专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007081201A Insulated circuit board and insulated circuit board with cooling sink section 有权
标题翻译：绝缘电路板和绝缘电路板与冷却水槽部分
公开(公告)号：JP2007081201A
公开(公告)日：2007-03-29
申请号：JP2005268094
申请日：2005-09-15
申请人： Mitsubishi Materials Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱マテリアル株式会社
发明人： KUROMITSU YOSHIO , CHOKAI MAKOTO , NAGATOMO YOSHIYUKI , ISHIZUKA HIROYA , BABA YOICHIRO , WATANABE TOMOYUKI , YASUI TAKUYA
IPC分类号： H01L23/473
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To reduce total thermal resistance in a stacking direction without reducing joining reliability between constituents. SOLUTION: An insulated circuit board is provided with an insulated plate 11, a circuit board 12 joined to one surface of the insulated plate 11 and a metal plate 13 joined to the other surface of the insulated plate 11. This insulated circuit board has a configuration in which a semiconductor chip 30 is joined to the surface of the circuit board 12 and the cooling sink section 31 is joined to the lower surface of the metal plate 13 which is opposite to surface joined to the insulated plate 11. The circuit board 12 and the metal plate 13 are formed of pure Al or Al alloy, and the thickness (a) of the circuit board 12 is 0.2-0.8 mm, and the thickness (b) of the metal plate 13 is 0.6-1.5 mm, where a/b≤1. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：降低堆叠方向的总热阻而不降低组分之间的接合可靠性。解决方案：绝缘电路板设置有绝缘板11，连接到绝缘板11的一个表面的电路板12和连接到绝缘板11的另一个表面的金属板13.该绝缘电路板具有半导体芯片30接合到电路板12的表面并且冷却吸收部分31接合到金属板13的与连接到绝缘板11的表面相对的下表面的构造。电路板12和金属板13由纯Al或Al合金形成，并且电路板12的厚度（a）为0.2-0.8mm，金属板13的厚度（b）为0.6-1.5mm，其中a /b≤1。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007081202A Insulated circuit board and insulated circuit board with cooling sink section 有权
标题翻译：绝缘电路板和绝缘电路板与冷却水槽部分
公开(公告)号：JP2007081202A
公开(公告)日：2007-03-29
申请号：JP2005268095
申请日：2005-09-15
申请人： Mitsubishi Materials Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱マテリアル株式会社
发明人： KUROMITSU YOSHIO , CHOKAI MAKOTO , NAGATOMO YOSHIYUKI , ISHIZUKA HIROYA , BABA YOICHIRO , WATANABE TOMOYUKI , YASUI TAKUYA
IPC分类号： H01L23/473 , H01L23/36 , H01L23/373
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To reduce total thermal resistance in a stacking direction without reducing joining reliability between constituents. SOLUTION: An insulated circuit board is provided with an insulated plate 11, a circuit board 12 joined to one surface of the insulated plate 11 and a metal plate 13 joined to the other surface of the insulated plate 11. This insulated circuit board has a configuration in which a semiconductor chip 30 is joined to the surface of the circuit board 12 via a first solder layer 14, and the cooling sink section 31 is joined via a second solder layer 15 to the lower rear surface of the metal plate 13 which is opposite to the surface joined to the insulated plate 11. The circuit board 12 is formed of Al alloy of purity of not less than 99.98% or pure Al, and the metal plate 13 is formed of Al alloy of purity 98.00-99.90%. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：降低堆叠方向的总热阻而不降低组分之间的接合可靠性。解决方案：绝缘电路板设置有绝缘板11，连接到绝缘板11的一个表面的电路板12和连接到绝缘板11的另一个表面的金属板13.该绝缘电路板具有通过第一焊料层14将半导体芯片30接合到电路基板12的表面的结构，并且冷却吸收部31经由第二焊料层15接合到金属板13的下后表面其与连接到绝缘板11的表面相对。电路板12由纯度不小于99.98％的Al合金或纯Al形成，金属板13由纯度为98.00-99.90％的Al合金形成，。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007081200A Insulated circuit board with cooling sink section 审中-公开
