bonding capable of suppressing occurring/scattering of a burr generated by pushing out a material of a material to be bonded from a gap between projection parts, reducing an amount of a transmission efficiency varied of energy relative to the material to be bonded by reducing variation of a shape by wearing of the projection part and prolonging a life to exchange of a tool.
SOLUTION: The horn 5 for ultrasonic bonding is constituted so as to be ultrasonic-vibrated in a predetermined vibration direction, has a plurality of projection parts 11 on a surface for pressurizing the material to be bonded, and ultrasonic-vibrates the material to be bonded while pressing it through the plurality of projection parts 11. The projection parts 11 are a hexagonal pyramid shape and are formed such that an opposed direction of a pair of opposed surfaces 11a, 11a becomes a direction perpendicular to a vibration direction.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：为了提供能够抑制从突出部之间的间隙推出待接合材料的材料而产生的毛刺的发生/飞散的超声波接合用喇叭，减少了传输效率通过减少突起部的磨损来减小形状的变化并延长工具更换的寿命，相对于待粘合的材料的能量变化。解决方案：用于超声波接合的喇叭5被构造成在预定的振动方向上被超声波振动，在用于加压待接合的材料的表面上具有多个突出部11，并且使材料超声波振动在通过多个突起部分11压制的同时被粘合。突起部分11是六角锥形的，并且形成为使得一对相对表面11a，11a的相对方向成为垂直于振动方向的方向。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2005228919A Stacked power module and method of positioning the same 有权
标题翻译：堆叠电源模块及其定位方法
公开(公告)号：JP2005228919A
公开(公告)日：2005-08-25
申请号：JP2004036291
申请日：2004-02-13
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： OKAMURA TAKESHI , ONO HIROTAKA , INAGAKI NOBUAKI
IPC分类号： H01L23/40 , H01L25/11
摘要： PROBLEM TO BE SOLVED: To solve the problem, wherein operability when inserting connection terminals to connection holes is degraded in a conventional laminated power module, since the relative positions of the connection terminals of semiconductor modules, and the connection holes of a circuit board are deviated, since variations of the thicknesses of respective parts constituting the semiconductor modules, the thickness of grease applied to an insulating board and the like are built up due to the lamination of the semiconductor modules and cooling apparatuses.
SOLUTION: The stacked power module 1 is constituted by alternately stacking a plurality of the semiconductor modules 10 and cooling apparatuses 20. At a support case 30 supporting the semiconductor modules 10 and cooling apparatuses 20, the recess 31a of a positioning part for individually deciding the positions in the stacking direction of the respective semiconductor modules 10 or the respective cooling apparatuses 20 is formed, and flat springs 21 serving as biasing members for sticking the semiconductor modules 10 and the cooling apparatuses 20 are provided.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决问题：为了解决在以往的层叠功率模块中将连接端子插入连接孔时的可操作性劣化的问题，由于半导体模块的连接端子和电路的连接孔的相对位置由于半导体模块和冷却装置的叠层，由于构成半导体模块的各个部分的厚度的变化，施加到绝缘板等的润滑脂的厚度的变化，板偏移。堆叠式功率模块1通过交替堆叠多个半导体模块10和冷却装置20而构成。在支撑半导体模块10和冷却装置20的支撑壳体30处，用于形成各个半导体模块10或各个冷却装置20的层叠方向的位置，并且设置有用作粘贴半导体模块10和冷却装置20的偏置构件的板簧21。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2005086018A Power module, and attaching method thereof 有权
标题翻译：电源模块及其连接方法
公开(公告)号：JP2005086018A
公开(公告)日：2005-03-31
申请号：JP2003317170
申请日：2003-09-09
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： ISHIMATSU HISATOMO , INAGAKI NOBUAKI
IPC分类号： H01L23/40 , H01L23/36 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the heat radiating quality of a power module without increasing its cost, by so heating it previously that the warping shape of the surface of its heat radiating plate becomes protrusive, by making the extension of a heat conducting grease easy, by so preventing the cavity and gap generated between its heat radiating plate and a case when attaching it to the case as to adhere to each other both the plate and case, and by preventing both end portions of the plate from so receiving the reaction forces of the heat conducting grease as to deform the power module. SOLUTION: The attaching method of a power module 1, whereby the power module 1 having a mounted heat radiating plate 12 is attached to an inverter case 3 via a heat conducting grease, has a process for heating previously the surface of the heat radiating plate 12 of the power module 1 before attaching the power module 1 to the case 3, a process for so forming the warp of the surface of the heat radiating plate of the power module 1 that the warp becomes protrusive, and a process wherein after fastening to the inverter case 3 one end-side of the plate 12 in the warp forming direction, the other end-side of plate 12 is fastened to the inverter case 3. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提高功率模块的散热质量而不增加其成本，通过如此加热，预先使其散热板的表面的翘曲形状变得突出，通过使热量延伸通过防止其散热板之间产生的空腔和间隙与将壳体附接到壳体上以使板和壳体彼此粘附，并且防止板的两个端部如此接收而导致油脂容易导热油脂的反作用力使功率模块变形。解决方案：电源模块1的安装方法，其中具有安装的散热板12的电源模块1经由导热油脂附接到逆变器壳体3，具有先前将热表面加热的工艺在将功率模块1附接到壳体3之前，将功率模块1的散热板12，形成功率模块1的散热板的表面的翘曲，使翘曲变得突出的工序，将板12的另一端侧固定在逆变器壳体3上，在该板12的一端侧经由成形方向，将其固定在逆变器壳体3上。（C）2005，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式