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1. 发明专利

JP2014027118A Joining apparatus, joining system, joining method, program, and computer storage medium 有权
标题翻译：加工设备，加工系统，加工方法，程序和计算机存储介质
公开(公告)号：JP2014027118A
公开(公告)日：2014-02-06
申请号：JP2012166613
申请日：2012-07-27
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： OMORI YOSUKE , AKIYAMA NAOKI , SUGIYAMA MASAHIKO
IPC分类号： H01L21/02
摘要： PROBLEM TO BE SOLVED: To appropriately join a substrate to be processed and a support substrate through adhesives of thermoplastic resin, and to uniform thickness of a polymerization substrate in which the substrate to be processed and the support substrate are joined in the substrate plane.SOLUTION: A joining section 113 of the joining apparatus has: a first holding section 200 for holding a wafer W to be processed; a second holding section 201 for holding a support wafer S; a first heating mechanism 211 for heating the wafer W to be processed; a second heating mechanism 241 for heating the support wafer S; a first cooling mechanism 212 for cooling the wafer W to be processed; a second cooling mechanism 242 for cooling the support wafer S; and a control section 400 for controlling the difference between temperature in a holding plane of the first holding section 200 and temperature in a non-holding plane to a predetermined difference in temperature by controlling the first cooling mechanism 212 so that the holding plane of the first holding section 200 can be a predetermined flatness, when cooling the wafer W to be processed and the support wafer S.
摘要翻译：要解决的问题：通过热塑性树脂的粘合剂适当地接合待处理的基板和支撑基板，并且将待处理的基板和支撑基板在基板平面中接合的聚合基板的均匀厚度。接合装置的接合部113具有：保持待加工晶片W的第一保持部200; 用于保持支撑晶片S的第二保持部201; 用于加热要处理的晶片W的第一加热机构211; 用于加热支撑晶片S的第二加热机构241; 用于冷却要处理的晶片W的第一冷却机构212; 用于冷却支撑晶片S的第二冷却机构242; 以及控制部400，其通过控制第一冷却机构212，将第一保持部200的保持面中的温度与非保持面的温度之间的差与预定的温度差进行控制，使得第一当冷却待处理的晶片W和支撑晶片S时，保持部200可以是预定的平坦度。

2. 发明专利

JP2014027117A Joining apparatus, joining system, joining method, program, and computer storage medium 有权
标题翻译：加工设备，加工系统，加工方法，程序和计算机存储介质
公开(公告)号：JP2014027117A
公开(公告)日：2014-02-06
申请号：JP2012166607
申请日：2012-07-27
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKIYAMA NAOKI , SUGIYAMA MASAHIKO , OMORI YOSUKE
IPC分类号： H01L21/02
摘要： PROBLEM TO BE SOLVED: To appropriately join a substrate to be processed and a support substrate through adhesives of thermoplastic resin.SOLUTION: A joining section 113 of the joining apparatus has: a first holding section 200 for holding a wafer W to be processed; a second holding section 201 for holding a support wafer S; a first heating mechanism 211 for heating the wafer W to be processed; a second heating mechanism 241 for heating the support wafer S; a first cooling mechanism 212 for cooling the wafer W to be processed; and a second cooling mechanism 242 for cooling the support wafer S. In the joining section 113, the wafer W to be processed and the support wafer S are heated by the first heating mechanism 211 and the second heating mechanism 241, the wafer W to be processed and the support wafer S are adhered, and then the wafer W to be processed is cooled to a first cooling temperature by the first cooling mechanism 212 and the support wafer S is cooled at a second cooling temperature by the second cooling mechanism 242.
摘要翻译：要解决的问题：通过热塑性树脂的粘合剂适当地接合待处理的基板和支撑基板。解决方案：接合装置的接合部分113具有：用于保持要处理的晶片W的第一保持部分200; 用于保持支撑晶片S的第二保持部201; 用于加热要处理的晶片W的第一加热机构211; 用于加热支撑晶片S的第二加热机构241; 用于冷却要处理的晶片W的第一冷却机构212; 以及用于冷却支撑晶片S的第二冷却机构242.在接合部113中，待处理晶片W和支撑晶片S被第一加热机构211和第二加热机构241加热，晶片W将被并且将待处理晶片W通过第一冷却机构212冷却至第一冷却温度，并且通过第二冷却机构242在第二冷却温度下冷却支撑晶片S.

