专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2008108993A Substrate for power module, method of manufacturing the substrate for power module, and power module 有权
标题翻译：电源模块基板，电源模块基板和电源模块的制造方法
公开(公告)号：JP2008108993A
公开(公告)日：2008-05-08
申请号：JP2006292006
申请日：2006-10-27
申请人： Mitsubishi Materials Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱マテリアル株式会社
发明人： KITAHARA JOJI , ISHIZUKA HIROYA , KUROMITSU YOSHIO , WATANABE TOMOYUKI
IPC分类号： H01L23/373 , H01L23/13 , H01L25/07 , H01L25/18
CPC分类号： H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H01L2224/83424 , H05K1/0306 , H05K1/09 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K2201/0355 , H05K2201/068 , H05K2203/0405 , H01L2924/014
摘要： PROBLEM TO BE SOLVED: To increase the bonding reliability of a power module. SOLUTION: A substrate 14 for a power module comprises a ceramics plate 11; a circuit layer 12 which is brazed to the front surface of the ceramic plate; a metal layer 13 which is brazed to the back surface of the ceramic plate; and a semiconductor chip 16 which is solder-bonded to the circuit layer 12. The metal layer 13 is formed of an Al alloy, having overall average purity of 98.0 to 99.9 wt.%. The concentration of Fe contained in a brazing surface 13a side for the ceramic plate 11 is less than 0.1 wt.%, and the concentration of Fe, contained in a surface 13b side opposite to the brazing surface 13a, is 0.1 wt.% or higher. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提高电源模块的接合可靠性。解决方案：用于功率模块的基板14包括陶瓷板11; 电路层12，其钎焊到陶瓷板的前表面; 金属层13，其钎焊到陶瓷板的背面; 以及与电路层12焊接的半导体芯片16.金属层13由Al合金形成，其平均纯度为98.0〜99.9重量％。陶瓷板11的钎焊表面13a侧所含的Fe的浓度小于0.1重量％，与钎焊面13a相反的表面13b侧的Fe的浓度为0.1重量％以上。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007250638A Cooler 有权
标题翻译： COOLER
公开(公告)号：JP2007250638A
公开(公告)日：2007-09-27
申请号：JP2006069112
申请日：2006-03-14
申请人： Mitsubishi Materials Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱マテリアル株式会社
发明人： NAGATOMO YOSHIYUKI , CHOKAI MAKOTO , ISHIZUKA HIROYA , KITAHARA JOJI , KUROMITSU YOSHIO , WATANABE TOMOYUKI
IPC分类号： H01L23/373 , H01L23/36
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To correspond to the high output of a power module, and to raise joining reliability respectively in a joining part between a planar material and the surface of a cooler body, and a joining part between an insulating circuit substrate and the planar material. SOLUTION: The cooler 14 for the power module is arranged on the rear surface of a ceramic plate 11 where a semiconductor chip 13 is arranged on the front surface. The cooler includes: the planar material 17 formed of pure Cu with the purity of not less than 99.90%; and the cooler body 19 where at least the front surface with the planar material 17 arranged thereon is formed of pure Al with the purity of not less than 99.0%. The front surface of the planar material 17 is joined to the rear surface side of the ceramic plate 11 and the rear surface is joined by soldering onto the surface of the cooler body 19. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了对应于功率模块的高输出，并且分别在平面材料和冷却体的表面之间的接合部分中提高接合可靠性，以及绝缘电路基板和平面材料。解决方案：用于功率模块的冷却器14布置在陶瓷板11的后表面上，其中半导体芯片13布置在前表面上。冷却器包括：由纯Cu形成的平面材料17，纯度不低于99.90％; 并且其中至少具有布置在其上的平面材料17的前表面的冷却器主体19由纯Al形成，纯度不小于99.0％。平面材料17的前表面与陶瓷板11的后表面接合，后表面通过焊接接合到冷却体19的表面上。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2014072365A Manufacturing method of substrate for power module 有权
标题翻译：电源模块基板的制造方法
公开(公告)号：JP2014072365A
公开(公告)日：2014-04-21
申请号：JP2012217186
申请日：2012-09-28
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： AOKI SHINSUKE , KATO HIROKAZU , KITAHARA JOJI
IPC分类号： H01L23/12 , H01L23/36 , H05K3/22
摘要： PROBLEM TO BE SOLVED: To easily manufacture a substrate for a power module whose warpage amount is small.SOLUTION: A manufacturing method of a substrate for a power module comprises: a substrate manufacturing process for manufacturing a substrate for a power module by respectively bonding metal layers to both sides of a ceramic substrate; a vacuum packaging process for forming a vacuum package in a state where the substrate for a power module is pressed against a holding surface formed on a tray by mounting the substrate for a power module on the holding surface of the tray and vacuum packing the substrate for a power module and the tray with a plastic film; and a cooling process for cooling the vacuum package to a temperature lower than a normal temperature.