标题翻译：绝缘电路板，带冷却水槽部分
公开(公告)号：JP2007081200A
公开(公告)日：2007-03-29
申请号：JP2005268093
申请日：2005-09-15
申请人： Mitsubishi Materials Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 三菱マテリアル株式会社
发明人： KUROMITSU YOSHIO , CHOKAI MAKOTO , NAGATOMO YOSHIYUKI , ISHIZUKA HIROYA , BABA YOICHIRO , WATANABE TOMOYUKI , YASUI TAKUYA
IPC分类号： H01L23/40 , H01L23/473
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To reduce total thermal resistance in a stacking direction without reducing joining reliability between constituents. SOLUTION: An insulated circuit board 10a with a cooling sink section is provided with an insulated circuit board 20 provided with an insulated plate 11, a circuit board 12 joined to one surface of the insulated plate 11 and a metal plate 13 joined to the other surface of the insulated plate 11; and a cooling sink section 31 provided on the lower surface of the metal plate 13 which is opposite to the surface joined to the insulated plate 11. The circuit board 10a has a configuration in which a semiconductor chip 30 is joined to the surface of the circuit board 12 via a first solder layer 14, and the metal plate 13 is joined to the cooling sink section 31 by a second solder layer 15 containing Sn having Young's modulus of 35 GPa or more, 0.2% proof stress of 30 MPa or more and tensile strength of 40 MPa or more as a main component. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：降低堆叠方向的总热阻而不降低组分之间的接合可靠性。解决方案：具有冷却槽部分的绝缘电路板10a设置有绝缘电路板20，绝缘电路板20设置有绝缘板11，连接到绝缘板11的一个表面的电路板12和连接到绝缘板11的金属板13 绝缘板11的另一个表面; 以及设置在与连接到绝缘板11的表面相对的金属板13的下表面上的冷却槽部分31.电路板10a具有其中半导体芯片30接合到电路的表面的构造板12通过第一焊料层14，并且金属板13通过包含具有35GPa以上的杨氏模量，30MPa以上的0.2％屈服应力和30MPa以上的Sn的Sn的第二焊料层15接合到冷却吸收部31，强度为40MPa以上为主要成分。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007250571A Tape bonding equipment and method therefor 审中-公开
标题翻译：胶带接合设备及其方法
公开(公告)号：JP2007250571A
公开(公告)日：2007-09-27
申请号：JP2006067751
申请日：2006-03-13
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： YASUI TAKUYA
IPC分类号： H01L21/607
CPC分类号： H01L2224/32225 , H01L2224/73265 , H01L2224/78313 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve the matter of conventional tape bonding equipment that, when the bonding reference surface of an IGBT element is inclining against the lowering direction of a bonding tool, bonding operation is performed while inclining the bonding reference surface and a significant force is applied to the IGBT element, thus causing damage or degradation of characteristics. SOLUTION: The tape bonding equipment for connecting a tape material 14 to the wiring terminal 52a of a semiconductor device 5 in a workpiece 4 constituted by bonding the semiconductor device 5 to a housing 6 comprises a pin 3 for pressing the periphery of bonding region of the tape material 14, when the tape material 14 is bonded to the wiring terminal 52a of the semiconductor device 5. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了解决传统的带状接合设备的问题，即当IGBT元件的接合基准表面相对于接合工具的下降方向倾斜时，进行接合操作同时使接合基准面和对IGBT元件施加很大的力，从而导致特性的损坏或劣化。解决方案：将带状材料14连接到通过将半导体器件5接合到壳体6而构成的工件4中的半导体器件5的接线端子52a的带接合设备包括用于按压接合周围的销3 当带材14接合到半导体器件5的布线端子52a时，带材14的区域。（C）2007年，JPO和INPIT