3. 发明专利

JP2012089625A Joining apparatus 有权
标题翻译：加工设备
公开(公告)号：JP2012089625A
公开(公告)日：2012-05-10
申请号：JP2010233878
申请日：2010-10-18
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKIYAMA NAOKI , SUGIYAMA MASAHIKO , FURUYA HAJIME
IPC分类号： H01L21/02 , B23K20/00 , B23K20/14
CPC分类号： H01L24/81 , H01L21/67092 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05624 , H01L2224/13117 , H01L2224/16145 , H01L2224/75102 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/7526 , H01L2224/75283 , H01L2224/753 , H01L2224/75303 , H01L2224/75312 , H01L2224/75314 , H01L2224/755 , H01L2224/75501 , H01L2224/7565 , H01L2224/757 , H01L2224/75901 , H01L2224/75985 , H01L2224/81001 , H01L2224/81204 , H01L2224/8122 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/00014 , H01L2924/01032
摘要： PROBLEM TO BE SOLVED: To effectively perform temperature adjustments of substrates having metal joining portions and improve throughput of substrate joining process.SOLUTION: A joining apparatus 10 includes a processing container 70 in which an opening 78 is formed at a lower surface, a second heat treatment plate 90 in which a superposed wafer Wis placed and heat treatment is performed thereon, a pressurizing mechanism 80 provided in the processing container 70 so as to face the heat treatment plate 90 and pressing the superposed wafer Wtoward the second heat treatment plate 90, an annular support base 95 provided on an inner surface of the processing container 70 so as to be along the opening 78 of the processing container 70 and hermetically closing a space between the processing container 70 and the second heat treatment plate 90, and a cooling mechanism 100 provided below the second heat treatment plate 90 and on an inner side of the support base 95. The cooling mechanism 100 includes a cooling plate having an upper surface provided so as to be parallel to the second heat treatment plate 90, a communication pipe communicating with the interior of the cooling plate and supplying air to the interior of the cooling plate, and a lifting mechanism moving up and down the cooling plate.
摘要翻译：要解决的问题：有效地进行具有金属接合部的基板的温度调节，并提高基板接合工序的生产率。解决方案：接合装置10包括：处理容器70，其中在下表面形成有开口78;第二热处理板90，其中叠置的晶片W T T 朝向第二热处理板90，设置在处理容器70的内表面上并沿着处理容器70的开口78设置的环形支撑基座95，并且密封地封闭处理容器70与第二热处理板之间的空间 90，以及设置在第二热处理板90的下方和支撑基座95的内侧的冷却机构100.冷却机构100包括：冷却板，其具有设置成与第二热处理板平行的上表面 90，一个通讯与冷却板的内部连通并向冷却板的内部供给空气的单元管，以及在冷却板上下移动的升降机构。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2004140296A Probe apparatus for temperature control of inspected object, and probe inspection method 有权
公开(公告)号：JP2004140296A
公开(公告)日：2004-05-13
申请号：JP2002305925
申请日：2002-10-21
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SUGIYAMA MASAHIKO , INOUE YOSHINORI
IPC分类号： G01R1/06 , G01R1/067 , G01R31/28 , H01L21/66
CPC分类号： G01R31/2874 , G01R1/06705 , G01R31/2865 , G01R31/2891
摘要： PROBLEM TO BE SOLVED: To provide a probe apparatus and its method whereby the temperature control of an inspected object can be performed properly in a probe inspection.
SOLUTION: The probe apparatus 100 for inspecting an inspected object while controlling its temperature is provided. The probe apparatus has a stage base 2, a Z-stage 10, an X-Y stage 12 having a frame-form structure, a substrate-fastening mechanism 23 provided on the X-Y stage, a probe card 14 disposed opposite to the substrate fastening mechanism, and a probing stage 3 fastened to the Z-stage and so provided in the frame-form structure of the X-Y stage as for its axis center so as to coincide with an extension trailing from the probe center of the probe card. Further, the probing stage has a temperature control device for heating or cooling the inspected object and a probing elevating mechanism to support the inspected object of the substrate from its bottom surface and to perform the temperature control of the inspected object.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2015018926A 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体有权
标题翻译：加工设备，加工系统，加工方法，程序和计算机存储介质
公开(公告)号：JP2015018926A
公开(公告)日：2015-01-29
申请号：JP2013144982
申请日：2013-07-10
申请人：東京エレクトロン株式会社 , Tokyo Electron Ltd
发明人： AKIYAMA NAOKI , SUGIYAMA MASAHIKO , OMORI YOSUKE
IPC分类号： H01L21/02 , B23K20/00
摘要：【課題】第1の基板と第2の基板の間にボイドが発生することを抑制し、基板同士の接合処理を適切に行う。【解決手段】接合装置41は、上ウェハWUと下ウェハWLを収容して接合するための処理容器100と、下面に上ウェハWUを保持する上チャック140と、上チャック140の下方に設けられ、上面に上ウェハWUを保持する下チャック141と、下チャック141を水平方向及び鉛直方向に移動させる第1の下チャック移動部160及び第2の下チャック移動部166と、を有する。処理容器100は、処理容器10内に空気を導入する給気口105と、処理容器100内から空気を排気する排気口103と、給気口105から排気口103に向かって空気の流れを形成する送風ユニット106を備えている。【選択図】図5
摘要翻译：要解决的问题：为了抑制第一基板和第二基板之间的空隙的产生，并且适当地进行基板的接合处理。解决方案：接合装置41包括：处理容器100，用于容纳和接合上晶片和下晶圆W; 用于将上晶片保持其下表面的上卡盘140; 设置在上卡盘140下方并保持下晶片的下卡盘141的上表面; 以及用于将下卡盘141移动到水平方向和垂直方向的第一下卡盘移动部分160和第二下卡盘移动部分166。处理容器100包括：空气入口105，用于将空气引导到处理容器100中; 用于从处理容器100排出空气的排气口103; 以及用于形成从空气入口105到空气出口103的空气流的鼓风机单元106。