摘要翻译：要解决的问题：为了容易地制造翘曲量小的功率模块用基板。解决方案：功率模块用基板的制造方法包括：通过分别将金属接合来制造功率模块用基板的基板制造工序层到陶瓷基板的两侧; 在通过将用于功率模块的基板安装在托盘的保持表面上的状态下，将用于功率模块的基板压靠在托盘上的保持表面的状态下形成真空封装的真空包装处理，并且真空包装基板电源模块和带塑料薄膜的托盘; 以及用于将真空包装冷却到低于常温的温度的冷却过程。

4. 发明专利

JP2013207236A Power module substrate and manufacturing method thereof 有权
标题翻译：功率模块基板及其制造方法
公开(公告)号：JP2013207236A
公开(公告)日：2013-10-07
申请号：JP2012077401
申请日：2012-03-29
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , KITAHARA JOJI , MURANAKA AKIRA
IPC分类号： H01L23/14 , C04B37/02 , H01L23/12 , H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： B23K1/0016 , B23K1/19 , B32B15/04 , B32B18/00 , B32B2457/00 , C04B37/026 , C04B2235/6581 , C04B2235/723 , C04B2235/963 , C04B2237/121 , C04B2237/126 , C04B2237/128 , C04B2237/366 , C04B2237/402 , C04B2237/52 , C04B2237/60 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/86 , H01L23/3735 , H01L23/3736 , H01L23/473 , H01L2224/48091 , H01L2224/73265 , H05K1/0306 , H05K3/382 , H05K3/383 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a power module substrate which has had minute voids in junctions reduced to prevent separation and a method for manufacturing the power module substrate.SOLUTION: A metal plate consisting of aluminum or aluminum alloy is joined by soldering to the face on at least one side of a ceramic substrate. When the cross section of the metal plate in a depth range of 5 μm from a junction interface between the metal plate and the ceramic substrate within a region of 200 μm in width from a side edge of the metal plate is observed by a scanning electron microscope in a 3000-fold magnified field of vision, a total length of continuous residual oxide existing continuously 2 μm or more along the junction interface is 70% or less of the length of the visual field.
摘要翻译：要解决的问题：提供一种功率模块基板，其在接合处具有微小的空隙以防止分离，以及制造功率模块基板的方法。解决方案：由铝或铝合金组成的金属板通过焊接连接到表面在陶瓷基板的至少一侧上。当通过扫描电子显微镜观察金属板的距离金属板和陶瓷基板之间的接合界面的距离金属板的侧边宽度在200μm宽度范围内的金属板的横截面在3000倍放大视野中，沿着接合界面连续存在2μm以上的连续残余氧化物的总长度为视野长度的70％以下。

5. 发明专利

JP2013065918A Power module substrate with heat sink, manufacturing method thereof, power module with heat sink, and power module substrate 有权
标题翻译：具有散热功能的模块底座，其制造方法，具有散热功能的模块和功率模块基板
公开(公告)号：JP2013065918A
公开(公告)日：2013-04-11
申请号：JP2013007864
申请日：2013-01-18
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： HAYASHI HIROMASA , KITAHARA JOJI , TONOMURA HIROSHI , ISHIZUKA HIROYA , KUROMITSU YOSHIO
IPC分类号： H01L23/36 , H01L23/12
CPC分类号： H01L23/3735 , H01L2224/32225 , Y10T29/49126 , Y10T29/49227
摘要： PROBLEM TO BE SOLVED: To provide a power module substrate with a heat sink capable of suppressing warpage occurrence, a manufacturing method thereof, a power module with a heat sink, and a power module substrate.SOLUTION: A power module substrate 10 with a heat sink comprises a power module substrate 11 in which a circuit layer 13 is formed on one surface of an insulating substrate 12 and a metal layer 14 is formed on the other surface, and a heat sink 17 which is jointed to the metal layer 14 side and cools the power module substrate 11. The metal layer 14 is directly jointed to the heat sink 17. A ratio B/A of thickness A of the circuit layer 13 to thickness B of the metal layer 14 is set in a range of 2.167≤B/A≤20.