5. 发明专利

JP2015061350A 車両用平滑回路审中-公开
标题翻译：用于车辆的平滑电路
公开(公告)号：JP2015061350A
公开(公告)日：2015-03-30
申请号：JP2013192164
申请日：2013-09-17
申请人：トヨタ自動車株式会社 , Toyota Motor Corp
发明人： YASUI TAKUYA
IPC分类号： B60L3/04
CPC分类号： Y02T10/7241
摘要：【課題】車両の衝突時にコンデンサの放電処理を不要にできる、車両用平滑回路を提供すること。【解決手段】コンデンサ21a,21b,21cが複数直列に接続された車両用平滑回路であって、コンデンサ21a,21b,21cのうちの隣り合うコンデンサ間の接続を車両の衝突時に分断する分断手段を備えることを特徴とする、車両用平滑回路。分断手段は、例えば、コンデンサ21aとコンデンサ21bとの接続を分断するリレー22aと、コンデンサ21bとコンデンサ21cとの接続を分断するリレー22bと、リレー22a,22bによる分断を車両の衝突時に制御するリレー制御部23とを有している。【選択図】図1
摘要翻译：要解决的问题：提供一种用于车辆的平滑电路，其能够消除在车辆碰撞期间电容器的放电过程的需要。解决方案：一种用于车辆的平滑电路，其具有连接到多个电容器21a，21b和21 串联包括用于在车辆碰撞期间中断电容器21a，21b和21c的相邻电容器之间的连接的中断装置。中断装置包括例如用于中断电容器21a和电容器21b之间的连接的继电器22a，用于中断电容器21b和电容器21c之间的连接的继电器22b和控制中断的继电器控制部23 在车辆碰撞期间由继电器22a和22b执行。

6. 发明专利

JP2013015403A Semiconductor inspection device 审中-公开
标题翻译：半导体检测装置
公开(公告)号：JP2013015403A
公开(公告)日：2013-01-24
申请号：JP2011148248
申请日：2011-07-04
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： YASUI TAKUYA
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To improve efficiency, cost, workload, or the like in performing an inspection.SOLUTION: A semiconductor inspection device 1 according to the present invention includes a stage part 2 for placing an object 4 to be inspected, and a probe part 3 for outputting a current to inspect the object to be inspected. The stage part includes a stationary member 5, a movable member 6 interposed between the stationary member and the object 4 to be inspected, and displacement means which, if there are abnormalities in the inspection results, displaces a contact part 15 of the movable member with the object to be inspected. Also, the movable member is wound around a roller member, and the displacement means may control the rotation of the roller member according to the inspection results.
摘要翻译：要解决的问题：提高检查中的效率，成本，工作量等。＆lt; P＆gt;解决方案：根据本发明的半导体检查装置1包括用于放置被检查物体4的台部2和用于输出电流以检查被检查物体的探针部3。台架部分包括静止部件5，插入固定部件和待检查物体4之间的可动部件6以及如果检查结果有异常的位移装置，可移动部件的接触部件15移动被检查对象。此外，可动构件卷绕在辊构件上，位移装置可以根据检查结果来控制辊构件的旋转。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JPH01128454A IC WITH SELECTABLE PIN ARRANGEMENT 失效
公开(公告)号：JPH01128454A
公开(公告)日：1989-05-22
申请号：JP28677987
申请日：1987-11-12
申请人： TOYOTA MOTOR CORP
发明人： YASUI TAKUYA
IPC分类号： H01L23/32 , H01L23/52
摘要： PURPOSE:To freely select an arbitrary pin arrangement, say, an output part of a signal processing part to which each pin is connected, by applying a predetermined voltage to a fuse pattern through a decode circuit to melt away that pattern over a region of the same which region demonstrates a unnecessary conduction relationship. CONSTITUTION:Respective pins 16a-38a are not connected intactly to an output part fixed in position in a signal processing part 34, but connected to one ends of connecting lead frame select lines 44-58 derived from the output part of the signal processing part 34 and one ends of connecting signal select lines 60-74 arranged in a matrix form with respect to the former lines. All intersections between both select lines are electrically connected through a conductive fuse pattern so that all pins area electrically connected to all output parts, say, any output is available from any pin. A desired pin arrangement is achieved by making a low level the connecting lead frame select lines to be made conductive by a decode circuit 60, applying a predetermined voltage to the corresponding connecting signal select lines, and melting away, with the fuse pattern only of a necessary location being left behind, other fractions of the fuse pattern.