6. 发明专利

JP2013084717A Three-dimensional mounting device 审中-公开
标题翻译：三维安装设备
公开(公告)号：JP2013084717A
公开(公告)日：2013-05-09
申请号：JP2011222811
申请日：2011-10-07
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KOBAYASHI MASAHITO , IIDA ITARU , SUGIYAMA MASAHIKO , WATANABE SHINJIRO
IPC分类号： H01L25/065 , H01L21/60 , H01L25/07 , H01L25/18
CPC分类号： H01L24/75 , H01L2224/16
摘要： PROBLEM TO BE SOLVED: To provide a three-dimensional mounting device capable of further improving a manufacturing throughput of a semiconductor device, and preventing deterioration of quality of the manufactured semiconductor device.SOLUTION: In a three-dimensional mounting device 11, a transportation tray 16 has an inner tray 16a including an arrangement surface 16aa, and transports eight laminate chips 21 arranged on the arrangement surface 16aa. A chamber 27 houses the inner tray 16a, and a lower stage 28 locates the inner tray 16a in the chamber 27. An upper stage 29 has a pressing face 29a in parallel to the arrangement surface 16aa of the inner tray 16a which is located in the lower stage 28. Heaters 33, 39 are built in the lower stage 28 and the upper stage 29, and the lower stage 28 and the upper stage 29 move to reduce a gap between them.
摘要翻译：解决的问题：提供能够进一步提高半导体器件的制造通量并防止制造的半导体器件的质量劣化的三维安装器件。解决方案：在三维安装装置11中，传送托盘16具有包括布置表面16aa的内托盘16a，并且输送布置在布置表面16aa上的八个层叠片21。腔室27容纳内托盘16a，下台28将内托盘16a定位在腔室27中。上台架29具有平行于内托盘16a的布置表面16aa的按压面29a，内侧托盘16a位于下段28.加热器33,39内置在下段28和上段29中，下段28和上段29移动以减小它们之间的间隙。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013084716A Three-dimensional mounting device 审中-公开
标题翻译：三维安装设备
公开(公告)号：JP2013084716A
公开(公告)日：2013-05-09
申请号：JP2011222810
申请日：2011-10-07
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KOBAYASHI MASAHITO , IIDA ITARU , SUGIYAMA MASAHIKO , WATANABE SHINJIRO
IPC分类号： H01L25/065 , H01L21/60 , H01L25/07 , H01L25/18
CPC分类号： H01L24/75 , H01L2224/16
摘要： PROBLEM TO BE SOLVED: To provide a three-dimensional mounting device capable of further improving a manufacturing throughput of a semiconductor device, and preventing deterioration of quality of the manufactured semiconductor device.SOLUTION: In a three-dimensional mounting device 11, a transportation tray 16 has an inner tray 16a including an arrangement surface 16aa, and transports eight laminate chips 21 arranged on the arrangement surface 16aa. A chamber 27 houses the inner tray 16a, and a lower stage 28 locates the inner tray 16a in the chamber 27. A plurality of chucks 29 are opposed to the laminate chips 21 arranged on the arrangement surface 16aa of the inner tray 16a. Each one of the plurality of chucks 29 is arranged corresponding to each one of the plurality of laminate chips 21 arranged on the arrangement surface 16aa. The lower stage 28 and each of the plurality of chucks 29 move to reduce a gap between the lower stage 28 and each of the plurality of chucks 29.
摘要翻译：解决的问题：提供能够进一步提高半导体器件的制造通量并防止制造的半导体器件的质量劣化的三维安装器件。解决方案：在三维安装装置11中，传送托盘16具有包括布置表面16aa的内托盘16a，并且输送布置在布置表面16aa上的八个层叠片21。腔室27容纳内托盘16a，下台28将内托盘16a定位在腔室27中。多个卡盘29与布置在内托盘16a的布置表面16aa上的层压片21相对。多个卡盘29中的每一个对应于布置在布置表面16aa上的多个层叠芯片21中的每个。下级28和多个卡盘29中的每一个移动以减小下级28和多个卡盘29中的每一个之间的间隙。（C）2013，JPO和INPIT

