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1. 发明专利

JP2011047782A Method for evaluating semiconductor device 审中-公开
标题翻译：评估半导体器件的方法
公开(公告)号：JP2011047782A
公开(公告)日：2011-03-10
申请号：JP2009196182
申请日：2009-08-27
申请人： Fuji Electric Systems Co Ltd , Tokyo Electron Ltd , 富士電機システムズ株式会社 , 東京エレクトロン株式会社
发明人： MIYAZONO MITSUYOSHI , KOMATSU SHIGEKAZU , SHINOZAKI DAI , KATO MASAHIRO , YOSHIDA ATSUSHI
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01L22/20 , G01R31/2831 , H01L22/14
摘要： PROBLEM TO BE SOLVED: To improve the yield rate and productivity of a semiconductor module.
SOLUTION: A sheet having electrical conductivity is stuck to a main surface of a semiconductor substrate which includes a surface structure and a back plate and on which a plurality of semiconductor elements are arranged. In the state that the sheet is stuck to the main surface, the semiconductor substrate is divided into semiconductor chips on a first support base. The plurality of divided semiconductor chips are mounted on a second support base via the sheet, and dynamic characteristic tests for the mounted plurality of semiconductor chips are carried out continuously on the second support base. Thereby, cracking which develops and propagates from cracks generated in the dynamic characteristic tests for the vertical semiconductor elements is suppressed, and the yield rate and productivity of the semiconductor module are improved.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提高半导体模块的产率和生产率。解决方案：具有导电性的片材粘附到包括表面结构和背板的半导体衬底的主表面上，并且其上布置有多个半导体元件。在片材粘附到主表面的状态下，半导体衬底在第一支撑基底上分成半导体芯片。多个划分的半导体芯片通过片材安装在第二支撑基座上，并且在第二支撑基座上连续地执行安装的多个半导体芯片的动态特性测试。因此，抑制了在垂直半导体元件的动态特性试验中产生的裂纹发展和传播的裂纹，提高了半导体模块的成品率和生产率。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2014187346A Method of manufacturing sintered silver coating film, baking device, and semiconductor device 审中-公开
标题翻译：制造烧结银涂膜的方法，烘烤装置和半导体装置
公开(公告)号：JP2014187346A
公开(公告)日：2014-10-02
申请号：JP2013163998
申请日：2013-08-07
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SHIYOUDEN KENJI , SHINOZAKI DAI , HARADA MUNEO , MITANO YOSHINOBU , NAKAMURA ATSUICHI , IIDA ITARU , WATANABE SHINJIRO
IPC分类号： H01L23/373 , B22F1/02 , B22F3/10 , B22F7/04 , H01L23/36
CPC分类号： H01L23/3736 , F27B17/0025 , H01L21/4871 , H01L21/561 , H01L21/67109 , H01L21/67248 , H01L21/67253 , H01L23/3735 , H01L2924/0002 , Y02P10/143 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To manufacture a sintered silver coating film for a heat spreader, which is excellent in adhesion and thermal conductivity, on a semiconductor substrate or semiconductor package.SOLUTION: A baking device 30 takes in and out a semiconductor substrate 12 having a coating film KM of ink including nano-silver particles formed on a surface, as a work piece W (KM/12). For example, the device includes: a chamber 32 that accommodates a plurality of work pieces W at a time in a baking room which is provided with barriers or straightening vanes 31 and stages 33; a ventilation part 34 that exhausts gas from the chamber 32 while introducing air into the chamber; a temperature adjustment mechanism 36 that adjusts an atmosphere in the chamber 32 to a predetermined baking temperature; and a humidity adjustment mechanism 38 that adjusts humidity in the chamber 32 to a set value within the range of 30% to 50% RH(30°C).
摘要翻译：要解决的问题：在半导体衬底或半导体封装上制造用于散热器的粘合和导热性优异的烧结银涂层。解决方案：烘烤装置30取出和取出具有作为工件W（KM / 12），将表面形成的包含纳米银颗粒的墨水的涂膜KM作为工件W（KM / 12）。例如，该装置包括：室32，其在设置有障碍物或矫直叶片31和台33的烘烤室中一次容纳多个工件W. 通气部分34，其在将空气引入到腔室中的同时从腔室32排出气体; 温度调节机构36，其将室32中的气氛调节到预定的烘烤温度; 以及将室32内的湿度调节到30％〜50％RH（30℃）的范围内的设定值的湿度调节机构38。