8. 发明专利

JPH1153038A ACTUATOR DRIVING CIRCUIT 失效
公开(公告)号：JPH1153038A
公开(公告)日：1999-02-26
申请号：JP21184897
申请日：1997-08-06
申请人： TOYOTA MOTOR CORP
发明人： YASUI TAKUYA
IPC分类号： F02M51/06 , F02D41/20 , F16K31/06 , G05F1/56 , H01F7/18
摘要： PROBLEM TO BE SOLVED: To provide the actuator driving circuit which makes the OFF operation of an actuator fast. SOLUTION: The actuator driving circuit 10 consists of a boosting circuit 51, a step-down circuit 52, a constant-current circuit 53, capacitors C1 and C2, switches SW1 to SW5, a diode D, etc. The driving circuit 10 charges the capacitors C1 and C2 by the boosting circuit 51 to perform the large-current driving of an injector solenoid L with its discharging current and then the small-current driving for a specific time after that with a small current generated by the step-down circuit 52 and constant-current circuit 53. When the injector solenoid L is driven with the large current, the driving circuit 10 turns off the switch SW4 to separate the capacitor C1 from the capacitor C2, and a large negative voltage is generated at the capacitor C2.

9. 发明专利

JPH06101508A VALVE TIMING CONTROLLER OF INTERNAL COMBUSTION ENGINE 失效
公开(公告)号：JPH06101508A
公开(公告)日：1994-04-12
申请号：JP24831992
申请日：1992-09-17
申请人： TOYOTA MOTOR CORP
发明人： YASUI TAKUYA
IPC分类号： F01L1/34 , F02D13/02 , F02D45/00
摘要： PURPOSE:To enable an intake air negative pressure to be precisely controlled to the optimum value, and effectively decrease a pumping loss so as to improve fuel consumption. CONSTITUTION:Closing timing of an air intake valve 9 is continuously varied by means of a variable valve timing mechanism(VVT) 23. The VVT 23 is feedback-controlled by an electronic control unit(ECU) 40 so that the real air intake negative pressure may approach the optimum value as relatively a small value based on the detected result from various kinds of sensors such as a negative pressure sensor 35, a throttle sensor 14, etc., in the case when an operational condition is in a no-load range or in the vicinity of the no-load range. The intake air negative pressure is thus regulated to a relatively small level by accurately catching the condition even if the various operational conditions are minorly varied in the no-load range or in the vicinity of no-load range.

10. 发明专利

JP2000257492A INJECTOR DRIVE METHOD AND DRIVE CIRCUIT THEREOF 失效
公开(公告)号：JP2000257492A
公开(公告)日：2000-09-19
申请号：JP5723299
申请日：1999-03-04
申请人： TOYOTA MOTOR CORP
发明人： YASUI TAKUYA
IPC分类号： F02D41/20 , F16K31/06
摘要： PROBLEM TO BE SOLVED: To improve fuel injection characteristics by further stabilizing the valve opening time of an injector, in particular the time needed for closing the valve. SOLUTION: An injector drive circuit comprises a high-voltage applying part 2, a timing control part(TC) 3, a constant current control part 4, and switches SW1-SW3. The high voltage applying part 2 comprises a high-voltage charging circuit(HVC) 20 for converting, for example, a 12 V battery voltage (+B) to about a 200 V direct current high voltage by a switching operation, and high capacity capacitor C for charging, such high voltage. Based on an injection command signal, the capacitor C is made discharged with respect to a solenoid L1 of the injector INJ, with a large current drive only in the initial state of the drive, and thereafter by a constant current drive with a smaller current for a prescribed amount of time. The switching operation of the high voltage charging circuit 20 is temporarily cut off including at least the timing, when the constant current drive is turned off.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式