8. 发明专利

JP2012099531A Adhering device and adhering method 有权
标题翻译：附加装置和附着方法
公开(公告)号：JP2012099531A
公开(公告)日：2012-05-24
申请号：JP2010243516
申请日：2010-10-29
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： AKIYAMA NAOKI , SUGIYAMA MASAHIKO , OMORI YOSUKE
IPC分类号： H01L21/02 , H01L21/683
CPC分类号： H01L21/67092
摘要： PROBLEM TO BE SOLVED: To prevent a void between two members when the two members are adhered to each other.SOLUTION: An adhering device 1 has a lower chuck and an upper chuck for holding a wafer. The upper chuck is constituted so that its center part is flexed when it is pressurized at a predetermined pressure. A heat insulation ring 13 supporting an outer periphery of the lower chuck is provided on a lower surface of the lower chuck. The heat insulation ring 13 is formed by assembling a plurality of heat insulation members 30. The lower surface of the heat insulation ring 13 is supported by a support ring 14 formed by assembling a plurality of support members 31. The support members 31 and the lower chuck are fixed with bolts 40, each one of which is provided respectively for each of the support members 31. The bolts 40 penetrate through through-holes 30a, 31a formed on the heat insulation member 30 and the support members 31. Diameters of the through-holes 30a, 31a are larger than that of the bolt 40.
摘要翻译：要解决的问题：为了防止当两个构件彼此粘附时两个构件之间的空隙。解决方案：粘合装置1具有用于保持晶片的下卡盘和上卡盘。上卡盘的构造使得当其以预定压力被加压时，其中心部分弯曲。在下卡盘的下表面上设置有支撑下卡盘的外周的隔热环13。绝热环13通过组装多个绝热构件30而形成。隔热环13的下表面由通过组装多个支撑构件31形成的支撑环14支撑。支撑构件31和下部卡盘通过螺栓40固定，螺栓40分别为每个支撑构件31设置。螺栓40穿过形成在绝热构件30上的通孔30a，31a和支撑构件31.直通孔孔30a，31a大于螺栓40的厚度。版权所有：（C）2012，JPO＆INPIT