摘要翻译：要解决的问题：为了提供具有能够抑制翘曲发生的散热器的功率模块基板，其制造方法，具有散热器的功率模块和功率模块基板。解决方案：具有散热器的功率模块基板10包括功率模块基板11，其中电路层13形成在绝缘基板12的一个表面上，并且金属层14形成在另一表面上，并且散热器17，其连接到金属层14侧并冷却功率模块基板11.金属层14直接连接到散热器17.电路层13的厚度A与厚度B的比率B / A 金属层14设定在2.167≤B/A≤20的范围内。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2010171437A Substrate for power module with heat sink, method for manufacturing the same, power module with heat sink, and substrate for power module 有权
标题翻译：具有散热功率模块的基板，其制造方法，带有散热器的功率模块和电源模块的基板
公开(公告)号：JP2010171437A
公开(公告)日：2010-08-05
申请号：JP2010053620
申请日：2010-03-10
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： HAYASHI HIROMASA , KITAHARA JOJI , TONOMURA HIROSHI , ISHIZUKA HIROYA , KUROMITSU YOSHIO
IPC分类号： H01L23/36 , H01L23/12
CPC分类号： H01L23/3735 , H01L2224/32225 , Y10T29/49126 , Y10T29/49227
摘要： PROBLEM TO BE SOLVED: To provide: a substrate for a power module with a heat sink suppressing the occurrence of warpage; a method of manufacturing the same; a power module with a heat sink; and a substrate for a power module. SOLUTION: In the substrate 10 for a power module with a heat sink including: the substrate 11 for a power module formed with a circuit layer 13 on one surface of an insulation substrate 12, and formed with a metal layer 14 on the other face; and a heat sink 17 joined to the metal layer 14 side for cooling the substrate 11 for a power module, wherein the metal layer 14 is directly joined with the heat sink 17; and the ratio B/A of the thickness A of the circuit layer 13 to the thickness B of the metal layer 14 is set within the range of 2.167≤B/A≤20. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于具有抑制翘曲发生的散热器的功率模块的基板; 其制造方法; 具有散热器的电源模块; 以及功率模块用基板。解决方案：在具有散热器的功率模块的基板10中，包括：用于功率模块的基板11，其在绝缘基板12的一个表面上形成有电路层13，并且在其上形成有金属层14 其他脸以及连接到金属层14侧的散热器17，用于冷却用于功率模块的基板11，其中金属层14与散热器17直接接合; 并且电路层13的厚度A与金属层14的厚度B的比率B / A设定在2.167≤B/A≤20的范围内。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2008205372A Unit for mounting power element, manufacturing method of the unit for mounting power element and power module 有权
标题翻译：电力元件安装单元，电力元件安装单元和电源模块的制造方法
公开(公告)号：JP2008205372A
公开(公告)日：2008-09-04
申请号：JP2007042329
申请日：2007-02-22
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： MIYATA HIROSHI , ISHIZUKA HIROYA , KUROMITSU YOSHIO , KITAHARA JOJI
IPC分类号： H01L23/473
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a unit for mounting a power element which has superior cooling performance and can execute miniaturization and space saving for an apparatus, and to provide a manufacturing method of the unit for mounting a power element and a power module. SOLUTION: The unit 7 for mounting a power element is constituted so that a cooling liquid C circulating in an apparatus can recover heat and cool the apparatus. In the power unit 7, two separated headers 1a, 1b through which the cooling liquid C circulates and a multi-flow passage pipe 2 having both ends supported between the headers 1a, 1b and allowing the cooling liquid C to circulate are each differently disposed side by side in plane; and the power unit 7 is provided with a ceramic insulating layer 52 directly jointed to one surface of the multi-flow passage pipe 2; and a circuit layer 51 provided on the one surface of the ceramic insulating layer 52. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于安装具有优良冷却性能的功率元件的单元，并且可以实现装置的小型化和节省空间，并且提供用于安装功率元件和功率的单元的制造方法模块。解决方案：用于安装功率元件的单元7构成为使得在设备中循环的冷却液C可以回收热量并冷却设备。在动力单元7中，冷却液C循环的两个分离的集管1a，1b和两个支撑在集管1a，1b之间并允许冷却液体C循环的多流道管2分别为不同的侧面在飞机上; 功率单元7设置有直接连接到多流路管2的一个表面的陶瓷绝缘层52; 以及设置在陶瓷绝缘层52的一个表面上的电路层51.版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2013122996A Substrate for power module, substrate for power module with heat sink, and power module 有权
标题翻译：功率模块基板，带有散热器的电源模块基板和电源模块
公开(公告)号：JP2013122996A
公开(公告)日：2013-06-20
申请号：JP2011271081
申请日：2011-12-12
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NISHIKAWA MASAHITO , NISHIMOTO SHUJI , KITAHARA JOJI , NAGASE TOSHIYUKI
IPC分类号： H01L23/36 , H01L23/12 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a substrate for a power module which inhibits the joint reliability achieved between an insulation layer and a metal plate from deteriorating even when a joined material is joined using flux, and to provide the substrate for the power module with a heat sink and the power module.SOLUTION: In a substrate for a power module 10, a circuit layer 12 is formed on one surface of an insulation layer 11, and a metal layer 13 is formed on the other surface of the insulation layer 11. A joined body is joined to one surface of the metal layer 13 using flux. A flux component intrusion prevention layer 51 including an oxidative product and a resin is formed at a peripheral part of a joining surface between the insulation layer 11 and the metal layer 13.
