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1. 发明专利

JP2006081373A Connector attached directly to equipment 有权
标题翻译：连接器直接连接到设备
公开(公告)号：JP2006081373A
公开(公告)日：2006-03-23
申请号：JP2004265538
申请日：2004-09-13
申请人： Toyota Industries Corp , Toyota Motor Corp , Yazaki Corp , トヨタ自動車株式会社 , 株式会社豊田自動織機 , 矢崎総業株式会社
发明人： MATSUMOTO MITSUHIRO , FUKUSHIMA HIROTAKA , TSUKAMOTO SETSU , SHIBA KENSHIRO , WATANABE TOMOYUKI , OKAMOTO KOJI
IPC分类号： H02K5/22 , B60L11/18 , H01R13/405 , H02K11/00
CPC分类号： H02M7/003 , H01R13/42 , H01R25/162 , H01R29/00 , H01R31/065
摘要： PROBLEM TO BE SOLVED: To reduce the size of an invertor (equipment) connecting two motors and a connection structure. SOLUTION: The connector that is to be attached directly to equipment is provided with six independent bus bars 21 to 26 for connecting two auxiliary machines for three-phase alternating current to one piece of equipment, wherein two U-electrode terminal parts 11, 12 of three-phase alternating current connected to the equipment, two V-electrode terminal parts 13, 14, and two W-electrode terminal parts 15, 16, are arranged mutually adjacent to each other; while terminal parts 11 to 16 are provided on one terminal side of each bus bar 21 to 26, and one each terminal part 31 to 33, 34 to 36 of the U-electrode, V-electrode and W-electrode that are to be connected to the two auxiliary machines are arranged in two sets, mutually adjacent on the other end side of each bus bar, each being separated from each other. The bus bars 22, 25 have extension parts 22c, 25c extended between the two sets of terminal parts 31 to 33, 34 to 36 on the other end side. The bus-bars 21 to 26 are molded into an insulating resin part. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：减少连接两台电机和连接结构的变频器（设备）的尺寸。
解决方案：要直接连接到设备的连接器设有六个独立的母线21至26，用于将两个用于三相交流的辅助设备连接到一个设备，其中两个U电极端子部分11 连接到设备的三相交流电的12个，两个V电极端子部分13,14和两个W电极端子部分15,16彼此相邻地布置; 而端子部11至16设置在每个汇流条21至26的一个端子侧，并且将要连接的U电极，V电极和W电极的每个端子部分31至33,34至36中的一个两个辅助机器被布置成两组，每个母线的另一端相互相邻，每个彼此分离。母线22,25具有在另一端侧的两组端子部31〜33,34〜36之间延伸的延伸部22c，25c。母线21至26被模制成绝缘树脂部分。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2011209158A Current sensor assembly and method for assembling the same 有权
标题翻译：电流传感器组件及其组装方法
公开(公告)号：JP2011209158A
公开(公告)日：2011-10-20
申请号：JP2010078325
申请日：2010-03-30
申请人： Aisin Aw Co Ltd , Toyota Industries Corp , Toyota Motor Corp , アイシン・エィ・ダブリュ株式会社 , トヨタ自動車株式会社 , 株式会社豊田自動織機
发明人： MIYAZAWA MANABU , UECHI TATSUYUKI , HIGASHIMORI YUKI , HOTTA YUTAKA , OKAMOTO KOJI
IPC分类号： G01R15/20 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide a current sensor assembly having a configuration which facilitates small-sizing of the current sensor assembly and bending of bus bars and allows to increase yield of the current sensor assembly, and to provide a method for assembling the current sensor assembly.SOLUTION: The current sensor assembly has two or more round bus bars 211, 212, 213, 221, 222 and 223 with a circular cross section. A positioning structure for fixing mounting positions of the round bus bars 211, 212, 213, 221, 222 and 223 to a resin case 250 is provided between the round bus bars 211, 212, 213, 221, 222 and 223 and the resin case 250.
摘要翻译：要解决的问题：提供一种电流传感器组件，其具有有助于电流传感器组件的小尺寸化和母线弯曲的结构，并且允许增加电流传感器组件的产量，并且提供用于组装电流传感器的方法装配。解决方案：电流传感器组件具有两个或多个具有圆形横截面的圆形母线211,212,213,221,222和223。将圆形母线211,212,213,221,222,223的安装位置固定到树脂外壳250上的定位结构设置在圆形汇流条211,212,213,221,222,223和树脂外壳之间 250。