9. 发明专利

JP2011138901A Mounting method and mounting device 有权
标题翻译：安装方法和安装设备
公开(公告)号：JP2011138901A
公开(公告)日：2011-07-14
申请号：JP2009297626
申请日：2009-12-28
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： NAKAMURA ATSUICHI , SUGIYAMA MASAHIKO , SHINOZAKI DAI , AKIYAMA NAOKI
IPC分类号： H01L21/52 , H01L25/04 , H01L25/18 , H05K13/04
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting method and mounting device, which can minimize the number of operation times of the mounting device and can reduce time for mounting all of a plurality of chips on a substrate without exactly controlling a position of a suction head for sucking the chip in sequentially mounting the plurality of chips on the substrate.
SOLUTION: The mounting method of sequentially mounting a plurality of elements 40 on the substrate 30 includes: a mounting step of mounting one element 40-1 ejected from a housing part 20 for housing the plurality of elements 40 by an ejecting part 5 on one region 31-1, which then is a surface of the substrate 30 with a liquid 32 coated thereon; and a coating step of coating the liquid 32 by a coating part 6 movably arranged together with the ejecting part 5 on a region 31-2 different from the one region 31-1 of the surface of the substrate 30, when mounting the one element 40-1 on the one region 31-1.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种可以最小化安装装置的操作次数的安装方法和安装装置，并且可以减少在基板上安装所有多个芯片的时间，而无需精确地控制用于将芯片顺序地安装在基板上的吸引头。解决方案：将多个元件40依次安装在基板30上的安装方法包括：安装步骤，安装从壳体部分20弹出的一个元件40-1，用于通过喷射部分5容纳多个元件40 在一个区域31-1上，然后是其上涂覆有液体32的基板30的表面; 以及涂布步骤，当安装一个元件40时，通过与喷射部5一起可移动地布置在与基板30的表面的一个区域31-1不同的区域31-2上的涂布部分6涂覆液体32 -1在一个区域31-1。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2010245452A Collectively holding tray and three-dimensionally integrated circuit manufacturing apparatus 审中-公开
标题翻译：集成托盘和三维集成电路制造设备
公开(公告)号：JP2010245452A
公开(公告)日：2010-10-28
申请号：JP2009095241
申请日：2009-04-09
申请人： Tohoku Univ , Tokyo Electron Ltd , 国立大学法人東北大学 , 東京エレクトロン株式会社
发明人： KOYANAGI MITSUMASA , FUKUSHIMA TAKASHI , SUGIYAMA MASAHIKO
IPC分类号： H01L21/677 , B25J15/06 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/16
摘要： PROBLEM TO BE SOLVED: To provide a collectively holding tray which deals with to varied chip sizes according to the number of stages of three-dimensionally integrated circuit and shift in a chip center position. SOLUTION: A collectively holding tray 46 is composed of: a body 47 having a first suction route 55; and an attachment 48 which is attached to the body 47 in a removable manner. The attachment 48 includes: a plurality of suction sections 50 which suck a plurality of chips 20; and a second suction route 49 which sucks gas from a plurality of suction sections 50. The first suction route 55 of the body 47 is connected to the second suction route 49 of the attachment 48, so that a plurality of chips 20 are sucked by a plurality of suction sections 50 when attaching the attachment 48 to the body 47. The attachment 48 which sucks a plurality of chips 20 is designed to be attached to the body 47 in an exchangeable manner, so that it is adaptable for a variety of chip sizes for each number of stages of three-dimensionally integrated circuit, or change of pitch between chip centers. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供根据三维集成电路的级数和芯片中心位置的移动来处理不同的芯片尺寸的集体保持托盘。集体保持托盘46由具有第一吸入路线55的主体47构成; 以及以可移除的方式附接到主体47的附件48。附件48包括：吸入多个芯片20的多个抽吸部分50; 以及从多个吸引部50吸入气体的第二吸入路径49.主体47的第一吸入路线55连接到附件48的第二吸引路径49，使得多个芯片20被吸附当将附件48附接到主体47时，多个抽吸部分50被吸引。多个芯片20的吸附附件48被设计成以可更换的方式附接到主体47，使得其适用于各种芯片尺寸对于三维集成电路的每个级数，或芯片中心之间的间距的改变。版权所有（C）2011，JPO＆INPIT

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