3. 发明专利

JP2011138902A Mounting method and mounting device 审中-公开
标题翻译：安装方法和安装设备
公开(公告)号：JP2011138902A
公开(公告)日：2011-07-14
申请号：JP2009297627
申请日：2009-12-28
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SUGIYAMA MASAHIKO , NAKAMURA ATSUICHI , SHINOZAKI DAI , AKIYAMA NAOKI
IPC分类号： H01L21/52
CPC分类号： H01L21/6835 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2221/68354 , H01L2221/68359 , H01L2221/68368 , H01L2221/68381 , H01L2224/32225 , H01L2224/75102 , H01L2224/75272 , H01L2224/75745 , H01L2224/75753 , H01L2224/7598 , H01L2224/81005 , H01L2224/81201 , H01L2224/83 , H01L2224/83907 , H01L2224/95001 , H01L2224/95146 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2924/3512 , Y10T156/10 , Y10T156/1744 , H01L2924/00014 , H01L2924/00011 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting method and a mounting device, capable of surely mounting an element such as a chip or the like on a substrate without increasing a device cost. SOLUTION: The mounting method of mounting the element on the substrate includes a first hydrophilic treatment process of executing hydrophilic treatment to a region 11 for bonding the element 50 on the substrate surface of the substrate 10, a second hydrophilic treatment process of executing hydrophilic treatment to the element surface of the element 50, a mounting process of mounting the element 50 on a mounting part 200 so that the element surface to which the hydrophilic treatment is executed is turned upwards, a coating process of coating a liquid 52 on the element surface to which the hydrophilic treatment is executed, an arranging process of arranging the substrate 10 over the mounting part 200 so that the region 11 for bonding the element 50 on the substrate surface is turned downwards, and a contact process of bringing the substrate 10 arranged over the mounting part 200 and the mounting part 200 on which the element 50 is mounted closer and bringing the liquid 52 and the substrate surface into contact. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在不增加设备成本的情况下将诸如芯片等元件可靠地安装在基板上的安装方法和安装装置。解决方案：将元件安装在基板上的安装方法包括对基板10的基板表面上的元件50进行亲和处理的区域11进行亲水处理的第一亲水处理工艺，执行第二亲水处理过程对元件50的元件表面进行亲水处理，将元件50安装在安装部200上，使得执行亲水处理的元件表面向上转动的安装过程，将液体52涂覆在执行亲水处理的元件表面，将基板10布置在安装部200上方的布置处理，使得用于将元件50接合在基板表面上的区域11向下转动，并且使基板10 布置在安装部件200和安装元件200上的安装部件200上，元件50被安装在该安装部件200上并且使液体52和su连接 ate面接触。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2014192209A Semiconductor device and heat dissipation mechanism 有权
标题翻译：半导体器件和散热机制
公开(公告)号：JP2014192209A
公开(公告)日：2014-10-06
申请号：JP2013063939
申请日：2013-03-26
申请人： Tanaka Kikinzoku Kogyo Kk , 田中貴金属工業株式会社 , Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： MAKITA YUICHI , KUBO HITOSHI , OSHIMA YUSUKE , MATSUDA HIDEKAZU , YANAI JUNICHI , SHIYOUDEN KENJI , SHINOZAKI DAI
IPC分类号： H01L23/36 , H05K7/20
CPC分类号： H01L23/367 , H01L23/34 , H01L23/36 , H01L23/373 , H01L23/3736 , H01L24/01 , H01L2924/0002 , H05K7/20409 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the adhesion, thermal conductivity, and cost performance of a heat spreader that is mounted on a semiconductor substrate or a semiconductor package.SOLUTION: In a semiconductor device 10, a semiconductor substrate 12 is a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is formed. A sintered silver coating film 14 adheres to a surface layer portion 12a of the semiconductor substrate 12 through a silicon oxide film 15. A radiation fin (heat sink) 18, made of copper or aluminum for example, is bonded to the sintered silver coating film 14 through an adhesive layer 16.
摘要翻译：要解决的问题：提高安装在半导体衬底或半导体封装上的散热器的粘附性，导热性和成本性能。解决方案：在半导体器件10中，半导体衬底12是发热半导体芯片或其中形成集成电路或布线的半导体继电器基板。烧结银涂膜14通过氧化硅膜15粘附到半导体衬底12的表层部分12a。例如，由铜或铝制成的辐射翅片（散热器）18被结合到烧结银涂膜 14通过粘合剂层16。

5. 发明专利

JP2011138901A Mounting method and mounting device 有权
标题翻译：安装方法和安装设备
公开(公告)号：JP2011138901A
公开(公告)日：2011-07-14
申请号：JP2009297626
申请日：2009-12-28
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： NAKAMURA ATSUICHI , SUGIYAMA MASAHIKO , SHINOZAKI DAI , AKIYAMA NAOKI
IPC分类号： H01L21/52 , H01L25/04 , H01L25/18 , H05K13/04
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting method and mounting device, which can minimize the number of operation times of the mounting device and can reduce time for mounting all of a plurality of chips on a substrate without exactly controlling a position of a suction head for sucking the chip in sequentially mounting the plurality of chips on the substrate.
SOLUTION: The mounting method of sequentially mounting a plurality of elements 40 on the substrate 30 includes: a mounting step of mounting one element 40-1 ejected from a housing part 20 for housing the plurality of elements 40 by an ejecting part 5 on one region 31-1, which then is a surface of the substrate 30 with a liquid 32 coated thereon; and a coating step of coating the liquid 32 by a coating part 6 movably arranged together with the ejecting part 5 on a region 31-2 different from the one region 31-1 of the surface of the substrate 30, when mounting the one element 40-1 on the one region 31-1.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种可以最小化安装装置的操作次数的安装方法和安装装置，并且可以减少在基板上安装所有多个芯片的时间，而无需精确地控制用于将芯片顺序地安装在基板上的吸引头。解决方案：将多个元件40依次安装在基板30上的安装方法包括：安装步骤，安装从壳体部分20弹出的一个元件40-1，用于通过喷射部分5容纳多个元件40 在一个区域31-1上，然后是其上涂覆有液体32的基板30的表面; 以及涂布步骤，当安装一个元件40时，通过与喷射部5一起可移动地布置在与基板30的表面的一个区域31-1不同的区域31-2上的涂布部分6涂覆液体32 -1在一个区域31-1。版权所有（C）2011，JPO＆INPIT

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