3. 发明专利

JP2012085416A Power shut-off device 有权
标题翻译：电源关闭装置
公开(公告)号：JP2012085416A
公开(公告)日：2012-04-26
申请号：JP2010228582
申请日：2010-10-08
申请人： Aisin Aw Co Ltd , Denso Corp , Toyota Industries Corp , Toyota Motor Corp , アイシン・エィ・ダブリュ株式会社 , トヨタ自動車株式会社 , 株式会社デンソー , 株式会社豊田自動織機
发明人： YAMANAKA MASASHI , UECHI TATSUYUKI , NISHIDA SHIRO , HOTTA YUTAKA , OKAMURA MAKOTO , OKAMOTO KOJI
IPC分类号： B60L3/04
摘要： PROBLEM TO BE SOLVED: To provide a power shut-off device combining an interlock means and a shock blocking means for interrupting the power supply of a high voltage battery appropriately at vehicle collision.SOLUTION: The power shut-off device 10 is arranged in a power control unit 3 (PCU), and the PCU 3 is arranged on a transaxle 2. The power shut-off device 10 comprises a sliding rod 11 having a sensor function and an interlock function, a hermetic seal 14 which seals the sliding rod 11 slidably, a male terminal 15 provided on the sliding rod 11, a female terminal block 12 which maintains connection of the male terminal 15 and a female terminal 19, and a bracket 13 which holds the female terminal block 12. The sliding rod 11 is arranged on the vehicle front side of the PCU 3 to project most therefrom, and arranged to cover a bolt 26 that fixes the upper and lower lids of the PCU 3.
摘要翻译：解决的问题：提供组合联锁装置和防震装置的电源切断装置，用于在车辆碰撞时适当地中断高压电池的电源。电源切断装置10配置在功率控制单元3（PCU）中，PCU3配置在变速驱动桥2上。动力切断装置10具备：滑动杆11，其具有传感器功能和互锁功能，可滑动地密封滑动杆11的气密密封件14，设置在滑动杆11上的阳端子15，保持阳端子15和阴端子19的连接的阴端子块12和托架13，其保持阴端子块12.滑动杆11布置在PCU 3的车辆前侧以使其最突出，并且布置成覆盖固定PCU 3的上盖和下盖的螺栓26。 P>版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012204773A Heat exchanger and pipe joint method for the same 有权
标题翻译：热交换器和管接头方法
公开(公告)号：JP2012204773A
公开(公告)日：2012-10-22
申请号：JP2011070378
申请日：2011-03-28
申请人： Toyota Industries Corp , Showa Denko Kk , 昭和電工株式会社 , 株式会社豊田自動織機
发明人： OKAMOTO KOJI , HIRANO TOMOYA
IPC分类号： H05K7/20 , B23K1/00 , B23K3/00 , B23K101/06
CPC分类号： B23K1/0012 , B23K3/087 , B23K37/0443 , B23K2201/14 , F28D7/106 , F28F2275/045 , Y10T29/4935 , Y10T29/49368 , Y10T29/49373 , Y10T29/49393
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger and a pipe joint method for the heat exchanger with which gaps are hardly formed between plates and a pipe.SOLUTION: On a first plate 15, a pair of first flange parts 21 is formed in a direction substantially orthogonal to a direction of lamination of the first plate 15 and a second plate 16 and an axial direction of a pipe 13 (14). On the second plate 16, a pair of second flange parts 22 is formed in the direction substantially orthogonal to the direction of lamination of the first plate 15 and the second plate 16 and the axial direction of the pipe 13 (14). In brazing, a jig sandwiches the first and second flange parts 21 and 22 and outer periphery faces 19b and 20b of first and second groove parts 19 and 20. When brazing material melts in a brazing process, a pressing load by the jigs fills the brazing material in portions where the first and second groove parts 19 and 20 cannot cover the pipe 13 (14).
摘要翻译：要解决的问题：提供一种用于热交换器的热交换器和管接头方法，其间几乎不在板和管之间形成间隙。解决方案：在第一板15上，一对第一凸缘部21沿与第一板15和第二板16的层叠方向大致正交的方向和管13（14）的轴向形成）。在第二板16上，在与第一板15和第二板16的层叠方向大致正交的方向以及管13（14）的轴向方向上形成有一对第二凸缘部22。在钎焊中，夹具夹着第一和第二槽部19和20的第一和第二凸缘部分21和22以及外周面19b和20b。当钎焊材料在钎焊过程中熔化时，夹具的挤压负载填充钎焊材料在第一和第二槽部分19和20不能覆盖管13（14）的部分中。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2011210813A Method of manufacturing electronic component device 有权
标题翻译：制造电子元器件的方法
公开(公告)号：JP2011210813A
公开(公告)日：2011-10-20
申请号：JP2010075063
申请日：2010-03-29
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： OKAMOTO KOJI
IPC分类号： H01L23/473 , H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component device that makes the electronic component device compact while simultaneously mounting electronic components on adjacent insulating substrates.SOLUTION: In the semiconductor device 10, a cooler 13 has a first housing 20 and a second housing 21 having a refrigerant flow passage therein. Further, the semiconductor device 10 has an expansion and contraction portion 22 which couples the first housing 20 and second housing 21 to each other, and can be expanded and contracted. The semiconductor device 10 is manufactured by mounting semiconductor elements 12 on respective circuit boards 11 in a state wherein the expansion and contraction portion 22 is expanded, and contracting the expansion and contraction portion 22 having been expanded after mounting the semiconductor elements 12.
摘要翻译：要解决的问题：提供一种制造电子部件装置的方法，其使电子部件装置紧凑，同时将电子部件安装在相邻的绝缘基板上。解决方案：在半导体装置10中，冷却器13具有第一壳体20和其中具有制冷剂流动通道的第二壳体21。此外，半导体装置10具有使第一壳体20和第二壳体21彼此连接的伸缩部22，并且能够扩大缩小。半导体器件10是通过在膨胀和收缩部分22膨胀的状态下将半导体元件12安装在各个电路板11上并且在安装半导体元件12之后收缩膨胀和收缩部分22而被制造的。

