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    • 3. 发明专利
    • Laser joining method of resin structures
    • 树脂结构的激光加工方法
    • JP2005178351A
    • 2005-07-07
    • JP2004127963
    • 2004-04-23
    • Leister Process Technologiesライスター プロセス テクノロジーズ
    • CHEN JIE-WEIDANZER ANDREAS
    • B23K26/06B29C65/16
    • B29C65/1674B23K26/066B29C65/1635B29C65/1638B29C65/1654B29C65/1687B29C65/1696B29C66/1122B29C66/43B29C66/712B29C66/7332B29C66/73921B29C66/80B29C66/836B29K2995/0027B29L2024/006B29C65/00
    • PROBLEM TO BE SOLVED: To provide a laser joining method for joining different processed members by laser irradiation. SOLUTION: The mutual contact surfaces 7 of an upper processed member 5 transparent to a laser beam 3 and faced to a laser beam source and a second processed member 6 absorbing the laser beam 3 are melted and both processed members 5 and 6 are mutually joined under pressure at the time of succeeding cooling. At least the second processed member 6 faces to the processed member 5 to have a surface region 8 constituted in the lower part and the processed members 5 and 6 are constituted of a resin or the resin and another material. The laser beam 3 and the processed members 5 and 6 are relatively moved and the laser beam 3 is condensed in the region of the contact surfaces 7 by an optical system so that energy density becomes maximum and the second processed member 6 is melted only on the contact surfaces 7. The processed members 5 and 6 are joined only in the region of the contact surfaces 7. COPYRIGHT: (C)2005,JPO&NCIPI
    • 解决的问题:提供一种通过激光照射连接不同的加工部件的激光接合方法。 解决方案:对激光束3透明并面对激光束源的上部加工构件5的相互接触表面7熔化并且吸收激光束3的第二处理构件6被熔化,两个处理构件5和6都是 在成功冷却的时候相互加压。 至少第二加工构件6面向处理构件5,以在下部构成表面区域8,并且处理构件5,6由树脂或树脂和另一种材料构成。 激光束3和处理部件5和6相对移动,并且激光束3通过光学系统在接触表面7的区域中被冷凝,使得能量密度变得最大,并且第二处理部件6仅在 接触表面7.处理的构件5和6仅在接触表面7的区域中连接。版权所有(C)2005,JPO和NCIPI