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    • 2. 发明专利
    • BONDING METHOD FOR RESIN
    • JPH04173232A
    • 1992-06-19
    • JP30087490
    • 1990-11-06
    • DAI ICHI HIGH FREQUENCY CO LTDNIPPON STEEL CORP
    • TANIGUCHI YASUYUKIMORISHITA YOSHIYUKIKOBAYASHI RYOJIYOSHITOME TAKAHIROTSUCHIDA ISAMUYOSHIDA KOTARO
    • B29C65/04B29C65/34
    • PURPOSE:To conduct without generating dielectric breakdown of resin in the state of bringing a couple of electrodes into contact with the surface of resin laminated with a heat generating body layer interposed therein, high frequency voltage, by setting the resistance of heat generating body layer in an electric line and the area of electrodes under the specified conditions at that time. CONSTITUTION:Resin sheets 1A and LB to be bonded together are laminated, and a resistant heat generating body 2 is interposed between the laminates. Electrodes 3A and 3B are disposed on the surface of the resin sheet 1A positioned on the sections 2a and 2b of the resistant heat generating body 2, and a high frequency power source 4 is connected with the electrodes 3A and 3B. High frequency voltage of 10 to 10 Hz is applied, and power is applied to the heat generating body layer indirectly through a resin layer. At that time, the resistance R of the heat generating body layer in the electric line and the area S of electrodes are set as shown by the formula I so as to apply power without generating dielectric breakdown of the resin sheets in the electrode sections. In the formula, (z) represents impedance (OMEGA.cm ) per unit area of a capacitor formed on the electrode section using resin as a dielectric medium, and E represents dielectric strength V for the overall thickness of resin and P represents the power W to be supplied to the heat generating layer.
    • 3. 发明专利
    • BONDING METHOD AND APPARATUS OF HEAT-SHRINKABLE COVERING MATERIAL
    • JPH047124A
    • 1992-01-10
    • JP10975490
    • 1990-04-25
    • DAI ICHI HIGH FREQUENCY CO LTDNIPPON STEEL CORP
    • TSUCHIDA ISAMUYAMATANI YATAROMATSUOKA KIYOMIKUROKI RYOICHI
    • B29C35/08B29C63/00B29C63/42B29C65/32B29C65/66B29K105/02B29L23/00
    • PURPOSE:To satisfactorily bond heat-shrinkable covering material onto the outer surface of pipe by a method wherein the heat-shrinkable covering material is mounted onto the outer surface of the pipe and induction-heatable heat generating tube and induction heating coil are arranged around the covering material and energized and, at the same time, heat is generated in the pipe inside the covering material by induction heating. CONSTITUTION:When energizing of induction heating coil 7 is started, the temperature of heat generating tube 8 is raised by induction heating and covering material 13 is heat-shrunk by being applied with radiation heat and, at the same time, the temperature of the space in an oven is raised and, simultaneously, the heat of pipe 2 is raised by induction heating. The covering material 13 starts to shrink peripherally from its middle so as to tightly adhere to the outer surface of the pipe and the shrunk part of the material moves toward both ends. As a result, the air between the outer surface of the pipe and the covering material 13 is expelled from the middle of the material to both ends, resulting in leaving no bubbles between the outer surface of the pipe and the covering material 13. When the covering material 13 is shrunk and brought into close contact with the outer surface of the pipe, the bonding layer of the covering material 13 is melted by the heat, which is conducted from the outer surface of the covering material 13 and from the outer surface of the pipe, resulting in realizing better adhesion between the covering material 13 and the outer surface of the heating pipe. Further, the contact area between the covering material 13 and film 12 is heated and melt-bonded through the heating from the outer surface of the covering material 13 and the conduction of heat from the pipe 2 to the film 12.