6. 发明专利

JP2012023130A Resin seal type semiconductor device formation method 审中-公开
标题翻译：树脂密封型半导体器件形成方法
公开(公告)号：JP2012023130A
公开(公告)日：2012-02-02
申请号：JP2010158725
申请日：2010-07-13
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： KAYANO KAZUO , OKAMOTO KOJI
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a resin seal type semiconductor device formation method which can encapsulate a semiconductor device with a resin while preventing occurrence of cracks reaching the semiconductor device.SOLUTION: In a space between a semiconductor device 10 and presser foot pins 43, a first resin material 44 having quality same as that of an encapsulation resin is used at portions contacting the semiconductor device 10, and a second resin material 45 of a melting point higher than that of the encapsulation resin is used at portions contacting the presser foot pins 43. In this state, the semiconductor device 10 is pressed by the presser foot pins 43. The encapsulation resin is infused into a cavity 50 to encapsulate the semiconductor device 10 with the first resin material 44 being integrated with the encapsulation resin.
摘要翻译：解决的问题：提供一种树脂密封型半导体器件形成方法，其可以在防止发生到达半导体器件的裂纹的同时用树脂封装半导体器件。解决方案：在半导体器件10和压脚销43之间的空间中，与半导体器件10接触的部分使用与密封树脂质量相同的第一树脂材料44和第二树脂材料45 在与压脚销43接触的部分使用高于封装树脂的熔点。在这种状态下，半导体器件10被压脚销43挤压。将封装树脂注入空腔50中以封装半导体器件10与第一树脂材料44与封装树脂一体化。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2013239675A Cooler 有权
标题翻译：冷却器
公开(公告)号：JP2013239675A
公开(公告)日：2013-11-28
申请号：JP2012113393
申请日：2012-05-17
申请人： Toyota Industries Corp , 株式会社豊田自動織機 , Showa Denko Kk , 昭和電工株式会社
发明人： OKAMOTO KOJI , FURUKAWA YUICHI
IPC分类号： H01L23/473 , F25D9/00 , H02M7/48 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To facilitate positioning of columnar fins where the pitch of the fins is narrowed.SOLUTION: A cooler is formed by housing a fin unit 31 in a base substance formed by joining a first base substance formation member forming a square box shape to a flat plate like second base substance formation member having a square shape in a plane view. The fin unit 31 is formed by forming columnar fins 33 on both surfaces of a flat plate like substrate 32. An apical surface of each fin 33 is joined to an inner surface of the base substance.
摘要翻译：要解决的问题：为了便于翅片间距变窄的柱状翅片的定位。解决方案：通过将翅片单元31容纳在形成方形盒形状的第一基底物质形成构件形成的基体中形成冷却器如平面图中具有正方形形状的第二基体形成构件的平板。翅片单元31通过在平板状基板32的两个表面上形成柱状散热片33而形成。每个翅片33的顶面与基体的内表面接合。