摘要翻译：要解决的问题：即使当使用焊剂接合接合材料时，提供抑制绝缘层和金属板之间实现的接合可靠性劣化的功率模块的基板，并且提供用于功率的基板模块带有散热器和电源模块。解决方案：在用于功率模块10的基板中，在绝缘层11的一个表面上形成电路层12，并且在绝缘层11的另一个表面上形成金属层13。使用焊剂与金属层13的一个表面接合。在绝缘层11和金属层13之间的接合面的周边部形成有包含氧化物和树脂的助熔剂成分侵入防止层51.（C）2013，JPO＆INPIT

9. 发明专利

JP2012114224A Power module substrate with heat sink and manufacturing method of the power module and the power module substrate 有权
标题翻译：功率模块基板与功率模块和功率模块基板的散热和制造方法
公开(公告)号：JP2012114224A
公开(公告)日：2012-06-14
申请号：JP2010261618
申请日：2010-11-24
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , AOKI SHINSUKE , KITAHARA JOJI
IPC分类号： H01L23/36 , H01L23/29 , H01L23/40
CPC分类号： H01L2224/83801
摘要： PROBLEM TO BE SOLVED: To provide a power module substrate with a heat sink which prevents cracks of ceramic substrates and the like without impairing characteristics of heat radiation from the power module substrate to the heat sink, and to provide manufacturing a method of the power module including the power module substrate and the power module substrate.SOLUTION: A power module substrate with a heat sink comprises: a power module substrate 3 in which metal layers 6 and 7 are joined to both surfaces of a ceramic substrate 2; a heat sink 5 temporarily joined to the metal layer 7, which is one of the metal layers, by interposing an Ag calcination layer 9 between the heat sink 5 and the metal layer 7; and holding means (sealing material 10) holding the power module substrate 3 and the heat sink 5 in a lamination state.
摘要翻译：要解决的问题：为了提供功率模块基板具有散热器，其防止陶瓷基板等的裂纹，而不损害从功率模块基板到散热器的热辐射的特性，并且提供制造方法功率模块包括功率模块基板和功率模块基板。解决方案：具有散热器的功率模块基板包括：功率模块基板3，其中金属层6和7接合到陶瓷基板2的两个表面; 通过在散热器5和金属层7之间插入Ag煅烧层9，临时接合到作为金属层之一的金属层7的散热器5; 以及将功率模块基板3和散热片5保持在层压状态的保持机构（密封材料10）。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2010238964A Substrate for power module, method for manufacturing substrate for power module, and power module 有权
标题翻译：电源模块基板，电源模块基板制作方法及电源模块
公开(公告)号：JP2010238964A
公开(公告)日：2010-10-21
申请号：JP2009086069
申请日：2009-03-31
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NAGASE TOSHIYUKI , KITAHARA JOJI , KUROMITSU YOSHIO
IPC分类号： H01L23/373 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a substrate for a power module, capable of suppressing the occurrence of warpage or crack of a ceramic substrate even if it has a comparatively large area, a method for manufacturing the substrate for a power module, and a power module using this substrate for a power module. SOLUTION: The substrate includes a metal layer 13 made of a plate of aluminum or aluminum alloy, a ceramic substrate disposed on one surface of the metal layer 13, and a circuit layer disposed on the ceramic substrate and made of an aluminum or aluminum alloy. The metal layer 13 has an area set to be larger than that of the ceramic substrate, and is equipped with a hard layer 31 in which a second phase is dispersed in a host phase of the aluminum and a soft layer 32 made of a single phase of aluminum in one surface side portion. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种用于功率模块的基板，即使其面积比较大，也能够抑制陶瓷基板的翘曲或裂纹的发生，制造功率模块用基板的方法，以及使用该基板用于功率模块的功率模块。解决方案：基板包括由铝或铝合金板制成的金属层13，设置在金属层13的一个表面上的陶瓷基板和设置在陶瓷基板上并由铝制成的电路层铝合金。金属层13的面积设定为大于陶瓷基板的面积，并且配备有第二相分散在铝的主相中的硬质层31和由单相制成的软层32 在一个表面侧部分的铝。版权所有（C）2011，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式