8. 发明专利

JP2011228547A Cooling structure of reactor 有权
标题翻译：反应器冷却结构
公开(公告)号：JP2011228547A
公开(公告)日：2011-11-10
申请号：JP2010098201
申请日：2010-04-21
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： ONO HIROSHI , OKAMOTO KOJI
IPC分类号： H01F37/00 , H01F27/12 , H01F27/24
摘要： PROBLEM TO BE SOLVED: To provide a cooling structure of a reactor for appropriately controlling an accumulation amount and a flow rate of cooling liquid at a periphery of the reactor.SOLUTION: A reactor 40 is stored in a catch tank 30. A movable member 20a makes oil 50 flow into the catch tank 30. An opening/closing member 31 is installed in an exhaust port 30b of the catch tank 30. When a pressure of the oil 50 accumulated in the catch tank 30 is less than a prescribed threshold, the opening/closing member 31 is constituted to be closed (a close position 31a). When the pressure of the oil 50 exceeds the prescribed threshold, the member is opened (an opening position 31b or an intermediate position).
摘要翻译：要解决的问题：提供用于适当地控制反应器周围的冷却液的积聚量和流量的反应器的冷却结构。解决方案：反应器40储存在捕集罐30中。可移动部件20a使油50流入捕集罐30.打开/关闭部件31安装在捕获罐30的排气口30b中。当蓄积在捕获罐30中的油50的压力小于规定的阈值，打开/关闭部件31被构造成关闭（关闭位置31a）。当油50的压力超过规定的阈值时，打开构件（打开位置31b或中间位置）。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2014017446A Electronic component module and manufacturing method of the same 审中-公开
标题翻译：电子元件模块及其制造方法
公开(公告)号：JP2014017446A
公开(公告)日：2014-01-30
申请号：JP2012155645
申请日：2012-07-11
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： OKAMOTO KOJI
IPC分类号： H01G4/228 , H01G2/10 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide an electronic component module which prevents misalignment between a terminal board and a terminal, and to provide a manufacturing method of the electronic component module.SOLUTION: A capacitor module 10 includes: a resin case 11 formed into a boxed shape with a closed bottom; a capacitor 15 which includes a positive electrode terminal 16 and a negative electrode terminal and is housed in the case 11; and a terminal board 21 having a nut 22. The capacitor module 10 includes a sealing part 20 which seals the capacitor 15 in the case 11 and is made of a thermosetting resin. In the capacitor module 10, a part of the terminal board 21 is sealed by the sealing part 20 at a position separated from an inner surface of the case 11 with the nut 22 protruding from the sealing part 20.
摘要翻译：要解决的问题：提供一种防止端子板和端子之间的未对准的电子部件模块，并提供电子部件模块的制造方法。电容器模块10包括：形成为盒状的树脂壳体11 形状封闭底部; 电容器15，其包括正极端子16和负极端子，并且容纳在壳体11中; 以及具有螺母22的端子板21.电容器模块10包括密封部20，密封部20将壳体11中的电容器15密封并由热固性树脂制成。在电容器模块10中，端子板21的一部分由与密封部20突出的螺母22的与壳体11的内表面分离的位置被密封部20密封。

10. 发明专利

JP2012023124A Semiconductor device with heat dissipation member 有权
标题翻译：具有散热部件的半导体器件
公开(公告)号：JP2012023124A
公开(公告)日：2012-02-02
申请号：JP2010158552
申请日：2010-07-13
申请人： Toyota Industries Corp , 株式会社豊田自動織機
发明人： OKAMOTO KOJI
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device with a heat dissipation member which can inhibit cracks occurring in an encapsulation resin reaching a semiconductor element and a conductive member and reliably isolate the conductive member and the heat dissipation member.SOLUTION: A semiconductor device 101 with a heat dissipation member comprises a semiconductor chip 1, a die pad part 2a, a heat sink 3, a first resin block 10 and a second resin block 20 each forming gaps g1 respectively with the die pad part 2a and with the heat sink 3 and having similar structures. The first resin block 10 includes a first resin layer 11 and a third resin layer 13 consisting of first resin materials, and a second resin layer 12 consisting of a second resin material. The first resin layer 11 contacts the die pad part 2a, and the second resin layer 12 does not contact the die pad part 2a. The first resin material has a melting point lower than that of the second resin material. Furthermore, the semiconductor device 101 with a heat dissipation member is encapsulated by an encapsulation resin 4 consisting of the first resin material.
摘要翻译：解决的问题：为了提供具有散热构件的半导体装置，该散热构件可以抑制到达半导体元件的封装树脂和导电构件中发生的裂纹，并且可靠地隔离导电构件和散热构件。解决方案：具有散热构件的半导体器件101包括分别与模具形成间隙g1的半导体芯片1，芯片焊盘部分2a，散热器3，第一树脂块10和第二树脂块20 垫部分2a和散热器3并且具有相似的结构。第一树脂块10包括由第一树脂材料构成的第一树脂层11和第三树脂层13以及由第二树脂材料构成的第二树脂层12。第一树脂层11与芯片焊盘部分2a接触，第二树脂层12不与芯片焊盘部分2a接触。第一树脂材料的熔点低于第二树脂材料的熔点。此外，具有散热构件的半导体装置101由由第一树脂材料构成的封装树脂4封装。版权所有（C）2012，JPO＆INPIT

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